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TE Connectivity
61117-7
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TE Connectivity
880687-2
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TE Connectivity
66399-9
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TE Connectivity
201145-4
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TE Connectivity
226537-1
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TE Connectivity
5148354-1
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TE Connectivity
86182-7
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TE Connectivity
487117-9
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TE Connectivity
647485-2
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TE Connectivity
1766198-1
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Price |
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RoHS |
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Lead Status |
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Contact Angle |
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Straight |
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Right Angle |
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Straight |
Accepts Wire Insulation Diameter Range |
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.106 – .157 |
.08 – .1 |
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Glow Wire Rating |
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Standard Part - Not Glow Wire |
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Standard Part - Not Glow Wire |
Termination Type |
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Crimp |
Crimp |
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PCB (Standard) |
Contact Mating Area Plating Material |
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Tin |
Gold |
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Gold |
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Silver |
Contact Type |
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Socket |
Socket |
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Pin |
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Pin |
Mating Pin Diameter |
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.14 |
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1.57 |
Wire/Cable Type |
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Discrete Wire |
Discrete Wire |
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Connector & Contact Terminates To |
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Wire & Cable |
Wire & Cable |
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Printed Circuit Board |
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Wire & Cable |
Wire Contact Termination Area Plating Material |
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Tin |
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Silver |
Wire Insulation Support |
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Without |
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Without |
Product Type |
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Contact |
Contact |
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Contact |
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Contact |
Wire/Cable Size |
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1 – 2.5 |
24 – 20 |
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20 – 16 |
Contact Retention in Housing |
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With |
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Without |
Circuit Application |
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Power |
Signal |
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Power |
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Power |
Contact Base Material |
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Phosphor Bronze |
Brass |
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Copper Alloy |
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Copper |
Contact Termination Area Plating Material |
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Tin |
Gold Flash |
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Silver |
Operating Voltage |
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250 |
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For Multiple Crimp |
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No |
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Packaging Quantity |
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2500 |
100 |
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500 |
Operating Temperature Range |
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-67 – 221 |
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-67 – 221 |
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-67 – 221 |
Contact Current Rating (Max) |
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17 |
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3 |
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35 |
Contact Retention Type within Housing |
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Locking Lance |
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Connector Mounting Type |
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Cable Mount |
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Cable Mount |
Packaging Method |
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Reel |
Box |
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Carton |
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Bag |
Connector System |
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Wire-to-Wire |
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Cable-to-Cable |
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Wire-to-Wire |
Contact Mating Area Plating Thickness |
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30 |
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30 |
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5 |
For Use With |
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G Series Connectors |
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Type M Connector |
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Comment |
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Overall insulation crimp diameter, including crimp barrel, must not exceed 3.18 [.125]. |
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Contact Size |
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16 |
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12 |
Test Current |
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13 |
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Body Style |
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Right Angle |
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Length |
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17.6 |
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Retaining Ring Material |
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Copper Alloy |
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PCB Contact Termination Area Plating Material |
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Gold |
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Contact Configuration |
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High Current Power Contact |
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Contact Underplating Material |
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Nickel |
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Nickel |
DIN Level |
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II |
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Contact Termination Area Plating Thickness |
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200 |
Crimp Area Plating Finish |
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Silver |
Contact Plating Material |
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Silver |
Underplate Material Thickness |
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1.27 |
Crimp Area Plating Thickness |
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200 |
Mount Type |
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Crimp |
Contact Mating Area Plating Material Finish |
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Silver |