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Texas Instruments
NE556DBRG4
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Texas Instruments
NE556DBRE4
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Texas Instruments
NE556NSRG4
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TE Connectivity
2-962842-1
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Omron
H3FA-AU DC5
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Texas Instruments
LM556 MWC
|
Omron
H5S-WFB2
|
onsemi
MC1455B
|
Omron
H3Y-2 DC24 30S
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Omron
H5S-WFB2D
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| Price |
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$0.59 |
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| RoHS |
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Compliant |
Compliant |
Compliant |
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Compliant |
Compliant |
Compliant |
Not Compliant |
Compliant |
Compliant |
| Lead Status |
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Yes |
No |
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No |
No |
| Wire Size |
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1 – 2.5 |
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| Wire Size Search |
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15 |
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| Packaging Method |
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Reel |
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| Interface Plating |
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Tin (Sn) |
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| Agency/Standard |
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IEC 664/664A (DIN VDE 0110) |
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| Packaging Quantity |
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3500 |
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| Wire Type |
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Copper |
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| Operating Temperature Range |
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-40 – 130 |
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| Mating Tab Thickness |
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.031 |
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| Mating Tab Width |
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2.8 |
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| Termination Method |
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Crimp |
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| Crimp Type |
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F-Crimp |
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| Typical Current Rating |
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30 |
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| Terminal Transmits |
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25 – 40 A (Power) |
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| Terminal & Splice Style |
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Tab |
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| Wire Insulation Diameter |
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2.1 – 2.9 |
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| Primary Locking Feature |
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Locking Lance |
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| Contact Termination Area Plating Material |
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Tin (Sn) |
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| Sealable |
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No |
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| Package Group |
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DIESALE,PDIP,SOIC,WAFERSALE |
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| Iq(Typ)(uA) |
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3000 |
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| Frequency(Max)(MHz) |
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0.1 |
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| Rating |
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Military |
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| Operating Temperature Range(C) |
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-40 to 85,-55 to 125,0 to 70 |
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| VCC(Max)(V) |
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16 |
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| Package Size |
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mm2 |
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| VCC(Min)(V) |
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4.5 |
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