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Molex
58002-0000
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3M
8B36-2431
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3M
8AB36-2230-LJ
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3M
8C26-22200
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Amphenol
10081533-001LF
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Molex
0760945003
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Amphenol
10120666-101LF
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TE Connectivity
2170808-4
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TE Connectivity
554953-1
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TE Connectivity
554955-2
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| Price |
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| RoHS |
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Not Compliant |
Not Compliant |
Not Compliant |
Not Compliant |
Compliant |
Compliant |
Compliant |
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| Lead Status |
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No |
No |
No |
No |
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Yes |
No |
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| Heat Sink Style |
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Pin |
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| Number of Ports |
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2 |
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| PCB Thickness (Recommended) |
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1.57 |
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| For Use With Pluggable I/O Products |
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QSFP28 Cable Assembly |
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| EMI Containment Feature Type |
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Internal/External EMI Springs |
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| Form Factor |
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zQSFP+ |
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| Heat Sink Height |
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.165 |
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| Data Rate (Max) |
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28 |
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| Cage Material |
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Nickel Silver |
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| Connector Mounting Type |
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Board Mount |
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| Connector & Contact Terminates To |
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Printed Circuit Board |
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| Connector System |
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Cable-to-Board |
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| Product Type |
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Cage Assembly |
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| Rear EONs per Port Column |
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0 |
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| Enhancements |
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Standard |
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| Included Lightpipe |
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Yes |
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| Included Heat Sink |
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Yes |
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| Operating Temperature Range |
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-40 – 85 |
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| Port Matrix Configuration |
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1 x 2 |
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| PCB Contact Termination Area Plating Material |
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Tin |
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| Heat Sink Finish |
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Anodized Black |
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| Lightpipe Configuration |
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Single Round |
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| Circuit Application |
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Signal |
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| Pluggable I/O Applications |
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Standard |
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| Packaging Method |
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Box & Tray |
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| Tail Length |
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2.05 |
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| Heat Sink Height Class |
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PCI |
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| UL Flammability Rating |
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UL 94V-0 |
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| Sealable |
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No |
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| Cage Type |
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Ganged |
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| Termination Method to Printed Circuit Board |
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Through Hole - Press-Fit |
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