|
|
Schneider Electric
9050AO11EV02
|
Texas Instruments
TPL5110EVM
|
NXP Semiconductors N.V.
ICM7555CD/01,118
|
Nexperia
HEF4541BT,652
|
NXP Semiconductors N.V.
MC68340CFE25E
|
TE Connectivity
1-968857-3
|
TE Connectivity
1-928343-1
|
Diodes Inc.
NE555S-13
|
Texas Instruments
NE555PWE4
|
Renesas Electronics Corporation
IS82C54Z96
|
| Price |
|
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| RoHS |
|
Compliant |
|
Compliant |
Compliant |
Compliant |
|
|
Not Compliant |
Compliant |
Compliant |
| Lead Status |
|
|
|
No |
No |
No |
|
|
No |
No |
|
| Contact Termination Area Plating Material |
|
|
|
|
|
|
Silver (Ag) |
|
|
|
|
| Wire Insulation Diameter |
|
|
|
|
|
|
.075 – .118 |
|
|
|
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| Wire Size Search |
|
|
|
|
|
|
15 |
|
|
|
|
| Packaging Method |
|
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|
|
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|
Reel |
|
|
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| Wire Size |
|
|
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16 – 14 |
|
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| Agency/Standard |
|
|
|
|
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|
LV214 |
|
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|
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| Sealable |
|
|
|
|
|
|
Yes |
|
|
|
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| Typical Current Rating |
|
|
|
|
|
|
22 |
|
|
|
|
| Wire Type |
|
|
|
|
|
|
Copper |
|
|
|
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| Receptacle Style |
|
|
|
|
|
|
180° |
|
|
|
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| Mating Tab Thickness |
|
|
|
|
|
|
.031 |
|
|
|
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| Mating Tab Width |
|
|
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|
|
|
2.8 |
|
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| Terminal & Splice Style |
|
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|
Receptacle |
|
|
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| Interface Plating |
|
|
|
|
|
|
Silver (Ag) |
|
|
|
|
| Packaging Quantity |
|
|
|
|
|
|
4000 |
|
|
|
|
| Termination Method |
|
|
|
|
|
|
Crimp |
|
|
|
|
| Operating Temperature Range |
|
|
|
|
|
|
-40 – 140 |
|
|
|
|
| Crimp Type |
|
|
|
|
|
|
F-Crimp |
|
|
|
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| Terminal Transmits |
|
|
|
|
|
|
25 – 40 A (Power) |
|
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|
| Primary Locking Feature |
|
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|
|
|
|
Locking Lance |
|
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|
