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Maxim Integrated
MAX1667EAP+
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Texas Instruments
BQ76PL536TPAPRQ1
|
NXP Semiconductors N.V.
MC34674BEPR2
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NXP Semiconductors N.V.
MC34674CEPR2
|
Maxim Integrated
MAX1259CWE+T
|
Texas Instruments
BQ20Z80DBTR
|
TE Connectivity
1565986-1
|
TE Connectivity
5787428-1
|
STMicroelectronics
TSM1012AIST
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STMicroelectronics
TSM1013AIST
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| Price |
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$6.27 |
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| RoHS |
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Compliant |
Yes |
Compliant |
Compliant |
Compliant |
Compliant |
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Compliant |
Compliant |
| Lead Status |
|
No |
Yes |
No |
Yes |
No |
No |
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No |
No |
| Mounting Angle |
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Vertical |
Right Angle |
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| Connector Mounting Type |
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Board Mount |
Board Mount |
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| Connector & Contact Terminates To |
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Printed Circuit Board |
Printed Circuit Board |
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| Connector Style |
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Receptacle |
Plug |
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| Operating Temperature Range |
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-4 – 176 |
-30 – 70 |
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| Number of Positions |
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5 |
5 |
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| PCB Mount Retention |
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With |
Without |
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| Connector System |
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Board-to-Board |
Board-to-Board |
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| Connector Type |
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Connector Assembly |
Connector Assembly |
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| Centerline (Pitch) |
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2.5 |
5 |
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| Circuit Application |
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Power & Signal |
Power & Signal |
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| Contact Current Rating (Max) |
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7 |
7 |
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| Voltage |
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30 VDC |
12 |
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| PCB Mount Retention Type |
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Locating Post |
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| Packaging Quantity |
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72 |
88 |
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| Packaging Method |
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Tray |
Tray |
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| Sealable |
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No |
No |
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| Contact Mating Area Plating Thickness |
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2.54 |
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| PCB Contact Termination Area Plating Material |
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Tin |
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| Contact Underplating Material |
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Nickel |
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