3549
Henkel
Category: Chemicals and Adhesives
FAST FLOW LOW TEMPERATURE CURE REWORKABLE EPOXY UNDERFILL FOR BGA AND CSP DEVICES. HIGH ADHES AND RIGID CIRCUIT SUBSTRATES - 10 CC ML
$0.00
Distributors
Currency:
| Distributor | SKU | Stock | MOQ | 1 | 10 | 50 | 100 | 1000 | 10000 | Purchase | ||
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Newark | 3549 | 10 | $0.00 | $0.00 | $0.00 | $0.00 | $0.00 | $0.00 | Buy |