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Price
RoHS Y Y Y Y Y Y Y Y Y Y
Lead Status Y Y See ti.com Y Y See ti.com See ti.com See ti.com Y Y
Array diagonal(in) 0.48
Chipset family DLPC4430
Component type DMD
Display resolution(max) WUXGA (1920x1200)
Input frame rate(max)(Hz) 120
Micromirror array size 1920x1200
Micromirror pitch(mm) 0.0054
Operating temperature range(C) 0 -40 to 105 -40 to 125 -40 to 125 -40 to 125 -40 to 125 -40 to 125 -40 to 125 -40 to 125
Package area(mm^2) 718.06
Package size (L x W)(mm) 32.2 x 22.3
Package type DLP-S410
Pin count 257
Rating Catalog Catalog Automotive Catalog Catalog Catalog Catalog Catalog Catalog
System brightness(max)(lm) 5500
TI.com inventory 199
Approx. price(US$) 145.2 | 1ku 2.10 | 1ku 5.49 | 1ku 0.70 | 1ku 2.60 | 1ku 2.60 | 1ku 3.00 | 1ku 3.00 | 1ku 0.15 | 1ku 0.28 | 1ku
Control topology Switch-Mode Boost
Package Group VQFN|24 HTQFP|48 HTSSOP|16,VQFN|16 SOIC|16 SOIC|16 SC70|5,SOT-23|5,X2SON|5 SOIC|8,SOT-23-THIN|8,TSSOP|8,VSSOP|10,VSSOP|8,WSON|8,X2QFN|10
Absolute Vin (safety rating)(Max)((V)) 20
Number of series cells 2
Control interface I2C Hardware (GPIO)
Features ICO,IINDPM,Integrated ADC,Integrated FET,JEITA BAT Temp Monitoring (Thermistor Pin),OVP,Thermal Regulation,UVLO,VINDPM,Cell Balancing Cell Balancing,Integrated ADC,Multi-cell Support,Open wire detection,Over-temperature (OT),Over-voltage (OV),Requires separate MCU,Stackable (built-in interface),Temperature sense,Under-temperature (UT),Under-voltage (UV) Integrated Current Sensing,Current Sense Amplifier Hysteresis,Small Size Cost Optimized,EMI Hardened,Shutdown,Small Size
Charge current(Max)(A) 2.2
Operating Vin(Min)(V) 3.9
Package size mm2 mm2 mm2 mm2 mm2 mm2 mm2 mm2 mm2
Battery charge voltage(Max)(V) 9.2
Operating Vin(Max)(V) 6.2
Cell chemistry Li-Ion/Li-Polymer
Battery charge voltage(Min)(V) 6.8
Battery over-voltage protection(Min)(V) 2
Communication interface Differential Daisy Chain, UART
Vin(Max)(V) 33
Typical operating current(Typ)(uA) 4200
Battery over-voltage protection(Max)(V) 5
Number of series cells(Max) 6
Number of series cells(Min) 3
RDS(ON) (HS + LS)(mOhms) 700
Number of full bridges 1
Peak output current(A) 3.5
Vs(Max)(V) 37 6.5
Vs(Min)(V) 4.5 1.6
Control mode PWM,PH/EN,Independent 1/2-H PWM
Fail safe Idle,Open,Short Idle,Open,Short Idle,Open,Short Idle,Open,Short
VCC1(Min)(V) 1.71 1.71 1.71 1.71
VCC2(Min)(V) 3 3 3 3
HBM ESD(kV) 30 30 30 30
Isolation rating(Vrms) 5000 5000 5000 5000
Surge voltage capability(Vpk) 10000 10000 10000 10000
VCC2(Max)(V) 5.5 5.5 5.5 5.5
Data rate(Max)(Mbps) 12 12 50 50
VCC1(Max)(V) 5.5 5.5 5.5 5.5
Integrated transformer driver No No No No
Duplex Half Half Half Half
DIN V VDE V 0884-10 working voltage(Vpk) 1500 1500
CSA 60950-1 basic working(Vrms) 800 800
Number of nodes 256 256
CSA isolation rating(Vrms) 5000 5000
CSA 61010-1 reinforced working(Vrms) 250 250
Number of channels(#) 1 2
Iq per channel(Max)(mA) 0.0009 0.75
Vos (offset voltage @ 25 C)(Max)(mV) 8 1.6
Output type Push-Pull
Input bias current (+/-)(Max)(nA) 0.002
Propagation delay time(uS) 3
Rail-to-rail In,Out In,Out
Iq per channel(Typ)(mA) 0.000335 0.538
VICR(Max)(V) 6.6
VICR(Min)(V) 0
GBW(Typ)(MHz) 10
Output current(Typ)(mA) 50
Offset drift(Typ)(uV/C) 0.53
Slew rate(Typ)(V/us) 6.5
CMRR(Typ)(dB) 103
Output swing headroom (to positive supply)(Typ)(V) -0.02
Vn at 1 kHz(Typ)(nV/rtHz) 16
Input common mode headroom (to positive supply)(Typ)(V) 0.1
Input common mode headroom (to negative supply)(Typ)(V) -0.1
Architecture CMOS
Output swing headroom (to negative supply)(Typ)(V) 0.02
Total supply voltage(Min)(+5V=5, +/-5V=10) 1.8
Total supply voltage(Max)(+5V=5, +/-5V=10) 5.5
CMRR(Min)(dB) 80
Input bias current(Typ)(pA) 20