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TLV70133DBVRM3
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TLV70718APDQNR
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TLV709A50DBVR
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TLV9001ZIDPWR
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OPA1677DR
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OPA186DBVR
|
| Price |
|
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| RoHS |
|
Y |
Y |
Y |
Y |
Y |
Y |
Y |
Y |
Y |
Y |
| Lead Status |
|
Y |
Y |
Y |
Y |
Y |
Y |
Y |
Y |
Y |
Y |
| Accuracy(%) |
|
2 |
1.5 |
2 |
|
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|
|
| Dropout voltage (Vdo)(typ)(mV) |
|
400 |
250 |
400 |
|
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|
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| Fixed output options(V) |
|
3.3 |
1,1.1,1.2,1.5,1.8,1.85,1.9,2.5,2.6,2.7,2.8,2.85,2.9,3,3.3,3.4,3.6 |
5 |
|
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|
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| Iout(max)(A) |
|
0.15 |
0.2 |
0.15 |
|
|
|
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|
|
|
| Iq(typ)(mA) |
|
0.003 |
0.025 |
0.003 |
|
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|
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| Load capacitance(min)(F) |
|
0.47 |
0.1 |
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| Maximum package height(mm) |
|
1.45 |
0.4 |
1.45 |
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| Noise(Vrms) |
|
550 |
45 |
425 |
|
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| Operating temperature range(C) |
|
-40 |
-40 |
-40 |
-40 |
-40 |
-40 |
-40 |
-40 |
-40 |
-40 |
| Output options |
|
Fixed Output |
Fixed Output |
Fixed Output |
|
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| PSRR at 100 KHz(dB) |
|
42 |
40 |
60 |
|
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|
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| Package area(mm^2) |
|
8.12 |
1 |
8.12 |
0.64 |
4.2 |
51.9 |
4.2 |
51.9 |
29.4 |
8.12 |
| Package size (L x W)(mm) |
|
2.9 x 2.8 |
1 x 1 |
2.9 x 2.8 |
0.8 x 0.8 |
2 x 2.1 |
8.65 x 6 |
2 x 2.1 |
8.65 x 6 |
4.9 x 6 |
2.9 x 2.8 |
| Package type |
|
SOT-23 |
X2SON |
SOT-23 |
X2SON |
SOT-SC70 |
SOIC |
SOT-SC70 |
SOIC |
SOIC |
SOT-23 |
| Pin count |
|
5 |
4 |
5 |
5 |
5 |
14 |
5 |
14 |
8 |
5 |
| Rating |
|
Catalog |
Catalog |
Catalog |
Catalog |
Catalog |
Catalog |
Catalog |
Catalog |
Catalog |
Catalog |
| Regulated outputs(#) |
|
1 |
1 |
|
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| TI functional safety category |
|
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| Thermal resistance JA(C/W) |
|
297.2 |
208 |
195 |
|
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| Vin(max)(V) |
|
24 |
5.5 |
30 |
|
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|
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| Vin(min)(V) |
|
2.5 |
2 |
2.5 |
|
|
|
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|
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| Vout(max)(V) |
|
3.3 |
3.6 |
28 |
|
|
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|
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| Vout(min)(V) |
|
3 |
1 |
1.2 |
|
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| TI.com inventory |
|
26454 |
164500 |
427181 |
9593 |
12495 |
8500 |
315756 |
8500 |
59345 |
77990 |
| Approx. price(US$) |
|
.171 | 1ku |
.06 | 1ku |
.2 | 1ku |
.104 | 1ku |
.3 | 1ku |
.513 | 1ku |
.3 | 1ku |
.513 | 1ku |
.154 | 1ku |
.45 | 1ku |
| Features |
|
|
Enable,Output discharge |
|
Cost Optimized,EMI Hardened,Shutdown,Small Size |
Fail-safe,POR |
Fail-safe,POR |
Fail-safe,POR |
Fail-safe,POR |
Small Size |
Cost Optimized,EMI Hardened,Zero Drift |
| Architecture |
|
|
|
|
CMOS |
|
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|
CMOS |
CMOS |
| CMRR(typ)(dB) |
|
|
|
|
95 |
|
|
|
|
110 |
134 |
| GBW(typ)(MHz) |
|
|
|
|
1 |
|
|
|
|
16 |
0.75 |
| Input common mode headroom (to negative supply)(typ)(V) |
|
|
|
|
-0.1 |
|
|
|
|
|
-0.1 |
| Input common mode headroom (to positive supply)(typ)(V) |
|
|
|
|
0.1 |
|
|
|
|
|
0.1 |
| Iout(typ)(A) |
|
|
|
|
0.04 |
|
|
|
|
0.05 |
|
| Iq per channel(typ)(mA) |
|
|
|
|
0.06 |
0.016 |
0.016 |
0.016 |
0.016 |
2 |
0.09 |
| Number of channels |
|
|
|
|
1 |
1 |
4 |
1 |
4 |
1 |
1 |
| Offset drift(typ)(V/C) |
|
|
|
|
0.6 |
|
|
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|
2 |
| Output swing headroom (to negative supply)(typ)(V) |
|
|
|
|
0.01 |
|
|
|
|
|
0.06 |
| Output swing headroom (to positive supply)(typ)(V) |
|
|
|
|
-0.01 |
|
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|
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| Rail-to-rail |
|
|
|
|
In,Out |
In |
In |
In |
In |
Out |
In,Out |
| Slew rate(typ)(V/s) |
|
|
|
|
2 |
|
|
|
|
9 |
0.35 |
| TI package name |
|
|
|
|
DPW |
|
|
|
|
D |
DBV |
| Total supply voltage (+5 V = 5, 5 V = 10)(max)(V) |
|
|
|
|
5.5 |
|
|
|
|
36 |
|
| Total supply voltage (+5 V = 5, 5 V = 10)(min)(V) |
|
|
|
|
1.8 |
|
|
|
|
4.5 |
|
| Vn at 1 kHz(typ)(nVHz) |
|
|
|
|
30 |
|
|
|
|
4.5 |
38 |
| Vos (offset voltage at 25C)(max)(mV) |
|
|
|
|
1.6 |
1.5 |
1.5 |
1.5 |
1.5 |
2 |
0.01 |
| Input bias current ()(max)(nA) |
|
|
|
|
|
0.005 |
0.005 |
0.005 |
0.005 |
|
|
| Output type |
|
|
|
|
|
Open-collector,Open-drain |
Open-collector,Open-drain |
Push-Pull |
Push-Pull |
|
|
| Propagation delay time(s) |
|
|
|
|
|
0.1 |
0.1 |
0.1 |
0.1 |
|
|
| VICR(max)(V) |
|
|
|
|
|
5.5 |
5.5 |
5.5 |
5.5 |
|
|
| VICR(min)(V) |
|
|
|
|
|
0 |
0 |
0 |
0 |
|
|
| Vs(max)(V) |
|
|
|
|
|
5.5 |
5.5 |
5.5 |
5.5 |
|
|
| Vs(min)(V) |
|
|
|
|
|
1.65 |
1.65 |
1.65 |
1.65 |
|
|
| THD + N at 1 kHz(typ)(%) |
|
|
|
|
|
|
|
|
|
0.0001 |
|
| Input bias current(max)(pA) |
|
|
|
|
|
|
|
|
|
|
600 |