|
|
TE Connectivity
530750-5
|
Amphenol Aerospace
M55302/170B49Z1
|
Amphenol
EN4165-25D
|
Amphenol Aerospace
M55302/168C42Y1
|
Phoenix Contact Ltd
1607394
|
Amphenol
DBMAE25PTI
|
Amphenol
DBMA25PTIFO
|
Wurth Elektronik
690367282276
|
Molex
171089-8401
|
Molex
171089-8402
|
| Price |
|
|
|
|
|
|
|
|
|
|
|
| RoHS |
|
|
Not Compliant |
Not Compliant |
Not Compliant |
Compliant |
Not Compliant |
Not Compliant |
Compliant |
Compliant |
Compliant |
| Lead Status |
|
|
|
|
|
|
|
|
|
|
|
| For Use With |
|
.100 [2.54] Centerline |
|
|
|
|
|
|
|
|
|
| Termination Type |
|
Crimp |
|
|
|
|
|
|
|
|
|
| Wire/Cable Size |
|
.12 – .4 |
|
|
|
|
|
|
|
|
|
| Contact Mating Area Plating Material |
|
Gold |
|
|
|
|
|
|
|
|
|
| Contact Type |
|
Pin |
|
|
|
|
|
|
|
|
|
| Product Type |
|
Contact |
|
|
|
|
|
|
|
|
|
| Contact Mating Area Plating Thickness |
|
50 |
|
|
|
|
|
|
|
|
|
| Contact Base Material |
|
Brass |
|
|
|
|
|
|
|
|
|
| Packaging Method |
|
Loose Piece |
|
|
|
|
|
|
|
|
|
| Packaging Quantity |
|
1000 |
|
|
|
|
|
|
|
|
|
