TE Connectivity 6450170-8

TE Connectivity 6450172-1

641126-8

TE Connectivity 641126-8

TE Connectivity 6450173-1

641124-6

TE Connectivity 641124-6

172052-3

TE Connectivity 172052-3

TE Connectivity 293607-2

TE Connectivity 6450330-1

644886-5

TE Connectivity 644886-5

2-644886-7

TE Connectivity 2-644886-7

Price
RoHS
Lead Status
PCB Mount Orientation Right Angle Right Angle Right Angle Right Angle
Mating & Unmating Configuration Sequencing Sequencing Sequencing Sequencing
Contact Mating Area Plating Thickness 30 .076 .076 .076
Operating Voltage 60 60 300 60
Number of Rows 4 1 4
Housing Color Black Black Black Black
Connector Mounting Type Board Mount Board Mount Board Mount Board Mount
Mating Retention Type Boardlock Boardlock Boardlock
Packaging Method Box Tray Box Tray
Connector & Contact Terminates To Printed Circuit Board Printed Circuit Board Printed Circuit Board Printed Circuit Board
Number of Signal Positions 24 32 24
Number of Power Positions 9 14 3 2
Contact Current Rating (Max) 42 42 42 42
Contact Retention Without Without Without Without
UL Flammability Rating UL 94V-0 UL 94V-0 UL 94V-0 UL 94V-0
Termination Post & Tail Length 3.43 3.43 4.19 4.32
Glow Wire Rating High Temperature Part - Not Glow Wire High Temperature Part - Not Glow Wire High Temperature Part - Not Glow Wire High Temperature Part - Not Glow Wire
Contact Type Socket Socket Socket Pin
Housing Type Receptacle Receptacle Receptacle Plug
Row-to-Row Spacing .1 .1
Underplate Material Thickness 3.43 3.43 4.19 4.32
Centerline (Pitch) 7.62 6.35 7.62 6.35
PCB Mount Retention With With With Without
Connector System Board-to-Board Board-to-Board Board-to-Board Board-to-Board
Product Type Connector Assembly Connector Assembly Connector Assembly Header
Termination Post &Tail Length .135 .135 .165 .17
Number of Positions 33 46 3 26
Contact Mating Area Plating Material Noble Metal Noble Metal Gold Noble Metal
Circuit Application Power & Signal Power & Signal Power & Signal Power & Signal
Termination Method to Printed Circuit Board Through Hole - Solder Through Hole - Solder Through Hole - Solder Through Hole - Solder
Contact Termination Area Plating Material Tin Tin Tin Tin
Housing Material High Temperature Thermoplastic High Temperature Thermoplastic High Temperature Thermoplastic High Temperature Thermoplastic
PCB Mount Retention Type Boardlock Boardlock Boardlock
Board-to-Board Configuration Right Angle Right Angle Right Angle Right Angle
Power Contact Material Tin Tin Tin Tin
Sealable No No No No
Operating Temperature Range -20 – 105 -20 – 105 -20 – 105 -20 – 105