Quad DC/DC Module Regulator with Configurable 1.2A Output Array Features: Quad Output Step-Down µModule Regulator with 1.2A per Output Channel Wide Input Voltage Range: 2.7V to 17V 0.6V to 1.8V Output Voltage 1.2A DC, Parallelable, Output Current Each Channel ±1.5% Total Output Voltage Regulation 100% Duty Cycle Operation Current Mode Control, Fast Transient Response External Frequency Synchronization Selectable Burst Mode® Operation Power Good Indicator Over Voltage, Current and Temperature Protection 6.25mm × 6.25mm × 2.1mm BGA Package Pin Compatible with LTM4668A (0.6V to 5.5V Output, 2.25MHz)

Single Channel Transimpedance Amplifier with Output Multiplexing Features: 220MHz –3dB Bandwidth with 2pF Input Capacitance Single-Ended Output 74kΩ Transimpedance Gain 4.8pA/√Hz Input Current Noise Density at 200MHz (2pF) 64nARMS Integrated Input Current Noise Over 200MHz (2pF) Linear Input Range 0µA to 30µA Overload Current > ±400mA Peak Fast Overload Recovery: 1mA in 10ns Fast Output MUXing: <50ns Single 5V Supply 90mW Power Dissipation 2VP-P Output Swing on 100Ω Load 3mm × 3mm, 16-Lead QFN Package Output MUX Combines Multiple LTC6560 Devices AEC-Q100 Qualified for Automotive Applications

7.5kVRMS SPI/Digital or I2C Module Isolator with Transformer Driver Features: 6-Channel Logic Isolator: 7500VRMS for 1 Minute 16.2mm Creepage CSA (IEC/UL) Approved, File #255632 3V to 5.5V Supply Operation Transformer Driver with Integrated Isolated Side LDO SPI/Digital (LTM2810-S) or I2C (LTM2810-I) Options High Common Mode Transient Immunity: 50kV/μs High Speed Operation: 10MHz Digital Isolation 4MHz/8MHz SPI Isolation 400kHz I2C Isolation Operation Up to 125°C (H-Grade) 1.62V to 5.5V Logic Supplies for Flexible Digital Interfacing ±25kV ESD HBM Across the Isolation Barrier Maximum Continuous Working Voltage: 1kVRMS, 1.6kVDC Low Current Shutdown Mode (<10µA) 22mm × 6.25mm × 2.06mm BGA Package

Low IQ Boost/SEPIC/Inverting Converter with 1.5A, 150V Switch Features: Wide Input Voltage Range: 2.8V to 60V Ultralow Quiescent Current and Low Ripple Burst Mode® Operation: IQ = 9µA 1.5A, 150V Power Switch Positive or Negative Output Voltage Programming with a Single Feedback Pin Programmable Frequency (100kHz to 500kHz) Synchronizable to an External Clock Spread Spectrum Frequency Modulation for Low EMI BIAS Pin for Higher Efficiency Programmable Undervoltage Lockout (UVLO) Thermally Enhanced 16-lead MSOP Package AEC-Q100 Qualified for Automotive Applications

Precision Analog Microcontroller, 12-Bit Analog I/O, ARM7TDMI MCU Features: Analog I/O Multichannel, 12-bit, 1 MSPS ADC Up to 16 ADC channels Fully differential and single-ended modes 0 V to VREF analog input range12-bit voltage output DACs Up to 4 DAC outputs available On-chip voltage reference On-chip temperature sensor (±3°C) Voltage comparator Microcontroller ARM7TDMI core, 16-bit/32-bit RISC architecture JTAG port supports code download and debug Clocking options Trimmed on-chip oscillator (±3%) External watch crystal External clock source up to 44 MHz 41.78 MHz PLL with programmable divider See datasheet for additional features

MicroConverter Multichannel 24-/16-Bit ADCs with Embedded 62 kB Flash and Single-Cycle MCU Features: High resolution Σ-Δ ADCs 2 independent 24-bit ADCs Up to 10 ADC input channels on all devices 24-bit no missing codes 22-bit rms (19.5 bit p-p) effective resolution Offset drift 10 nV/°C, gain drift 0.5 ppm/°C chop enabled Memory 62-kbyte on-chip Flash/EE program memory 4-kbyte on-chip Flash/EE data memory Flash/EE, 100-year retention, 100 kcycle endurance 3 levels of Flash/EE program memory security In-circuit serial download (no external hardware) High speed user download (5 sec) 2304 bytes on-chip data RAM See data sheet for additional features

Ultra Low Power ARM Cortex-M4F MCU with Integrated Power Management Features: EEMBC ULPMark™-CP score (3 V): 189 Ultra low power active and hibernate modes Active mode dynamic current: 41 μA/MHz (typical) Flexi mode: 400 μA (typical) Hibernate mode: 0.65 μA (typical) Shutdown mode: 50 nA (typical) Shutdown mode (fast wake-up): 0.20 μA (typical) ARM Cortex-M4F processor at 52 MHz with FPU, MPU, ITM with SWD interface Power management Single-supply operation (connected to VBAT pins): 1.74 V to 3.6 V Optional buck converter for improved efficiency Memory options 512 kB of embedded flash memory with ECC 4 kB of cache memory to reduce active power 128 kB of configurable system SRAM with parity Safety Watchdog with dedicated on-chip oscillator Hardware CRC with programmable polynomial Multiparity bit protected SRAM ECC protected embedded flash Security Hardware cryptographic accelerator supporting AES-128, AES-256, and SHA-256 Protected key storage in flash, SHA-256-based keyed HMAC and key wrap and unwrap User code protection TRNG Digital peripherals 3 SPI interfaces to enable glueless interface to sensors, radios, and converters 1 I2C and 2 UART peripheral interfaces SPORT for natively interfacing with converters and radios Programmable GPIOs (44 in LFCSP and 51 in WLCSP) 3 general-purpose timers with PWM support RGB timer for driving RGB LED RTC0 for time keeping RTC1 with SensorStrobe and time stamping Programmable beeper 27-channel DMA controller Clocking features 26 MHz clock: on-chip oscillator, external crystal oscillator, SYS_CLKIN for external clock, and integrated PLL 32 kHz clock: on-chip oscillator and low power crystal oscillator Clock fail detection for external crystals Analog peripherals 12-bit SAR ADC, 1.8 MSPS, 8 channels, and digital comparator

Ultra Low Power ARM Cortex-M4F MCU with Integrated Power Management Features: EEMBC ULPMark™-CP score (3 V): 189 Ultra low power active and hibernate modes Active mode dynamic current: 41 μA/MHz (typical) Flexi mode: 400 μA (typical) Hibernate mode: 0.65 μA (typical) Shutdown mode: 50 nA (typical) Shutdown mode (fast wake-up): 0.20 μA (typical) ARM Cortex-M4F processor at 52 MHz with FPU, MPU, ITM with SWD interface Power management Single-supply operation (connected to VBAT pins): 1.74 V to 3.6 V Optional buck converter for improved efficiency Memory options 512 kB of embedded flash memory with ECC 4 kB of cache memory to reduce active power 128 kB of configurable system SRAM with parity Safety Watchdog with dedicated on-chip oscillator Hardware CRC with programmable polynomial Multiparity bit protected SRAM ECC protected embedded flash Security Hardware cryptographic accelerator supporting AES-128, AES-256, and SHA-256 Protected key storage in flash, SHA-256-based keyed HMAC and key wrap and unwrap User code protection TRNG Digital peripherals 3 SPI interfaces to enable glueless interface to sensors, radios, and converters 1 I2C and 2 UART peripheral interfaces SPORT for natively interfacing with converters and radios Programmable GPIOs (44 in LFCSP and 51 in WLCSP) 3 general-purpose timers with PWM support RGB timer for driving RGB LED RTC0 for time keeping RTC1 with SensorStrobe and time stamping Programmable beeper 27-channel DMA controller Clocking features 26 MHz clock: on-chip oscillator, external crystal oscillator, SYS_CLKIN for external clock, and integrated PLL 32 kHz clock: on-chip oscillator and low power crystal oscillator Clock fail detection for external crystals Analog peripherals 12-bit SAR ADC, 1.8 MSPS, 8 channels, and digital comparator

Ultra Low Power ARM Cortex-M4F MCU with Integrated Power Management Features: EEMBC ULPMark™-CP score (3 V): 189 Ultra low power active and hibernate modes Active mode dynamic current: 41 μA/MHz (typical) Flexi mode: 400 μA (typical) Hibernate mode: 0.65 μA (typical) Shutdown mode: 50 nA (typical) Shutdown mode (fast wake-up): 0.20 μA (typical) ARM Cortex-M4F processor at 52 MHz with FPU, MPU, ITM with SWD interface Power management Single-supply operation (connected to VBAT pins): 1.74 V to 3.6 V Optional buck converter for improved efficiency Memory options 512 kB of embedded flash memory with ECC 4 kB of cache memory to reduce active power 128 kB of configurable system SRAM with parity Safety Watchdog with dedicated on-chip oscillator Hardware CRC with programmable polynomial Multiparity bit protected SRAM ECC protected embedded flash Security Hardware cryptographic accelerator supporting AES-128, AES-256, and SHA-256 Protected key storage in flash, SHA-256-based keyed HMAC and key wrap and unwrap User code protection TRNG Digital peripherals 3 SPI interfaces to enable glueless interface to sensors, radios, and converters 1 I2C and 2 UART peripheral interfaces SPORT for natively interfacing with converters and radios Programmable GPIOs (44 in LFCSP and 51 in WLCSP) 3 general-purpose timers with PWM support RGB timer for driving RGB LED RTC0 for time keeping RTC1 with SensorStrobe and time stamping Programmable beeper 27-channel DMA controller Clocking features 26 MHz clock: on-chip oscillator, external crystal oscillator, SYS_CLKIN for external clock, and integrated PLL 32 kHz clock: on-chip oscillator and low power crystal oscillator Clock fail detection for external crystals Analog peripherals 12-bit SAR ADC, 1.8 MSPS, 8 channels, and digital comparator

Precision Analog Microcontroller, 16-Bit Analog Input/Output with MDIO Interface, Arm Cortex-M33 Features: Analog input/output Multichannel, 16-bit, 2 MSPS ADC Up to 16 external channels On-chip die temperature monitor 4 power monitor channels 4 PGA/TIA channels supporting voltage and current measurements Fully differential and single-ended modes 0 V to VREF analog input range 12-bit voltage output DACs 8× 0 V to 2.5 V, 1 kΩ load 4× 0 V to 2.5 V, 2.5 kΩ load On-chip low drift voltage reference, 1.25 V or 2.5 V Buffered 1.25 V or 2.5 V output 4 voltage comparators Microcontroller 32-bit Arm Cortex-M33 core, 32-bit RISC architecture, FPU Serial wire port supports code download and debug Clocking options 16 MHz on-chip oscillator 160 MHz PLL output with programmable divider External clock source Memory 2× 512 kB independent Flash/EE memories 10,000-cycle Flash/EE endurance 20-year Flash/EE retention 128 kB SRAM with ECC Software triggered, in circuit reprogrammability via MDIO or I2C On-chip peripherals 2× UART, 3× SPI, 3× I2C serial input/output Multilevel voltage (3.3 V, 1.8 V, 1.2 V) GPIOs MDIO slave up to 10 MHz 5 general-purpose timers Wake-up timer (WUTs) Watchdog timers (WDTs) 32-element PLA 16-bit PWM 10 external Interrupts Power Multiple supplies: 3.3 V for voltage DACs and ADCs, and 3.3 V, 1.8 V, or 1.2 V for digital inputs/outputs Flexible operating modes for low power applications Packages and temperature range 5 mm × 5 mm 81-ball CSP_BGA and 3.46 mm × 3.46 mm 64-ball WLCSP BGA package uses ULA molding compounds Fully specified for −40°C to +105°C operation Tools Low cost quick start development system Full third-party support