DEL-GPVOUS-0.080-00-0816..

Bergquist
GAP PAD VO ULTRA SOFT .080" 8"X16"; Thermal Conductivity: 1W/m.K; Conductive Material: Filled Silicone Polymer; Thickness: 2.032mm; Thermal Impedance: -; Dielectric Strength: -; External ; Available until stocks are exhausted
Distributor SKU Stock MOQ 1 10 50 100 1,000 10,000
element14 APAC DEL-GPVOUS-0.080-00-0816.. 0 1 * $223.22 * $223.22 * $223.22 * $223.22 * $223.22 * $223.22
Farnell DEL-GPVOUS-0.080-00-0816.. 0 1 * $353.35 * $353.35 * $353.35 * $353.35 * $353.35 * $353.35

SANP-C1N030

Littelfuse
Thermal Pad, Solid State Relay Rohs Compliant: Yes |Littelfuse SANP-C1N030

BTJ120625T1L0

Bourns, Inc.
THERMAL JUMPER CHIP, 3.2X1.6X0.7MM;

BTJ251225T2L0

Bourns, Inc.
THERMAL JUMPER CHIP, 6.4X3.2X0.7MM;

ILA-TIM-STRIP-300X20-2A.

Intelligent LED Solutions
HEAT SINK PADS, GRAPHITE SHEET, 0.16MM;

ATS-TEC40-47-002

Advanced Thermal Solutions (ATS Europe BV)
TEC MODULE, 40X40X4.7

ATS-TEC40-47-015

Advanced Thermal Solutions (ATS Europe BV)
TEC MODULE, 40X40X4.7

MP-TG-A2200-130-1.5

Multicomp
THERMAL PAD, 130X130X1.5MM, SILICONE;

MP-TG-A2200-130-3.0

Multicomp
THERMAL PAD, 130X130X3MM, SILICONE;

MP-TG-A3500-150-1.5A

Multicomp
THERMAL PAD, 150X150X1.5MM, SILICONE;