Dual 12-Bit nanoDAC+ with 2 ppm/C Reference, I2C Interface Features: Low drift 2.5 V reference: 2 ppm/°C typical Tiny package: 3 mm × 3 mm, 16-lead LFCSP Total unadjusted error (TUE): ±0.1% of full-scale range (FSR) maximum Offset error: ±1.5 mV maximum Gain error: ±0.1% of FSR maximum High drive capability: 20 mA, 0.5 V from supply rails User selectable gain of 1 or 2 (GAIN pin) Reset to zero scale or midscale (RSTSEL pin) 1.8 V logic compatibility Low glitch: 0.5 nV-sec 400 kHz I2C-compatible serial interface Low power: 3.3 mW at 3 V 2.7 V to 5.5 V power supply −40°C to +105°C temperature range

Single-Channel, 16-Bit Current and Voltage Output DAC with Dynamic Power Control and HART Connectivity Features: 16-bit resolution and monotonicity DPC for thermal management Current/voltage output available on a single terminal Current output ranges: 0 mA to 20 mA, 4 mA to 20 mA, 0 mA to 24 mA, ±20 mA, ±24 mA, −1 mA to +22 mA Voltage output ranges (with 20% overrange): 0 V to 5 V, 0 V to 10 V, ±5 V, and ±10 V User-programmable offset and gain Advanced on-chip diagnostics, including a 12-bit ADC On-chip reference Robust architecture, including output fault protection EMC test standards: IEC 61000-4-6 conducted immunity (10 V, Class A) IEC 61000-4-3 radiated immunity (20 V/m, Class A) IEC 61000-4-2 ESD (±6 kV contact, Class B) IEC 61000-4-4 electrical fast transient (EFT) (±4 kV, Class B) IEC 61000-4-5 surge (±4 kV, Class B) 32-lead, 5 mm × 5 mm LFCSP −40°C to +115°C temperature range

4-Channel, I2C, Ultralow Power 12-Bit ADC in 20-Lead LFCSP/TSSOP Features: I2C-compatible serial interface supports standard and fast modes Ultralow power: 90 μW typical at 3 V in fast mode Specified for VDD of 2.7 V to 5.25 V On-chip accurate 2.5 V reference, 5 ppm/°C typical drift 4 single-ended analog input channels ALERT function BUSY function Autocycle mode Wide input bandwidth 68 dB signal-to-noise ratio (SNR) typical at input frequency of 1 kHz Flexible power/throughput rate management No pipeline delays Power-down mode 550 nA typical at VDD = 5.25 V 435 nA typical at VDD = 3 V 20-lead LFCSP and TSSOP packages Temperature range: −40°C to +125°C

4-Channel 200 kSPS, 12-Bit A/D Converter with Sequencer in 16-Lead TSSOP Features: Fast throughput rate: 200 kSPS Specified for AVDD of 2.7 V to 5.25 V Low power 3.6 mW max at 200 kSPS with 3 V supply 7.5 mW max at 200 kSPS with 5 V supply 4 (single-ended) inputs with sequencer Wide input bandwidth 70 dB Min SNR at 50 kHz input frequency Flexible power/serial clock speed management No pipeline delays High speed serial interface SPI® -/QSPI™-/ MICROWIRE™-/DSP-compatible Shutdown mode: 0.5 μA max 16-lead TSSOP package Qualified for automotive applicationsAD7923-EP supports defense and aerospace applications (AQEC standard) Download AD7923-EP data sheet (pdf) Military temperature range (−55°C to +125°C) Controlled manufacturing baseline One assembly/test site One fabrication site Product change notification Qualification data available on request V62/12647 DSCC Drawing Number

250 kSPS, 12- Bit ADC in 6 Lead SC70 Features: Throughput Rate: 250 kSPS Specified for VDD of 2.35 V to 5.25 V Low Power: 3 mW typ at 250 KSPS with 3 V Supplies 12.5 mW typ at 250 KSPS with 5 V Supplies Wide Input Bandwidth: 70 dB SNR at 100 kHz Input Frequency No Pipeline Delays Flexible Power/Serial Clock Speed Management High Speed Serial Interface SPI®/QSPI™/MICROWIRE™/DSP Compatible Standby Mode: 1 µA max 6-Lead SC70 Package 8-Lead µSOIC Package

Dual, 16-Bit, 2.8 GSPS, TxDAC+ Digital-to-Analog Converter Features: Support input data rate >2 GSPS Proprietary low spurious and distortion design SFDR = 82 dBc at dc IF, −9 dBFS Flexible 8-lane JESD204B interface Multiple chip synchronization Fixed latency Data generator latency compensation Selectable 1×, 2×, 4×, or 8× interpolation filter Low power architecture Transmit enable function allows extra power saving and instant control of the output status High performance, low noise phase-locked loop (PLL) clock multiplier Digital inverse sinc filter Low power: 1.42 W at 1.6 GSPS full operating conditions 88-lead LFCSP with exposed pad

Quad, 16-Bit, 2.4 GSPS, TxDAC+ Digital-to-Analog Converter Features: Supports input data rates up to 1 GSPS Proprietary, low spurious and distortion design Single carrier LTE 20 MHz bandwidth (BW), ACLR = 77 dBc at 180 MHz IF Six carrier GSM IMD = 78 dBc, 600 kHz carrier spacing at 180 MHz IF SFDR = 72 dBc at 180 MHz IF, −6 dBFS single tone Flexible 8-lane JESD204B interface Multiple chip synchronization Fixed latency Data generator latency compensation Input signal power detection High performance, low noise phase-locked loop (PLL) clock multiplier Digital inverse sinc filter Digital quadrature modulation using a numerically controlled oscillator (NCO) Nyquist band selection—mix mode Selectable 1×, 2×, 4×, and 8× interpolation filters Low power: 2.11 W at 1.6 GSPS, full operating conditions 88-lead, exposed pad LFCSP

DC to 9 GHz, Vector Signal Generator Features: DC-coupled, 50 matched output Up to 4.3 dBm output power, 9.5 dBm at 9 GHz DAC core update rate: 12.0 GSPS (guaranteed minimum) in 2 NRZ mode Wide analog bandwidth DC to 9.0 GHz in 2 NRZ mode (12.0 GSPS DAC update rate) 1.0 GHz to 8.0 GHz in mix mode (6.0 GSPS DAC update rate) DC to 4.5 GHz in NRZ mode (6.0 GSPS DAC update rate) Power dissipation of 4.88 W in 2 NRZ mode (10 GSPS DAC update rate) Bypassable datapath interpolation 2, 3, 4, 6, 8, 12, 16, 24 Instantaneous (complex) signal bandwidth 2.25 GHz with device clock at 5 GHz (2 interpolation) 1.8 GHz with device clock at 6 GHz (3 interpolation) Fast frequency hopping Integrated biCMOS buffer amplifier

Dual, 16-Bit, 12.6 GSPS RF DAC with Channelizers Features: Supports multiband wireless applications 3 bypassable, complex data input channels per RF DAC 1.54 GSPS maximum complex input data rate per input channel 1 independent NCO per input channel Proprietary, low spurious and distortion design 2-tone IMD = −83 dBc at 1.8 GHz, −7 dBFS/tone RF output SFDR < −80 dBc at 1.8 GHz, −7 dBFS RF output Flexible 8-lane, 15.4 Gbps JESD204B interface Supports single-band and multiband use cases Supports 12-bit high density mode for increased data throughput Multiple chip synchronization Supports JESD204B Subclass 1 Selectable interpolation filter for a complete set of input data rates 1×, 2×, 3×, 4×, 6×, and 8× configurable data channel interpolation 1×, 2×, 4×, 6×, 8×, and 12× configurable final interpolation Final 48-bit NCO that operates at the DAC rate to support frequency synthesis up to 6 GHz Transmit enable function allows extra power saving and downstream circuitry protection High performance, low noise PLL clock multiplier Supports 12.6 GSPS DAC update rate Observation ADC clock driver with selectable divide ratios Low power 2.55 W at 12 GSPS, dual channel mode 10 mm × 10 mm, 144-ball BGA_ED with metal enhanced thermal lid, 0.80 mm pitch

Dual, 16-Bit, 12.6 GSPS RF DAC and Direct Digital Synthesizer Features: Supports multiband wireless applications 3 bypassable, complex data input channels per RF DAC 3.08 GSPS maximum complex input data rate per input channel 1 independent NCO per input channel Proprietary, low spurious and distortion design 2-tone IMD3 = −83 dBc at 1.84 GHz, −7 dBFS/tone RF output SFDR <−80 dBc at 1.84 GHz, −7 dBFS RF output Flexible 8-lane, 15.4 Gbps JESD204B interface Supports single-band and multiband use cases Supports 12-bit high density mode for increased data throughput Multiple chip synchronization Supports JESD204B Subclass 1 Selectable interpolation filter for a complete set of input data rates 1×, 2×, 3×, 4×, 6×, and 8× configurable data channel interpolation 1×, 2×, 4×, 6×, 8×, and 12× configurable final interpolation Final 48-bit NCO that operates at the DAC rate to support frequency synthesis up to 6 GHz Transmit enable function allows extra power saving and downstream circuitry protection High performance, low noise PLL clock multiplier Supports 12.6 GSPS DAC update rate Observation ADC clock driver with selectable divide ratios Low power 2.54 W with 2 DACs at 12 GSPS, DAC PLL on 10 mm × 10 mm, 144-ball BGA_ED with metal enhanced thermal lid, 0.80 mm pitch