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Toshiba Electronics Europe
TB67H410NG
|
Texas Instruments
DRV8220DSGR
|
Texas Instruments
DRV8300DPWR
|
Texas Instruments
DRV8424RGER
|
Texas Instruments
DRV8428PWPR
|
Texas Instruments
DRV8932PRGER
|
Kitronik
DRV8833
|
Texas Instruments
DRV8353RSRGZR
|
Texas Instruments
DRV8353SRTAR
|
Texas Instruments
DRV8323RSRGZT .
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| Price |
|
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|
|
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| RoHS |
|
Compliant |
Y |
Y |
Y |
Y |
Y |
Compliant |
Compliant |
See ti.com |
|
| Lead Status |
|
Yes |
Y |
Y |
Y |
Y |
Y |
No |
No |
See ti.com |
|
| Control interface |
|
|
Hardware (GPIO) |
3xPWM,6xPWM |
Hardware (GPIO) |
Hardware (GPIO) |
Hardware (GPIO) |
|
|
|
|
| Control mode |
|
|
Independent 1/2-Bridge,PH/EN,PWM |
|
STEP/DIR |
STEP/DIR |
PWM |
|
|
|
|
| Features |
|
|
Low-Power Sleep Mode |
Bootstrap Diode |
Current Regulation,Integrated Current Sensing,Smart Tune |
Current Regulation,Integrated Current Sensing,Smart Tune |
Current Regulation,Integrated Current Sensing |
|
Buck Step Down Converter,Hardware Management I/F,SPI Management I/F,VDS Monitoring |
Current Sense Amplifier,Hardware Management I/F,SPI/I2C,VDS Monitoring,Smart Gate Drive |
|
| Number of full bridges |
|
|
1 |
|
2 |
2 |
2 |
|
|
|
|
| Operating temperature range(C) |
|
|
-40 |
-40 |
-40 |
-40 to 125 |
-40 |
|
|
-40 to 125 |
|
| Package area(mm^2) |
|
|
4 |
41.6 |
16 |
|
16 |
|
|
|
|
| Package size (L x W)(mm) |
|
|
2 x 2 |
6.5 x 6.4 |
4 x 4 |
|
4 x 4 |
|
|
|
|
| Package type |
|
|
WSON |
TSSOP |
VQFN |
|
VQFN |
|
|
|
|
| Peak output current(A) |
|
|
1.76 |
|
4 |
1.7 |
1.5 |
|
|
|
|
| Pin count |
|
|
8 |
20.0 |
24 |
|
24.0 |
|
|
|
|
| RDS(ON) (HS + LS)(m) |
|
|
1000 |
|
330 |
|
900 |
|
|
|
|
| Rating |
|
|
Catalog |
Catalog |
Catalog |
Catalog |
Catalog |
|
Catalog |
Catalog |
|
| Sleep current(A) |
|
|
0.0845 |
|
2 |
|
2 |
|
|
|
|
| TI functional safety category |
|
|
|
|
|
|
|
|
|
|
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| Vs ABS(max)(V) |
|
|
20 |
100 |
35 |
|
35 |
|
|
|
|
| Vs(min)(V) |
|
|
4.5 |
5 |
4.5 |
|
4.5 |
|
|
|
|
| TI.com inventory |
|
|
25681 |
10959 |
14573 |
0 |
98595 |
|
|
|
|
| Approx. price(US$) |
|
|
.206 | 1ku |
.28 | 1ku |
1.26 | 1ku |
1.111 | 1ku |
1.353 | 1ku |
|
|
|
|
| Architecture |
|
|
|
Gate driver |
|
|
|
|
|
Gate Driver |
|
| Gate drive(A) |
|
|
|
0.75 |
|
|
|
|
|
1 |
|
| Full-scale current(A) |
|
|
|
|
2.5 |
1 |
|
|
|
|
|
| Microstepping levels |
|
|
|
|
256 |
|
|
|
|
|
|
| Sleep current(uA) |
|
|
|
|
|
2 |
|
|
|
|
|
| Package size |
|
|
|
|
|
mm2 |
|
|
|
|
|
| Vs ABS(Max)(V) |
|
|
|
|
|
35 |
|
|
|
102 |
|
| Vs(Max)(V) |
|
|
|
|
|
33 |
|
|
100 |
100 |
|
| Vs(Min)(V) |
|
|
|
|
|
4.5 |
|
|
9 |
9 |
|
| Package Group |
|
|
|
|
|
HTSSOP|16,WQFN|16 |
|
|
VQFN|48 |
WQFN|40 |
|
| Micro-stepping levels |
|
|
|
|
|
256 |
|
|
|
|
|
| RDS(ON) (HS + LS)(mOhms) |
|
|
|
|
|
1500 |
|
|
|
|
|
| Current Sense Amps |
|
|
|
|
|
|
|
|
3 |
|
|
| Operating Temperature Range(C) |
|
|
|
|
|
|
|
|
-40 to 125 |
|
|
| Control I/F |
|
|
|
|
|
|
|
|
PWM (6x/3x/1x) |
6xPWM,3xPWM,1xPWM |
|
| Package Size |
|
|
|
|
|
|
|
|
mm2 |
|
|
| Gate Drive(A) |
|
|
|
|
|
|
|
|
1 |
|
|
| Number of Half Bridges |
|
|
|
|
|
|
|
|
3 |
|
|
| Sensor type |
|
|
|
|
|
|
|
|
|
Universal,Sensored |
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| Control method |
|
|
|
|
|
|
|
|
|
External Control,Integrated Trapezoidal |
|
