TAP-TP1
Ohmite
HEAT SINK PAD, 55.9Mm x 55.9Mm x 200UM; Thickness:200µm; Conductive Material:Graphite Sheet; Thermal Conductivity:800W/m.K; Thermal Impedance:-; Volume Resistivity:-; External Length:55.9mm; External Width:55.9mm; Product Range:-
| Distributor | SKU | Stock | MOQ | 1 | 10 | 50 | 100 | 1,000 | 10,000 |
|---|---|---|---|---|---|---|---|---|---|
| Farnell | PEL00925 | 886 | 1 | * $72.96 | * $72.96 | * $72.96 | * $72.96 | * $72.96 | * $72.96 |
THJP0805ABT1
Vishay
THERMAL JUMPER, ALUMI NITRIDE, 170W/M.K; Thermal Conductivity:170W/m.K; Conductive Material:Aluminium Nitride; Thickness:0.03"; Thermal Impedance:13°C/W; Dielectric Strength:-; External Length:0.079"; External Width:0.047"
