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TE Connectivity
4-640469-2
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TE Connectivity
4-640469-7
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TE Connectivity
5-640470-8
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TE Connectivity
4-640469-5
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TE Connectivity
4-640468-4
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TE Connectivity
3-640468-4
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TE Connectivity
1-6450870-3
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TE Connectivity
103904-6
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TE Connectivity
6600112-2
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TE Connectivity
2-6450122-6
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Price |
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RoHS |
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Lead Status |
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PCB Mount Orientation |
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Right Angle |
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Right Angle |
Right Angle |
Mating & Unmating Configuration |
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Sequencing |
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Contact Mating Area Plating Thickness |
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30 |
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30 |
30 |
Operating Temperature Range |
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-40 – 125 |
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-20 – 105 |
-20 – 105 |
Number of Rows |
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4 |
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4 |
4 |
Number of Power Positions |
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12 |
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3 |
9 |
Housing Color |
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Black |
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Black |
Black |
Connector Mounting Type |
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Board Mount |
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Board Mount |
Board Mount |
Mating Retention Type |
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Boardlock |
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Boardlock |
Connector & Contact Terminates To |
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Printed Circuit Board |
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Printed Circuit Board |
Printed Circuit Board |
Contact Current Rating (Max) |
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42 |
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42 |
42 |
Contact Retention |
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Without |
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Without |
Without |
UL Flammability Rating |
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UL 94V-0 |
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UL 94V-0 |
UL 94V-0 |
Termination Post & Tail Length |
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3.43 |
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5.34 |
2.29 |
Number of Positions |
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28 |
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19 |
101 |
Centerline (Pitch) |
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7.62 |
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7.62 |
2.54 |
Glow Wire Rating |
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High Temperature Part - Not Glow Wire |
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High Temperature Part - Not Glow Wire |
High Temperature Part - Not Glow Wire |
Contact Type |
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Socket |
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Pin |
Pin |
Housing Type |
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Receptacle |
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Plug |
Plug |
Row-to-Row Spacing |
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.1 |
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.1 |
.1 |
Underplate Material Thickness |
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3.43 |
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5.34 |
2.29 |
PCB Mount Retention |
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With |
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Without |
With |
Connector System |
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Board-to-Board |
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Board-to-Board |
Board-to-Board |
Product Type |
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Connector Assembly |
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Header |
Header |
Termination Post &Tail Length |
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.135 |
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.21 |
.09 |
Contact Mating Area Plating Material |
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Noble Metal |
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Noble Metal |
Noble Metal |
Operating Voltage |
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60 |
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60 |
60 |
Circuit Application |
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Power & Signal |
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Power & Signal |
Power & Signal |
Termination Method to Printed Circuit Board |
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Through Hole - Solder |
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Through Hole - Solder |
Through Hole - Solder |
Number of Signal Positions |
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16 |
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16 |
92 |
Contact Termination Area Plating Material |
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Tin |
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Tin |
Tin |
Housing Material |
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High Temperature Thermoplastic |
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High Temperature Thermoplastic |
High Temperature Thermoplastic |
PCB Mount Retention Type |
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Boardlock |
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Boardlock |
Board-to-Board Configuration |
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Right Angle |
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Right Angle |
Right Angle |
Power Contact Material |
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Tin |
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Tin |
Tin |
Sealable |
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No |
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No |
No |
Packaging Method |
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Tray |
Tray |
PCB Thickness (Recommended) |
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1.57 |
Panel Thickness |
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2.29 |
Accepts Wire Insulation Diameter Range |
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3 |