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TE Connectivity
5554349-1
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TE Connectivity
2198483-1
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TE Connectivity
1-1734099-0
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TE Connectivity
1734099-4
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TE Connectivity
1734099-8
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TE Connectivity
749111-6
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TE Connectivity
2143331-4
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TE Connectivity
2170808-3
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TE Connectivity
1551920-2
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TE Connectivity
100616-1
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| Price |
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| RoHS |
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Compliant |
Compliant |
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| Lead Status |
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No |
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| PCB Mount Orientation |
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Right Angle |
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| PCB Thickness (Recommended) |
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.038 |
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.057 |
1.57 |
.057 |
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| Height above PC Board |
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16.44 |
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| Product Type |
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Receptacle Assembly |
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Cage Assembly |
Cage Assembly |
Connector |
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| Connector Style |
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Receptacle |
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| Product Grouping |
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Mini-SAS HD |
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| Termination Post Length |
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.065 |
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| Number of Positions |
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72 |
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38 |
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| Housing Material |
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LCP (Liquid Crystal Polymer) |
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| Connector & Contact Terminates To |
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Printed Circuit Board |
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Printed Circuit Board |
Printed Circuit Board |
Printed Circuit Board |
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| Connector System |
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Cable-to-Board |
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Cable-to-Board |
Cable-to-Board |
Cable-to-Board |
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| PCB Termination |
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Through Hole - Press-Fit |
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| Contact Base Material |
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Copper Alloy |
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| Included Lightpipe |
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Yes |
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Yes |
Yes |
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| Connector Type |
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Mini-SAS HD |
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| UL Flammability Rating |
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UL 94V-0 |
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UL 94V-0 |
UL 94V-0 |
UL 94V-0 |
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| Packaging Method |
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Box & Tray |
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Box & Tray |
Box & Tray |
Tape |
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| Shell |
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With |
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| Keyed |
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No |
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| PCB Mount Retention |
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With |
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| Circuit Application |
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Signal |
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Signal |
Signal |
Signal |
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| Operating Temperature Range |
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-67 – 185 |
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-67 – 221 |
-40 – 85 |
-40 – 85 |
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| High Temperature Housing |
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Yes |
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| Number of Rows |
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2 |
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| Number of Ports |
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2 |
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6 |
2 |
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| Centerline (Pitch) |
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.029 |
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.8 |
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| PCB Mount Retention Type |
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M2 Screw |
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| Stackable |
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No |
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| Housing Color |
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Black |
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| Heat Sink Style |
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Pin |
Pin |
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| Heat Sink Height |
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.165 |
13.5 |
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| Data Rate (Max) |
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28 |
28 |
25 |
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| Cage Material |
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Nickel Silver |
Nickel Silver |
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| Connector Mounting Type |
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Board Mount |
Board Mount |
Board Mount |
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| Tail Length |
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.086 |
2.05 |
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| Enhancements |
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Standard |
Standard |
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| Included Heat Sink |
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Yes |
Yes |
No |
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| Rear EONs per Port Column |
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1 |
1 |
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| PCB Contact Termination Area Plating Material |
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Tin |
Tin |
Tin |
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| Heat Sink Finish |
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Anodized Black |
Anodized Black |
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| Port Matrix Configuration |
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1 x 6 |
1 x 2 |
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| Pluggable I/O Applications |
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Standard |
Standard |
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| Form Factor |
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QSFP+ |
zQSFP+ |
zQSFP+ |
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| For Use With Pluggable I/O Products |
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QSFP Cable Assembly |
QSFP28 Cable Assembly |
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| Heat Sink Height Class |
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PCI |
Networking |
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| Lightpipe Configuration |
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Dual Round |
Single Round |
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| EMI Containment Feature Type |
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Customer Applied Gasket |
Internal/External EMI Springs |
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| Sealable |
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No |
No |
No |
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| Cage Type |
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Ganged |
Ganged |
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| Termination Method to Printed Circuit Board |
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Through Hole - Press-Fit |
Through Hole - Press-Fit |
Surface Mount |
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| Contact Mating Area Plating Thickness |
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30 |
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| Contact Current Rating (Max) |
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.5 |
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| Contact Mating Area Plating Material |
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Gold |
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