|
|
Microchip Technology Inc.
62576-1
|
Phoenix Contact Ltd
2917395
|
NXP Semiconductors N.V.
51-750-301
|
IDEC Corporation
GT3A-4EAF20
|
IDEC Corporation
GT5Y-4SN6A200
|
TE Connectivity
1418984-1
|
TE Connectivity
929950-3
|
TE Connectivity
964348-2
|
TE Connectivity
1-964300-3
|
ATC Diversified Electronics
355C-346-C-30-PX
|
| Price |
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| RoHS |
|
Compliant |
Compliant |
Compliant |
Not Compliant |
Compliant |
|
|
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|
|
| Lead Status |
|
|
|
|
|
|
|
|
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|
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| Wire Size Search |
|
|
|
|
|
|
|
22 |
18 |
.75 |
|
| Packaging Quantity |
|
|
|
|
|
|
|
7500 |
5500 |
3500 |
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| Packaging Method |
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|
Reel |
Reel |
Reel |
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| Interface Plating |
|
|
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Tin (Sn) |
Tin (Sn) |
Gold (Au) |
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| Agency/Standard |
|
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|
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|
IEC 664/664A (DIN VDE 0110) |
IEC 664/664A (DIN VDE 0110) |
IEC 664/664A (DIN VDE 0110) |
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| Mating Tab Width |
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|
|
|
|
|
|
.063 |
.063 |
2.8 |
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| Wire Size |
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.2 – .5 |
.5 – 1 |
.5 – 1 |
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| Wire Insulation Diameter |
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1.2 – 1.6 |
.055 – .083 |
.134 |
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| Wire Type |
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Copper |
Copper |
Copper |
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| Operating Temperature Range |
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-40 – 248 |
-40 – 248 |
-40 – 150 |
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| Terminal & Splice Style |
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Receptacle |
Receptacle |
Tab |
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| Terminal Transmits |
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0 – 24 A (Low Power) |
0 – 24 A (Low Power) |
0 – 24 A (Low Power) |
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| Termination Method |
|
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|
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|
|
|
Crimp |
Crimp |
Crimp |
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| Mating Tab Thickness |
|
|
|
|
|
|
|
.024 |
.024 |
.031 |
|
| Crimp Type |
|
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|
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|
F-Crimp |
F-Crimp |
F-Crimp |
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| Typical Current Rating |
|
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10 |
10 |
20 |
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| Primary Locking Feature |
|
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Locking Lance |
Locking Lance |
Locking Lance |
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| Contact Termination Area Plating Material |
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|
Tin (Sn) |
Tin (Sn) |
Tin (Sn) |
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| Sealable |
|
|
|
|
|
|
|
No |
Yes |
Yes |
|
