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Harwin
M50-1920005
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TE Connectivity
5-192039-4
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TE Connectivity
1-192046-6
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TE Connectivity
1551920-2
|
onsemi
LB1920-E
|
Molex
0192050010
|
Amphenol
91920-21131LF
|
Weidmüller
1781920000
|
onsemi
LB11920
|
Maxim Integrated
MAX1920EUT+T
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| Price |
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| RoHS |
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Compliant |
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Yes |
Compliant |
Compliant |
Compliant |
Not Compliant |
Compliant |
| Lead Status |
|
No |
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Yes |
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No |
No |
Yes |
No |
| Material |
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Beryllium Copper |
Beryllium Copper |
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| Product Type |
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Contact |
Contact |
Connector |
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| Centerline (Pitch) |
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|
.8 |
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| Packaging Method |
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Tape |
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| Form Factor |
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zQSFP+ |
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| Termination Method to Printed Circuit Board |
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Surface Mount |
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| PCB Thickness (Recommended) |
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.057 |
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| Connector Mounting Type |
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Board Mount |
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| Connector & Contact Terminates To |
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Printed Circuit Board |
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| Connector System |
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Cable-to-Board |
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| Operating Temperature Range |
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-40 – 85 |
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| PCB Contact Termination Area Plating Material |
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Tin |
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| Contact Mating Area Plating Thickness |
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30 |
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| Included Heat Sink |
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No |
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| Contact Current Rating (Max) |
|
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|
.5 |
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| Contact Mating Area Plating Material |
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Gold |
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| Circuit Application |
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Signal |
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| Number of Positions |
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38 |
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| UL Flammability Rating |
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UL 94V-0 |
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| Data Rate (Max) |
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25 |
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| Sealable |
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No |
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