3223-07FR-43
Bergquist
SIL-PAD 400 .007" TO-220 ; Thickness:0.178mm; Conductive Material:-; SVHC:No SVHC (17-Dec-2015); Thermal Conductivity:0.9W/m.K; Thermal Impedance:-; Volume Resistivity:1ohm-m; External Length:-; External Width:-; Product Range:-; Breakdown Voltage Vbr:3.5kV; Electrical Property Ins / Con:Insulative; Isolation Voltage:3.5kV; Material:Silicone Rubber / Fibreglass; Operating Temperature Max:180°C; Operating Temperature Min:-60°C; Operating Temperature Range:-60°C to +180°C; Packages Cooled:TO-220; Thermal Resistance:0.45°C/W; Type:Thermal Pad
| Distributor | SKU | Stock | MOQ | 1 | 10 | 50 | 100 | 1,000 | 10,000 |
|---|---|---|---|---|---|---|---|---|---|
| element14 APAC | 3223-07FR-43 | 4779 | 10 | * $0.00 | * $0.74 | * $0.71 | * $0.59 | * $0.53 | * $0.53 |
| Farnell | 3223-07FR-43 | 5970 | 10 | * $0.00 | * $0.97 | * $0.62 | * $0.58 | * $0.53 | * $0.53 |
| Mouser Electronics | 3223-07FR-43 | 0 | |||||||
| Newark | 3223-07FR-43 | 640 | 1 | $0.76 | $0.74 | $0.65 | $0.61 | $0.61 | $0.61 |
804070
Bergquist
Thermal Substrates - MCPCB Thermal Clad Power LED IMS Substrate, Footprint = Samsung Sunnix, Square Strip (17-up), TCLAD LED IMS Series
| Distributor | SKU | Stock | MOQ | 1 | 10 | 50 | 100 | 1,000 | 10,000 |
|---|---|---|---|---|---|---|---|---|---|
| Mouser Electronics | N/A | 0 |
804070
Bergquist
Thermal Substrates - MCPCB Thermal Clad Power LED IMS Substrate, Footprint = Samsung Sunnix, Square Strip (17-up), TCLAD LED IMS Series
| Distributor | SKU | Stock | MOQ | 1 | 10 | 50 | 100 | 1,000 | 10,000 |
|---|---|---|---|---|---|---|---|---|---|
| Mouser Electronics | N/A | 0 |
804070
Bergquist
Thermal Substrates - MCPCB Thermal Clad Power LED IMS Substrate, Footprint = Samsung Sunnix, Square Strip (17-up), TCLAD LED IMS Series
| Distributor | SKU | Stock | MOQ | 1 | 10 | 50 | 100 | 1,000 | 10,000 |
|---|---|---|---|---|---|---|---|---|---|
| Mouser Electronics | N/A | 0 |
2196886
Henkel
THERMAL GAP PAD, SLICONE FREE POLYMER; Thermal Conductivity:3W/m.K; Conductive Material:Silicone Free Polymer; Thickness:0.125"; Thermal Impedance:-; Dielectric Strength:-; External Length:-; External Width:-
2214846
Henkel
THERMAL GAP PAD, SILICONE/FIBERGLASS/GRY; Thermal Conductivity:6W/m.K; Conductive Material:Silicone, Fiberglass; Thickness:0.125"; Thermal Impedance:-; Dielectric Strength:-; External Length:16"; External Width:8"
2253551
Henkel
THERMAL GAP PAD, SLICONE FREE POLYMER; Thermal Conductivity:3W/m.K; Conductive Material:Silicone Free Polymer; Thickness:0.125"; Thermal Impedance:-; Dielectric Strength:-; External Length:-; External Width:-
804070
Bergquist
Thermal Substrates - MCPCB Thermal Clad Power LED IMS Substrate, Footprint = Samsung Sunnix, Square Strip (17-up), TCLAD LED IMS Series
| Distributor | SKU | Stock | MOQ | 1 | 10 | 50 | 100 | 1,000 | 10,000 |
|---|---|---|---|---|---|---|---|---|---|
| Mouser Electronics | N/A | 0 |
CD-02-05-126
Wakefield-Vette
CD-02-05 Series 0.5 x 0.35 inch w/ Hole TO-126 Phase Change Thermal Pad
| Distributor | SKU | Stock | MOQ | 1 | 10 | 50 | 100 | 1,000 | 10,000 |
|---|---|---|---|---|---|---|---|---|---|
| element14 APAC | CD-02-05-126 | 954 | 1 | * $1.34 | * $1.33 | * $1.17 | * $1.09 | * $1.09 | * $1.09 |
| Farnell | CD-02-05-126 | 954 | 1 | * $0.53 | * $0.50 | * $0.46 | * $0.46 | * $0.46 | * $0.46 |
| Future Electronics | CD-02-05-126 | 500 | 500 | $0.00 | $0.00 | $0.00 | $0.00 | $0.30 | $0.24 |
| Mouser Electronics | CD-02-05-126 | 1761 | 1 | $1.50 | $1.43 | $1.43 | $1.39 | $1.05 | $0.96 |
| Newark | CD-02-05-126 | 215 | 500 | $0.00 | $0.00 | $0.00 | $0.00 | $0.96 | $0.96 |
| Distributor | SKU | Stock | MOQ | 1 | 10 | 50 | 100 | 1,000 | 10,000 |
|---|---|---|---|---|---|---|---|---|---|
| Mouser Electronics | N/A | 0 |