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Amphenol ICC
10039651-001LF
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Amphenol
10137239-0011LF
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Molex
173162-0334
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Amphenol
10033998-002LF
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Amphenol
10034273-001LF
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Amphenol
10137850-0020LF
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TE Connectivity
1734290-2
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TE Connectivity
2288172-7
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TE Connectivity
2317823-1
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Amphenol ICC
10120666-101LF
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| Price |
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| RoHS |
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Compliant |
Compliant |
Compliant |
Compliant |
Compliant |
Compliant |
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Compliant |
| Lead Status |
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No |
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Yes |
| Lightpipe Style |
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Standard |
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| PCB Thickness (Recommended) |
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.059 |
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| Centerline (Pitch) |
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.8 |
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| For Use With Pluggable I/O Products |
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zSFP+ SMT Connector |
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| EMI Containment Feature Type |
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EMI Springs |
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| Contact Mating Area Plating Thickness |
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29.92 |
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| Cage Material |
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Nickel Silver Alloy |
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| Connector & Contact Terminates To |
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Printed Circuit Board |
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| Connector System |
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Cable-to-Board |
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| Lightpipe Configuration |
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Dual Triangular (Inner) |
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| Included Lightpipe |
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Yes |
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| Sealable |
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Yes |
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| Operating Temperature Range |
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-40 – 85 |
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| Port Matrix Configuration |
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2 x 12 |
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| UL Flammability Rating |
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UL 94V-0 |
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| Pluggable I/O Applications |
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zSFP+ Thermally Enhanced |
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| Heat Sink Compatible |
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No |
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| Cage Type |
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Stacked |
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| Included Heat Sink |
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No |
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| Contact Mating Area Plating Material |
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Gold or Gold Flash over Palladium Nickel |
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| Data Rate (Max) |
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32 |
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| Circuit Application |
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Signal |
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| Product Type |
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Cage Assembly with Integrated Connector |
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| Tail Length |
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1.8 |
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| Form Factor |
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zSFP+ |
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| Number of Positions |
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480 |
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| Tail Plating Material |
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Tin |
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| PCB Mounting Style |
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Through Hole Press-Fit |
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| Integrated Lightpipes |
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Yes |
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| Number of Ports |
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24 |
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| Packaging Method |
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Tray |
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| Termination Method to Printed Circuit Board |
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Through Hole - Press-Fit |
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