The Amphenol CDI CoreCryo interconnect solutions, enhanced by proven expertise in high-reliability connectivity, are engineered to deliver superior performance in extreme cryogenic environments for today’s most advanced applications. Ideal for high-density, space-constrained designs in quantum computing, aerospace, and scientific instrumentation, CoreCryo products support exceptional signal integrity and thermal stability at ultra-low temperatures. Their compact, precision engineered interfaces help engineers reduce system size while improving overall electrical performance, making them a strong choice for distribution customers seeking scalable, high-performance cryogenic connectivity solutions. Constructed with rugged materials and designed to withstand repeated thermal cycling, CoreCryo interconnects maintain consistent, long-term reliability without compromising performance. Their robust design supports dependable engagement and durability in harsh operating conditions, ensuring stable operation across critical applications.

Features:

• 20 GHz operating frequency
• Rugged connector: 1,000 cycle durability
• 2.5 mm signal-to-signal density
• Quick attach for RF/Digital connections
• Reusable and field-replaceable
• Non-magnetic materials

Applications:

Amphenol CDI solderless PCB Edge Launch connectors, backed by precision RF interconnect expertise, provide a cost-effective and efficient solution for high-frequency PCB testing and prototyping applications. Designed for quick installation without soldering, these connectors enable engineers to rapidly evaluate signal performance and validate designs while minimizing board rework and reducing overall development costs. Their precision-machined interface ensures excellent RF performance and consistent impedance matching, making them ideal for high-speed and microwave test environments commonly sourced through leading distributors. Engineered for repeated use, these connectors offer reliable attachment and removal without damaging the PCB, supporting fast design iterations and streamlined testing workflows. Their robust construction and stable mechanical interface ensure dependable performance across multiple test cycles, maintaining signal integrity throughout. By combining ease of use with reliable RF performance, solderless PCB Edge Launch connectors help engineers accelerate time-to-market while delivering a practical, cost-effective solution for RF testing and validation.

Features:

• Multiple mating interface options: 1.85 mm, 2.4 mm, 2.92 mm, and 3.5 mm
• Solderless/field-replaceable designs available
• Vertical flange-mount, edge-launch, and board-mount configurations
• Gold-plated brass bodies (for soldered versions)
• Rated up to 500 mating/de-mating cycles
• Supports wide frequency range with performance up to 110 GHz
• Non-solder installation enables fast setup, removal, and reuse without PCB damage
• Flexible placement options for high-density PCB designs
• Corrosion-resistant construction for improved durability
• Maintains high signal integrity over extended use

Applications:

• High-speed digital systems
• Vector network analyzers (VNA)
• Oscilloscopes
• Bit error ratio tests (BERT)
• Switch matrices
• Automatic test equipment (ATE)
• Semiconductors
• Design validation testing
• Integrators
• Military/defense
• Electronic sensors
• Radar/guidance systems