The Amphenol CDI CoreCryo interconnect solutions, enhanced by proven expertise in high-reliability connectivity, are engineered to deliver superior performance in extreme cryogenic environments for today’s most advanced applications. Ideal for high-density, space-constrained designs in quantum computing, aerospace, and scientific instrumentation, CoreCryo products support exceptional signal integrity and thermal stability at ultra-low temperatures. Their compact, precision engineered interfaces help engineers reduce system size while improving overall electrical performance, making them a strong choice for distribution customers seeking scalable, high-performance cryogenic connectivity solutions. Constructed with rugged materials and designed to withstand repeated thermal cycling, CoreCryo interconnects maintain consistent, long-term reliability without compromising performance. Their robust design supports dependable engagement and durability in harsh operating conditions, ensuring stable operation across critical applications.

Features:

• 20 GHz operating frequency
• Rugged connector: 1,000 cycle durability
• 2.5 mm signal-to-signal density
• Quick attach for RF/Digital connections
• Reusable and field-replaceable
• Non-magnetic materials

Applications: