MEMS ACCELEROMETER, 2G/4G/8G/16G, LGA14; MEMS Sensor Output: Digital; Measurement Axis: X, Y, Z; Acceleration Range: ± 2g, ± 4g, ± 8g, ± 16g; Supply Voltage Min: 2V; Supply Voltage Max: 3.6V; Sensor Case Style: LGA; No. of Pins: 14Pins; Sensitivity Typ: -; Sensitivity Min: -; Sensitivity Max: -; Product Range: -; Automotive Qualification Standard: -; MSL: MSL 3 - 168 hours; SVHC: No SVHC (07-Jul-2017)

TEMPERATURE SENSOR;

TEMPERATURE SENSOR, -40 TO 150DEG C;

TEMPERATURE SENSOR, -25 TO 100DEG C;

TEMPERATURE SENSOR, -40 TO 100DEG C;

TEMPERATURE SENSOR, -40 TO 100DEG C;

MEMS MODULE, 4.75-5.25V, MODULE-24;

MEMS MODULE, 3.15-3.45V, MODULE-14;

Micropower 3-Sensor Combination Including Acceleration and Temperature Features: All sensors sampled synchronously Up to 400 Hz ODR Samples can be synchronized to external trigger Ultralow power 1.95 A at 100 Hz ODR, 2.0 V supply, all sensors on 270 nA at 6 Hz motion activated wake-up mode 10 nA standby current 12-bit resolution for all sensors Acceleration scale factor down to 1 mg/LSB Temperature scale factor: 0.065C/LSB (typical) Built-in features for motion-based system level power savings Adjustable threshold sleep/wake modes for motion activation Accelerometer, temperature sensor, and provision for third analog sensor input Autonomous interrupt processing, without need for microcontroller intervention, to allow the rest of the system to be turned off completely Deep embedded FIFO minimizes host processor load Awake state output enables implementation of standalone, motion activated switch Wide supply and I/O voltage ranges: 1.6 V to 3.5 VOperates off 1.8 V to 3.3 V railsPower can be derived from coin cell batterySPI digital interfaceSmall and thin 3 mm 3.25 mm 1.06 mm package

Nanopower, 3-Axis, 2 g/4 g/8 g Digital Output MEMS Accelerometer Features: Supply voltage range Single-cell battery operation: 1.1 V to 3.6 V Internal power supply regulation for high PSRR Ultralow power 0.89 μA at 100 Hz ODR, 2.0 V supply 180 nA motion activated wake-up mode 40 nA standby current High resolution: 0.25 mg/LSB Built-in features for system level power savings Single-tap and double-tap detection with only 35 nA of added current Adjustable threshold sleep and wake-up modes for motion activation Autonomous interrupt processing, without need for microcontroller intervention, to allow the rest of the system to be turned off completely Deep 512 sample embedded FIFO minimizes host processor load Awake state output enables implementation of motion activated switch Low noise to 170 μg/√Hz Acceleration sample synchronization via external trigger On-chip temperature sensor Internal two-pole antialias filter SPI (4-wire) and I2C digital interfaces Small and thin 2.2 mm × 2.3 mm × 0.87 mm package