High-Performance 32-bit Floating-Point SHARC Processor for General Purpose Applications Features: 400MHz SIMD SHARC Core, capable of 2.4 GFLOPS peak performance 2Mbits SRAM; 6 Mbits customer-definable ROM High bandwidth, 32-bit external memory interface supporting glue-less interface to SDRAM, SRAM, and FLASH Digital Audio Interface (DAI) enabling user-definable access to system peripherals including 8 serial ports (SPORTs), S/PDIF Tx/Rx, 8-channel asynchronous sample rate converter, and 4 precision clock generators. Digital Peripheral Interface (DPI) enabling user-definable access to system peripherals including 2 SPI-compatible ports, 2 UARTs, 3 full-featured timers, and a two-wire interface compliant to the I2C standard. 34 zero-overhead DMA channels 16 Pulse Width Modulation (PWM) channels 208-lead LQFP-EP and 256-ball SBGA packages Commercial and industrial temperature ranges Maximum core performance is reduced for LQFP package

Up to 1GHz SHARC+ DSP with 640KB L1, 1024KB Shared L2 SRAM, 120-lead LQFP_EP Features:SHARC+ Core infrastructure 800MHz (max) or 1GHz (max) Core clock frequency 640KB on-chip Level 1 (L1) SRAM memory (with parity) increases low latency performance 32-bit, 40-bit & 64-bit floating point support 32-bit fixed point Byte, short-word, word, long-word addressedMemory 1024KB on-chip Level 2 (L2) SRAM with ECC protection - eliminates need for external memory in many use cases Advanced Hardware Accelerators Enhanced FIR/IIR offload engines running at Core clock frequency for added processing power Security Crypto Engines with OTPPowerful DMA SystemInnovative Digital Audio Interface (DAI) includes: 8x Full SPORT interfaces w/TDM & I2S modes 2x S/PDIF Rx/Tx, 8 ASRC pairs 4x Precision Clock Generators 24 BuffersOther Peripheral Connectivity / Interfaces: 2x Quad SPI, 1x Octal SPI MLB 3-pin 4x I2C, 2x UARTs 6x General Purpose Timer, 1x General Purpose Counter 2x Watchdog Timers 2-ch 12bit Housekeeping ADCs 22 GPIO pins, 24 DAI pins Thermal SensorPackage 14mm x 14mm 120-lead LQFP_EAdditional Features Security and Protection Crypto hardware accelerators Fast secure boot with IP protection Enhanced FIR and IIR accelerators running up to 1 GHz AEC-Q100 qualified for automotive applications

Up to 1GHz SHARC+ DSP with 640KB L1, 1024KB Shared L2 SRAM, 120-lead LQFP_EP Features:SHARC+ Core infrastructure 800MHz (max) or 1GHz (max) Core clock frequency 640KB on-chip Level 1 (L1) SRAM memory (with parity) increases low latency performance 32-bit, 40-bit & 64-bit floating point support 32-bit fixed point Byte, short-word, word, long-word addressedMemory 1024KB on-chip Level 2 (L2) SRAM with ECC protection - eliminates need for external memory in many use cases Advanced Hardware Accelerators Enhanced FIR/IIR offload engines running at Core clock frequency for added processing power Security Crypto Engines with OTPPowerful DMA SystemInnovative Digital Audio Interface (DAI) includes: 8x Full SPORT interfaces w/TDM & I2S modes 2x S/PDIF Rx/Tx, 8 ASRC pairs 4x Precision Clock Generators 24 BuffersOther Peripheral Connectivity / Interfaces: 2x Quad SPI, 1x Octal SPI MLB 3-pin 4x I2C, 2x UARTs 6x General Purpose Timer, 1x General Purpose Counter 2x Watchdog Timers 2-ch 12bit Housekeeping ADCs 22 GPIO pins, 24 DAI pins Thermal SensorPackage 14mm x 14mm 120-lead LQFP_EAdditional Features Security and Protection Crypto hardware accelerators Fast secure boot with IP protection Enhanced FIR and IIR accelerators running up to 1 GHz AEC-Q100 qualified for automotive applications

Up to 800MHz SHARC+ DSP with 640KB L1, 512KB Shared L2 SRAM, 400-Ball CSP_BGA Features:SHARC+ Core infrastructure 600MHz (max) or 800MHz (max) Core clock frequency 640KB on-chip Level 1 (L1) SRAM memory (with parity) increases low latency performance 32-bit, 40-bit & 64-bit floating point support 32-bit fixed point Byte, short-word, word, long-word addressedMemory 512KB on-chip Level 2 (L2) SRAM with ECC protection - eliminates need for external memory in many use cases One Level 3 (L3) interface optimized for low system power, providing 16-bit interface to DDR3 (supporting 1.35 V capable DDR3L devices) SDRAM devices16-bit DDR/DDR3L Memory Controller 1.35V support for DDR3LAdvanced Hardware Accelerators Enhanced FIR/IIR offload engines running at Core clock frequency for added processing power Security Crypto Engines with OTPPowerful DMA SystemInnovative Digital Audio Interface (DAI) includes: 8x Full SPORT interfaces w/TDM & I2S modes 2x S/PDIF Rx/Tx, 8 ASRC pairs 4x Precision Clock Generators 28 BuffersOther Peripheral Connectivity / Interfaces: 2x Quad SPI, 1x Octal SPI MLB 3-pin 6x I2C,3x UARTs 2x Link Ports 10x General Purpose Timer, 1x General Purpose Counter 2x Watchdog Timers 4-ch 12bit Housekeeping ADCs 40 GPIO pins, 28 DAI pins Thermal SensorPackage 17mm x 17mm (0.8mm pitch) 400-ball CSP_BGAAdditional Features Security and Protection Crypto hardware accelerators Fast secure boot with IP protection Enhanced FIR and IIR accelerators running up to 1 GHz AEC-Q100 qualified for automotive applications

15.1 GHz to 32 GHz, Tunable Band-Pass Filter Features:Amplitude settling time: 200 ns typicalWideband rejection: 30 dBSingle chip implementation40-lead, 6 mm 6 mm, RoHS compliant LFCSP

2 GHz to 18 GHz, Digitally Tunable, High-Pass and Low-Pass Filter Features: Digitally tunable, multioctave, high-pass and low-pass tuning Independent 3 dB frequency control for up to 4 GHz of bandwidth Optimal wideband rejection: 35 dB Single chip replacement for discrete filter banks Compact 9 mm × 9 mm, 56-terminal LGA packageENHANCED PRODUCT FEATURES Supports defense and aerospace applications (AQEC standard Military temperature range of −55°C to +105°C Controlled manufacturing baseline One assembly and test site One fabrication site Production change notification Qualification data available on request V62/21604

155/622 Mb/s Clock and Data Recovery IC with Integrated Limiting Amp Features: Meets SONET requirements for jitter transfer/generation/tolerance Quantizer sensitivity: 4 mV typical Adjustable slice level: ±100 mV Patented clock recovery architecture Loss-of-signal detect range: 3 mV to 15 mV Single-reference clock frequency for all rates, including15/14 (7%) wrapper rate Choice of 19.44 MHz, 38.88 MHz, 77.76 MHz, or 155.52 MHz REFCLK REFCLK inputs: LVPECL/LVDS/LVCMOS/LVTTL compatible (LVPECL/LVDS only at 155.52 MHz) Optional 19.44 MHz on-chip oscillator to be used with external crystal Loss-of-lock indicator Loopback mode for high speed test data Output squelch and bypass features Single-supply operation: 3.3 V Low power: 540 mW typical 7 mm × 7 mm, 48-lead LFCSP

5.7 kV RMS/1.5 kV RMS, Quad-Channel LVDS 2.5 Gigabit Isolator (0 Reverse Channels) Features: 5.7 kV rms and 1.5 kV rms LVDS isolators Complies with TIA/EIA-644-A LVDS signal levels Quad-channel configuration Any data rate up to 2.5 Gbps switching with low jitter 10 Gbps total bandwidth across four channels 2.15 ns typical propagation delay Typical jitter: 0.82 ps rms random, 40 ps total peak Lower power 1.8 V supplies ±8 kV IEC 61000-4-2 ESD protection across isolation barrier High common-mode transient immunity: 100 kV/μs typical Safety and regulatory approvals (28-lead SOIC_W_FP package) UL (pending): 5700 V rms for 1 minute per UL 1577 CSA Component Acceptance Notice 5A (pending) VDE certificate of conformity (pending) DIN V VDE V 0884-11 (VDE V 0884-11):2017-01 VIORM = 849 VPEAK (working voltage) Enable or disable refresh (low speed output correctness check) Operating temperature range: −40°C to +125°C 28-lead, wide-body, finer pitch SOIC_W_FP package with 8.3 mm creepage and clearance or 6 mm × 6 mm LFCSP package with 1.27 mm creepage and clearance

5 kV RMS/3.75 kV RMS, Dual LVDS Gigabit Isolator (0 Reverse Channels) Features: 5 kV rms and 3.75 kV rms LVDS isolators Complies with TIA/EIA-644-A LVDS standard Multiple dual-channel configurations Any data rate up to 1.1 Gbps switching with low jitter 4 ns typical propagation delay 2.6 ps rms typical random jitter, rms 90 ps typical peak-to-peak total jitter at 1.1 Gbps 2.5 V or 3.3 V supplies −75 dBc power supply ripple rejection, phase spur level Glitch immunity ±8 kV IEC 61000-4-2 ESD protection across isolation barrier High common-mode transient immunity: >25 kV/μs Passes EN 55022 Class B radiated emissions limits with 1.1 Gbps PRBS Safety and regulatory approvals (20-lead SOIC_W package) UL (pending): 5000 V rms for 1 minute per UL 1577 CSA Component Acceptance Notice 5A (pending) VDE certificate of conformity (pending) DIN V VDE V 0884-10 (VDE V 0884-10):2006-12 VIORM = 424 VPEAK Fail-safe output high for open, short, and terminated input conditions (ADN4655/ADN4656) Operating temperature range: −40°C to +125°C 7.8 mm minimum creepage and clearance

5 kV RMS/3.75 kV RMS, Dual LVDS Gigabit Isolator (Second Channel Reversed) Features: 5 kV rms and 3.75 kV rms LVDS isolators Complies with TIA/EIA-644-A LVDS standard Multiple dual-channel configurations Any data rate up to 1.1 Gbps switching with low jitter 4 ns typical propagation delay 2.6 ps rms typical random jitter, rms 90 ps typical peak-to-peak total jitter at 1.1 Gbps 2.5 V or 3.3 V supplies −75 dBc power supply ripple rejection, phase spur level Glitch immunity ±8 kV IEC 61000-4-2 ESD protection across isolation barrier High common-mode transient immunity: >25 kV/μs Passes EN 55022 Class B radiated emissions limits with 1.1 Gbps PRBS Safety and regulatory approvals (20-lead SOIC_W package) UL (pending): 5000 V rms for 1 minute per UL 1577 CSA Component Acceptance Notice 5A (pending) VDE certificate of conformity (pending) DIN V VDE V 0884-10 (VDE V 0884-10):2006-12 VIORM = 424 VPEAK Fail-safe output high for open, short, and terminated input conditions (ADN4655/ADN4656) Operating temperature range: −40°C to +125°C 7.8 mm minimum creepage and clearance