NE556DBRE4

Texas Instruments NE556DBRE4

NE556NSRG4

Texas Instruments NE556NSRG4

CD4536BDWE4

Texas Instruments CD4536BDWE4

2-962842-1

TE Connectivity 2-962842-1

2-967624-1

TE Connectivity 2-967624-1

TLC552CNE4

Texas Instruments TLC552CNE4

CD4536BNSRE4

Texas Instruments CD4536BNSRE4

TLC552CDRG4

Texas Instruments TLC552CDRG4

Fairchild Semiconductors CD4541BCN

NLV14536BDWR2G

onsemi NLV14536BDWR2G

Price
RoHS Compliant Compliant Compliant Compliant Compliant Compliant Compliant
Lead Status No
Wire Size 1 – 2.5
Wire Size Search 15
Packaging Method Reel
Interface Plating Tin (Sn)
Agency/Standard IEC 664/664A (DIN VDE 0110)
Packaging Quantity 3500
Wire Type Copper
Operating Temperature Range -40 – 130
Mating Tab Thickness .031
Mating Tab Width 2.8
Termination Method Crimp
Crimp Type F-Crimp
Typical Current Rating 30
Terminal Transmits 25 – 40 A (Power)
Terminal & Splice Style Tab
Wire Insulation Diameter 2.1 – 2.9
Primary Locking Feature Locking Lance
Contact Termination Area Plating Material Tin (Sn)
Sealable No