KSPSN13MI

Littelfuse KSPSN13MI

Fairchild Semiconductors CD4541BCN

CD4536BDWRG4

Texas Instruments CD4536BDWRG4

NE556DBRG4

Texas Instruments NE556DBRG4

NE556DBRE4

Texas Instruments NE556DBRE4

NE556NSRG4

Texas Instruments NE556NSRG4

2-962842-1

TE Connectivity 2-962842-1

CD4536BDWE4

Texas Instruments CD4536BDWE4

Omron H3YN21AC24

MC1455

onsemi MC1455

Price
RoHS Compliant Compliant Compliant Compliant Compliant Compliant Compliant
Lead Status No
Wire Size 1 – 2.5
Wire Size Search 15
Packaging Method Reel
Interface Plating Tin (Sn)
Agency/Standard IEC 664/664A (DIN VDE 0110)
Packaging Quantity 3500
Wire Type Copper
Operating Temperature Range -40 – 130
Mating Tab Thickness .031
Mating Tab Width 2.8
Termination Method Crimp
Crimp Type F-Crimp
Typical Current Rating 30
Terminal Transmits 25 – 40 A (Power)
Terminal & Splice Style Tab
Wire Insulation Diameter 2.1 – 2.9
Primary Locking Feature Locking Lance
Contact Termination Area Plating Material Tin (Sn)
Sealable No