RE230-LF

Roth Elektronik

Category: Prototyping Products

PCB PROTOTYPE RE230-LF; Board Type:Matrix Board; Board Material:Epoxy Glass Composite; Hole Diameter:1.02mm; External Height:114.3mm; External Width:165.1mm; Board Thickness:1.6mm; Product Range:-; SVHC:No SVHC (17-Dec-2015); Copper Coating Density:HAL 5 - 6 µm (hole 2 - 3 µm); Copper Thickness:35µm; External Length / Height:114.3mm; Hole Matrix:40 x 60; Hole Pitch:2.54mm; Material:Epoxied FR4; No. of Copper Coated Sides:1; No. of Holes:2400; PCB Size:114.30 x 165.10 mm (4.5 x 6.5 "); Pad Area:2.00 mm²; Pitch Spacing:2.54mm

$0.00 - * $35.22
Distributor SKU Stock MOQ 1 10 50 100 1000 10000 Purchase
element14 APAC RE230-LF 2 1 * $35.22 * $35.22 * $34.51 * $28.40 * $28.40 * $28.40 Buy
Farnell RE230-LF 2 1 * $18.77 * $18.77 * $18.77 * $18.77 * $18.77 * $18.77 Buy
Newark RE230-LF 7 1 $0.00 $0.00 $0.00 $0.00 $0.00 $0.00 Buy
RS Components RE230-LF $15.98 Buy
RS Components (APAC) RE230-LF $31.75 Buy
TME RE230-LF 10 $11.20 Buy