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TDA8541T/N1,118

NXP Semiconductors N.V. TDA8541T/N1,118

JANTX1N6638U

Microsemi JANTX1N6638U

ICL7136CPL

Maxim Integrated ICL7136CPL

DS1302S+

Maxim Integrated DS1302S+

MAX202EWE

Maxim Integrated MAX202EWE

Microsemi JANTX1N3890

SN74AHC1G08DCKR

Texas Instruments SN74AHC1G08DCKR

TE Connectivity 2-36158-1

TE Connectivity 330876

TE Connectivity 34130

Price
RoHS Compliant Not Compliant Not Compliant Compliant Not Compliant Not Compliant Compliant
Lead Status No No No No No No
Plating Material Tin Tin
Weight per Piece 1.048 .417
Terminal & Splice Style Ring Tongue Splice
Wire Insulation Diameter .115 – .17
Wire Insulation Diameter (Max) .17
Barrel Type Closed Barrel
Insulation Type Pre-Insulated
Insulation Sleeve Material Copper
Overall Length .859
Wire Size 16 – 14 22 – 16
Tongue Thickness .79
Packaging Quantity 5000 1000
Operating Temperature Range 105 170
Plating Thickness 2.54
Packaging Method Tape Mounted Loose Piece
Terminal Orientation Offset
Terminal Type Ring Tongue
Stud Diameter 3.68
Insulated Yes No
Inspection Slot No
Number of Holes 1
Wire Insulation Support With Without
Stud Size M3.5
Wire/Cable Type Regular Wire
Barrel Style Standard
Shape Code RING-041
Government Qualified No No
Discrete Wire Type Solid or Stranded
Support Style Insulation Support
Insulation Material Nylon
Material Thickness .79 .033
Voltage (Max) 300
Heavy Duty No
Barrel Color Blue
Terminal Angle Straight
Sealable No No
Product Type Splice
Splice Material Copper
Splice Type Parallel Splice
Contact Plating Thickness 100
Barrel Inside Diameter 1.55
Outside Diameter .141
Military Category No
Serrated Yes
Contact Plating Material Tin