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| RoHS | Y | Y | Y | Y | Y | Y | Y | Y | Y | Y | |
| Lead Status | Y | Y | Y | Y | Y | Y | Y | Y | Y | Y | |
| Battery overvoltage protection(max)(V) | 5.5 | 5.5 | 4.65 | 5.1 | 4.575 | ||||||
| Battery overvoltage protection(min)(V) | 1 | 1 | 3.85 | 3.55 | 3 | ||||||
| Communication interface | SPI | SPI | Daisy chain,SPI,UART | ||||||||
| Device type | Cell monitor and balancer | Cell monitor and balancer | Communication device | ||||||||
| Features | Digital output,High-side driver,I2C support,Integrated ADC,LDO output,Multi-cell support,One-time-programmable (OTP) memory,Open-wire detection,Overcurrent in charging protection,Overcurrent in discharging protection,Overtemperature protection,Overvoltage protection,Scratchpad memory,Short-current detection,Temperature sensing,Undertemperature protection,Undervoltage protection | Digital output,High-side driver,I2C support,Integrated ADC,LDO output,Multi-cell support,One-time-programmable (OTP) memory,Open-wire detection,Overcurrent in charging protection,Overcurrent in discharging protection,Overtemperature protection,Overvoltage protection,Scratchpad memory,Short-current detection,Temperature sensing,Undertemperature protection,Undervoltage protection | Overvoltage,Single pin output drive,Stackable | FET drive,Open wire (OW),Over-temperature (OT),Overvoltage,Stackable,Under-temperature (UT),Undervoltage | FET drive,Open wire (OW),Over-temperature (OT),Overcurrent during discharge (OCD),Overvoltage,Short-circuit Discharge (SCD),Stackable,Under-temperature (UT),Undervoltage | Overvoltage,Undervoltage,Overcurrent during charge (OCC),Overcurrent during discharge (OCD),Short-circuit Discharge (SCD),Open wire (OW),Over-temperature (OT),Under-temperature (UT),Stackable,Cell balancing,FET drive | Separate MCU requirement,Stackable (built-in interface) | Adjustable BW/IQ/IOUT | Output enable,Overvoltage tolerant inputs,Partial power down (Ioff),Vcc isolation | LE 1M PHY,LE Coded PHY (long range) | |
| Number of series cells(max) | 10 | 10 | 3,4,5 | 16 | 4,5 | ||||||
| Number of series cells(min) | 3 | 3 | 2,3,4,5 | 3 | 3,4,5 | ||||||
| Operating current(typ)(A) | 250 | 250 | 1 | 1 | 6 | 2500 | |||||
| Operating temperature range(C) | -40 | -40 | -40 | -40 | -40 | -40 | -40 to 125 | -40 | -40 | ||
| Package area(mm^2) | 81 | 81 | 12 | 49.92 | 41.6 | 32 | 2.52 | 49 | |||
| Package size (L x W)(mm) | 9 x 9 | 9 x 9 | 4 x 3 | 7.8 x 6.4 | 6.5 x 6.4 | 5 x 6.4 | 1.8 x 1.4 | 7 x 7 | |||
| Package type | TQFP | TQFP | WSON | TSSOP | TSSOP | TSSOP | UQFN | VQFN | |||
| Pin count | 48.0 | 48.0 | 8.0 | 24.0 | 20.0 | 16.0 | 10.0 | 48.0 | |||
| Rating | Catalog | Catalog | Catalog | Catalog | Catalog | Catalog | Automotive | Catalog | Automotive | Catalog | |
| TI functional safety category | Functional Safety-Capable | Functional Safety-Capable | Functional Safety-Capable | Functional Safety-Capable | Functional Safety-Compliant | ||||||
| Vin(max)(V) | 55 | 55 | 25 | 85 | 25 | ||||||
| TI.com inventory | 7343 | 3365 | 2000 | 55374 | 27683 | 361 | 87187 | 433445 | |||
| Approx. price(US$) | 1.737 | 1ku | 1.737 | 1ku | .53 | 1ku | 1.05 | 1ku | .606 | 1ku | .55 | 1ku | 4 | 1ku | 1.1 | 1ku | .357 | 1ku | 1.595 | 1ku | |
| Function | Protection | Protection | Protection | Protection | |||||||
| Overvoltage protection | 4.3 | 4.325 | 3.7 | 3.8,4.2,4.25,4.275 | |||||||
| Number of series cells(Max) | 4,5 | ||||||||||
| Package Group | TSSOP|24 | SO PowerPAD|8,SOIC|8,SON|8 | |||||||||
| Typical operating current(Typ)(uA) | 8 | ||||||||||
| Number of series cells(Min) | 3,4,5 | ||||||||||
| Vin(Max)(V) | 25 | ||||||||||
| Output current(Typ)(mA) | 250 | ||||||||||
| Offset drift(Typ)(uV/C) | 175 | ||||||||||
| Input bias current(Typ)(pA) | 5000000 | ||||||||||
| BW @ Acl(MHz) | 210 | ||||||||||
| Architecture | Fixed Gain/Buffer | ||||||||||
| Total supply voltage(Max)(+5V=5, +/-5V=10) | 36 | ||||||||||
| Slew rate(Typ)(V/us) | 3750 | ||||||||||
| Number of channels(#) | 1 | ||||||||||
| Rail-to-rail | No | ||||||||||
| Vn at flatband(Typ)(nV/rtHz) | 3.4 | ||||||||||
| 3rd harmonic(dBc) | -79 | ||||||||||
| Total supply voltage(Min)(+5V=5, +/-5V=10) | 4.5 | ||||||||||
| GBW(Typ)(MHz) | 240 | ||||||||||
| Package size | mm2 | ||||||||||
| Iq per channel(Typ)(mA) | 8.5 | ||||||||||
| Acl, min spec gain(V/V) | 1 | ||||||||||
| Vn at 1 kHz(Typ)(nV/rtHz) | 3.4 | ||||||||||
| Iq per channel(Max)(mA) | 12 | ||||||||||
| @ MHz | 0.02 | ||||||||||
| Input bias current(Max)(pA) | 1600000 | ||||||||||
| 2nd harmonic(dBc) | -77 | ||||||||||
| Vos (offset voltage @ 25 C)(Max)(mV) | 60 | ||||||||||
| Applications | JTAG,UART | ||||||||||
| Bits(#) | 2 | ||||||||||
| Data rate(max)(MBits) | 380 | ||||||||||
| Data rate(max)(Mbps) | 380 | ||||||||||
| High input voltage(max)(V) | 3.6 | ||||||||||
| High input voltage(min)(V) | 0.45 | ||||||||||
| IOH(max)(mA) | -12 | ||||||||||
| IOL(max)(mA) | 12 | ||||||||||
| Input type | CMOS | ||||||||||
| Output type | 3-State | ||||||||||
| Supply current(max)(A) | 23 | ||||||||||
| Technology family | AXC | ||||||||||
| Vout(max)(V) | 3.6 | ||||||||||
| Vout(min)(V) | 0.65 | ||||||||||
| Flash memory(kByte) | 128 | ||||||||||
| Number of GPIOs | 31 | ||||||||||
| Peripherals | 1 UART,12-bit ADC 8-channel,2 SPI,2 comparators,4 timers,I2C,I2S | ||||||||||
| Protocols | Bluetooth low energy 5.1 | ||||||||||
| RAM(kByte) | 28 | ||||||||||
| Security | Cryptographic acceleration,Debug security,Device identity,Software IP protection | ||||||||||
| Sensitivity (best)(dBm) | -97 | ||||||||||
| Type | Wireless MCU |
