SIL PAD TSP K1300

Bergquist
Category: Thermoelectric
SIL-PAD, K-10, .006", TO-220; Insulator Body Material: PI (Polyimide) Film; Thermal Conductivity: 1.3W/m.K; Breakdown Voltage Vbr: 6kV; Thickness: 0.152mm; Volume Resistivity: 10ohm-m; Thermal Impedance: 0.86°C/W; Dielectric S
* $0.64 - $0.97Distributors
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