Equalisers Front Panel HDMI Buffer - TMDS Only

Integrated Optical Module for Smoke Detection Features: Supports UL-217 edition 8/ UL-568 ed. 7; EN-54; GB..; ISO Lowers Nuisance Alarms using a Dual Wavelength detection with higher SNR and dynamic range. 3X Lower power dissipation enables smaller/ cheaper batteries Integrated Optical Module (3.8mm x 5mm x 0.9mm with 1 blue LED, 1 IR LED and 2 Photo diodes) simplifies EMC design, allows for greater diversity of industrial design options and results in 75% fewer discrete components. Loop calibration at final test reduces calibration challenges with smoke detector products. Supported by ADI designed smoke chamber manufactured by Accumold, 28800X. (Please see EVAL-CHAMBER Mechanical Dimensions (PDF), also under Resources below)

SMT 13 Gbps, 2:1 Selector Features: Supports High Data Rates: up to 13 Gbps Single-Ended Inputs Differential & Single-Ended Outputs Fast Rise & Fall Times: 17/15 ps Low Power Consumption: 250 mW typ. Programmable Differential Output Voltage Swing: 600 - 1200 mV Propagation Delay: 125 ps Single Supply: -3.3V 16 Lead Ceramic 3×3mm SMT Package: 9mm2

3.3 V, 200 Mbps, Half-Duplex, High Speed M-LVDS Transceiver with Type 2 Receiver Features: Multipoint LVDS transceivers (low voltage differential signaling driver and receiver pairs) Switching rate: 200 Mbps (100 MHz) Supported bus loads: 30 to 55 Type 2 receiver type: threshold offset of 100 mV for open-circuit and bus-idle fail-safe Conforms to TIA/EIA-899 standard for M-LVDS Glitch free power-up/power-down on M-LVDS bus Controlled transition times on driver output Common-mode range: −1 V to +3.4 V, allowing communication with 2 V of ground noise Driver outputs high-Z when disabled or powered off See data sheet for additional features

RapID Platform Generation 2 (RPG2) Network Interface Features: Configurable industrial protocol support PROFINET RT (Class B) PROFINET IRT (Class C): coming soon EtherNet/IP with DLR EtherCAT All protocols precertified Configurable applications processor interface UART: 115,200 bps to 1,000,000 bps Ethernet at 10 Mbps or 100 Mbps SPI follower: 10 MHz maximum clock I2C, QSPI, and CAN: future option Industrial Ethernet interface-compliant to IEEE 802.3, 10Base or 100Base transmit half and full duplex Single 3.3 V power supply, 840 mW Cycle time down to 1 ms (cycle times vary based on protocol, link type, and application data) 194-ball chip-scale package BGA form factor RoHS 3 compliant –40°C to +85°C industrial temperature range

RapID Platform Generation 2 (RPG2) Network Interface Features: Configurable industrial protocol support PROFINET RT (Class B) PROFINET IRT (Class C): coming soon EtherNet/IP with DLR EtherCAT All protocols precertified Configurable applications processor interface UART: 115,200 bps to 1,000,000 bps Ethernet at 10 Mbps or 100 Mbps SPI follower: 10 MHz maximum clock I2C, QSPI, and CAN: future option Industrial Ethernet interface-compliant to IEEE 802.3, 10Base or 100Base transmit half and full duplex Single 3.3 V power supply, 840 mW Cycle time down to 1 ms (cycle times vary based on protocol, link type, and application data) 194-ball chip-scale package BGA form factor RoHS 3 compliant –40°C to +85°C industrial temperature range

High-Performance 32-bit Floating-Point SHARC Processor for General Purpose Applications Features: 400MHz SIMD SHARC Core, capable of 2.4 GFLOPS peak performance 2Mbits SRAM; 6 Mbits customer-definable ROM High bandwidth, 32-bit external memory interface supporting glue-less interface to SDRAM, SRAM, and FLASH Digital Audio Interface (DAI) enabling user-definable access to system peripherals including 8 serial ports (SPORTs), S/PDIF Tx/Rx, 8-channel asynchronous sample rate converter, and 4 precision clock generators. Digital Peripheral Interface (DPI) enabling user-definable access to system peripherals including 2 SPI-compatible ports, 2 UARTs, 3 full-featured timers, and a two-wire interface compliant to the I2C standard. 34 zero-overhead DMA channels 16 Pulse Width Modulation (PWM) channels 208-lead LQFP-EP and 256-ball SBGA packages Commercial and industrial temperature ranges Maximum core performance is reduced for LQFP package

Up to 1GHz SHARC+ DSP with 640KB L1, 1024KB Shared L2 SRAM, 120-lead LQFP_EP Features:SHARC+ Core infrastructure 800MHz (max) or 1GHz (max) Core clock frequency 640KB on-chip Level 1 (L1) SRAM memory (with parity) increases low latency performance 32-bit, 40-bit & 64-bit floating point support 32-bit fixed point Byte, short-word, word, long-word addressedMemory 1024KB on-chip Level 2 (L2) SRAM with ECC protection - eliminates need for external memory in many use cases Advanced Hardware Accelerators Enhanced FIR/IIR offload engines running at Core clock frequency for added processing power Security Crypto Engines with OTPPowerful DMA SystemInnovative Digital Audio Interface (DAI) includes: 8x Full SPORT interfaces w/TDM & I2S modes 2x S/PDIF Rx/Tx, 8 ASRC pairs 4x Precision Clock Generators 24 BuffersOther Peripheral Connectivity / Interfaces: 2x Quad SPI, 1x Octal SPI MLB 3-pin 4x I2C, 2x UARTs 6x General Purpose Timer, 1x General Purpose Counter 2x Watchdog Timers 2-ch 12bit Housekeeping ADCs 22 GPIO pins, 24 DAI pins Thermal SensorPackage 14mm x 14mm 120-lead LQFP_EAdditional Features Security and Protection Crypto hardware accelerators Fast secure boot with IP protection Enhanced FIR and IIR accelerators running up to 1 GHz AEC-Q100 qualified for automotive applications

Up to 1GHz SHARC+ DSP with 640KB L1, 1024KB Shared L2 SRAM, 120-lead LQFP_EP Features:SHARC+ Core infrastructure 800MHz (max) or 1GHz (max) Core clock frequency 640KB on-chip Level 1 (L1) SRAM memory (with parity) increases low latency performance 32-bit, 40-bit & 64-bit floating point support 32-bit fixed point Byte, short-word, word, long-word addressedMemory 1024KB on-chip Level 2 (L2) SRAM with ECC protection - eliminates need for external memory in many use cases Advanced Hardware Accelerators Enhanced FIR/IIR offload engines running at Core clock frequency for added processing power Security Crypto Engines with OTPPowerful DMA SystemInnovative Digital Audio Interface (DAI) includes: 8x Full SPORT interfaces w/TDM & I2S modes 2x S/PDIF Rx/Tx, 8 ASRC pairs 4x Precision Clock Generators 24 BuffersOther Peripheral Connectivity / Interfaces: 2x Quad SPI, 1x Octal SPI MLB 3-pin 4x I2C, 2x UARTs 6x General Purpose Timer, 1x General Purpose Counter 2x Watchdog Timers 2-ch 12bit Housekeeping ADCs 22 GPIO pins, 24 DAI pins Thermal SensorPackage 14mm x 14mm 120-lead LQFP_EAdditional Features Security and Protection Crypto hardware accelerators Fast secure boot with IP protection Enhanced FIR and IIR accelerators running up to 1 GHz AEC-Q100 qualified for automotive applications

Dual-core SHARC+ DSP (w/768KB L1), 1MB Shared L2, 176-LQFP Features: Dual-enhanced SHARC+ high performance floating-point cores Up to 500 MHz per SHARC+ core Up to 3 Mb (384 kB) L1 SRAM memory per core with parity (optional ability to configure as cache) 32-bit, 40-bit, and 64-bit floating-point support 32-bit fixed point Byte, short word, word, long word addressed Powerful DMA system On-chip memory protection Integrated safety features 176-lead LQFP_EP, RoHS compliant Low system power across automotive temperature range Memory Large on-chip L2 SRAM with ECC protection, up to 1 MBAdditional Features Security and Protection Cryptographic hardware accelerators Fast secure boot with IP protection Support for arm® TrustZone Accelerators FIR, IIR offload engines Qualified for automotive applications