BGA-FC-015
ABL Components
Category: Heat Sinks
HEAT SINK BGA FLIP-CHIP 11°C/W; Packages Cooled:BGA; Thermal Resistance:11°C/W; External Height - Metric:24mm; External Width - Metric:40mm; External Length - Metric:40mm; External Diameter - Metric:-; Heat Sink Material:Aluminium; External Height - Imperial:0.945"; External Width - Imperial:1.575"; External Length - Imperial:1.575"; External Diameter - Imperial:-; Product Range:-; SVHC:No SVHC (12-Jan-2017)
* $2.74
Distributors
Currency:
| Distributor | SKU | Stock | MOQ | 1 | 10 | 50 | 100 | 1000 | 10000 | Purchase | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Farnell | BGA-FC-015 | 1 | * $2.74 | * $2.44 | * $2.26 | * $1.98 | * $1.67 | * $1.67 | Buy |