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TE Connectivity
2007626-1
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TE Connectivity
2-2013290-2
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TE Connectivity
2041021-3
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TE Connectivity
1564411-1
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TE Connectivity
2007562-6
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TE Connectivity
TE1500B1R0J
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TE Connectivity
2106091-2
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TE Connectivity
2106091-1
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TE Connectivity
1735690-1
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TE Connectivity
TE1200B8R2J
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| Price |
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| RoHS |
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| Lead Status |
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| Heat Sink Style |
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Pin |
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| Heat Sink Height |
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6.5 |
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| Lightpipe Configuration |
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Dual Square |
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Single Triangular (Inner) |
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| Heat Sink Height Class |
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SAN |
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| PCB Thickness (Recommended) |
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.057 |
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.059 |
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| Data Rate (Max) |
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28 |
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16 |
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| Cage Material |
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Nickel Silver |
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Nickel Silver |
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| Connector Mounting Type |
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Board Mount |
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Board Mount |
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| Connector & Contact Terminates To |
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Printed Circuit Board |
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Printed Circuit Board |
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Printed Circuit Board |
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| Connector System |
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Cable-to-Board |
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Cable-to-Board |
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| Product Type |
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Cage Assembly |
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Cage Assembly with Integrated Connector |
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Connector |
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| Tail Length |
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.086 |
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3 |
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| Enhancements |
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Standard |
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| Included Lightpipe |
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Yes |
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Yes |
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| Included Heat Sink |
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Yes |
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No |
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| Rear EONs per Port Column |
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1 |
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| PCB Contact Termination Area Plating Material |
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Tin |
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Tin |
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| Heat Sink Finish |
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Anodized Black |
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| Number of Ports |
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4 |
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12 |
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1 |
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| Circuit Application |
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Signal |
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Signal |
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| Pluggable I/O Applications |
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Standard |
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SFP+ |
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| Packaging Method |
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Box & Tray |
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Package |
Loose Piece - Box |
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Box & Tray |
Loose Piece - Box |
| Form Factor |
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QSFP+ |
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SFP+ |
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| For Use With Pluggable I/O Products |
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QSFP Cable Assembly |
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| Port Matrix Configuration |
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1 x 4 |
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2 x 6 |
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| UL Flammability Rating |
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UL 94V-0 |
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UL 94V-0 |
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UL 94V-0 |
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| Operating Temperature Range |
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-67 – 221 |
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-67 – 221 |
-25 – 225 |
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-25 – 225 |
| EMI Containment Feature Type |
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Customer Applied Gasket |
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External Springs |
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| Sealable |
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No |
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No |
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| Cage Type |
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Ganged |
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Stacked |
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| Termination Method to Printed Circuit Board |
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Through Hole - Press-Fit |
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Through Hole - Press-Fit |
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| Centerline (Pitch) |
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.8 |
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| Contact Mating Area Plating Thickness |
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.76 |
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30 |
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| Number of Positions |
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240 |
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29 |
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| Heat Sink Compatible |
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No |
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| Contact Mating Area Plating Material |
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Gold or Gold Flash over Palladium Nickel |
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Gold |
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| Tail Plating Material |
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Tin |
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| PCB Mounting Style |
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Through Hole Press-Fit |
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Through Hole Press-Fit |
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| Integrated Lightpipes |
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Yes |
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| Resistance Class |
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Up to 1kΩ |
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Up to 1kΩ |
| Mount Style |
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Bracket |
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Bracket |
| Resistor Type |
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Power Resistor |
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Power Resistor |
| Number of Resistors |
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1 |
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1 |
| Resistance |
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1 |
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8.2 |
| Termination Type |
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Solder Lug |
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Solder Lug |
| Number of Terminations |
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2 |
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2 |
| Element Type |
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Wirewound |
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Wirewound |
| Dimensions |
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465 x 60 x 119 |
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465 x 60 x 119 |
| Voltage Rating |
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2500 V |
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2500 V |
| Tolerance |
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5% |
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5% |
| Power Rating |
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1500 |
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1200 |
| Temperature Coefficient |
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±440 |
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±440 |
| Keyed |
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No |
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| Height above PC Board |
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.624 |
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| Housing Color |
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Black |
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| Boardlock Length |
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4 |
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| Packaging Quantity |
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300 |
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| Receptacle Configuration |
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SAS Backplane |
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| Product Grouping |
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SAS |
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| Termination Post Length |
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3.8 |
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| Contact Base Material |
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Copper Alloy |
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| Boardlock Plating Material |
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Tin over Nickel |
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| Boardlock Type |
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Fork |
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| Housing Material |
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Thermoplastic |
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| PCB Mount Orientation |
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Vertical |
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| PCB Mount Retention |
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With |
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| High Temperature Housing |
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Yes |
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| Connector Style |
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Receptacle |
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| Contact Underplating Material |
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Nickel |
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| PCB Mount Retention Type |
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Boardlock |
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| Boardlock Material |
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Copper Alloy |
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| Shell |
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Without |
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| Number of Rows |
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1 |
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| Stackable |
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No |
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