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STMicroelectronics
STM32MP151CAC3
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NXP Semiconductors N.V.
LPC1342FBD48,118
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Infineon Technologies AG
MB9BF524LQN-G-AVE2
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Infineon Technologies AG
MB9AF314NAPMC-G-JNE2
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NXP Semiconductors N.V.
LPC11U35FHI33/501,
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Texas Instruments
AM6546BACDXA
|
NXP Semiconductors N.V.
LPC4088FBD144,551
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Infineon Technologies AG
MB9AF314LAQN-G-AVE2
|
Infineon Technologies AG
MB9AF421LPMC-G-JNE2
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Infineon Technologies AG
S6J334DHEESC20000
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| Price |
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|
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| RoHS |
|
Compliant |
Compliant |
Compliant |
Compliant |
Not Compliant |
Y |
Compliant |
Compliant |
Compliant |
Compliant |
| Lead Status |
|
|
|
|
|
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Y |
|
|
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| Arm CPU |
|
|
|
|
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4 Arm Cortex-A53 |
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| Arm(max)(MHz) |
|
|
|
|
|
|
1100 |
|
|
|
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| CPU |
|
|
|
|
|
|
64-bit |
|
|
|
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| Coprocessors |
|
|
|
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2 Arm Cortex-R5F |
|
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| Display type |
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MIPI DPI,OLDI |
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| Ethernet MAC |
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1-Port 10/100/1000,6-Port 10/100/1000 PRU EMAC |
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| Features |
|
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Networking |
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| Operating system |
|
|
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Android,Linux,RTOS |
|
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|
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| Operating temperature range(C) |
|
|
|
|
|
|
-40 |
|
|
|
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| PCIe |
|
|
|
|
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2 PCIe Gen 3 |
|
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| Package area(mm^2) |
|
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|
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|
529 |
|
|
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| Package size (L x W)(mm) |
|
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23 x 23 |
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| Package type |
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FCCSP |
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|
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| Pin count |
|
|
|
|
|
|
784 |
|
|
|
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| Power supply solution |
|
|
|
|
|
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TPS6594-Q1 |
|
|
|
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| Protocols |
|
|
|
|
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|
EtherCAT,Ethernet,ICSS,Profibus,Profinet,TSN |
|
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| Rating |
|
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Catalog |
|
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| TI functional safety category |
|
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| TI.com inventory |
|
|
|
|
|
|
50 |
|
|
|
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| Approx. price(US$) |
|
|
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|
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58.451 | 1ku |
|
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