Texas Instruments

Enhanced Product Memorystick(Tm) Interconnect Extender Chipset 20-TSSOP -40 to 125

Parts in family

Technical Specifications

Lead Free Status No
ROHS Compliance Not Compliant
ESD HBM(kV) 12
Estimated Package Size (WxL)(mm2) [pf]20TSSOP[/pf]
ICC(Max)(mA) 25
Input Signal LVDS,LVTTL
No. of x 4
No. of Tx 1
Operating Temperature ange(C) -40 to 125
Output Signal LVDS,LVTTL
Package Group TSSOP
Signaling ate(Mbps) 125
ating Hi el Enhanced Product