5 KV rms Isolated Precision Half-Bridge Driver, 4 A Output Features: 4 A peak output current Working voltage High-side or low-side relative to input: 537 V peak High-side to low-side differential: 800 V peak High frequency operation: 1 MHz maximum  3.3 V to 5 V CMOS input logic 4.5 V to 18 V output drive  UVLO at 2.5 V VDD1 ADuM3223A/ADuM4223A UVLO at 4.1 V VDD2 ADuM3223B/ADuM4223B UVLO at 7.0 V VDD2 ADuM3223C/ADuM4223C UVLO at 11.0 V VDD2 Precise timing characteristics  54 ns maximum isolator and driver propagation delay 5 ns maximum channel-to-channel matching CMOS input logic levels  High common-mode transient immunity:>25 kV/μs Enhanced system-level ESD performance per IEC 61000-4-x  High junction temperature operation: 125°C  Thermal shutdown protection  Default low output Safety and regulatory approvals ADuM4223 wide-body, 16-lead SOIC UL recognition per UL 1577  5000 V rms for 1 minute SOIC long package  CSA Component Acceptance Notice 5A  VDE certificate of conformity  DIN V VDE V 0884-10 (VDE V 0884-10):2006-12 VIORM = 849 V peak  Qualified for automotive applications

Dual-Channel Isolators with Integrated DC-to-DC Converter (1/1 channel directionality) Features: isoPower® integrated isolated DC/DC converter Regulated 3V or 5V output Up to 500 mW output power 16-lead SOIC package with 7.6 mm creepage Dual dc-to-25 Mbps (NRZ) signal isolation channels High temperature operation: 105°C maximum High common-mode transient immunity: > 25 kV/µsSafety and regulatory approvals UL recognition 2500 V rms for 1 minute per UL 1577 VDE cert of conformity (pending) IEC 60747-5-2 (VDE V 0884-10):2006-12 VIORM = 560 VPEAK See data sheet for additional features

Digital PAL/NTSC Video Encoder with 10-Bit SSAF and Advanced Power Management Features: ITU-R BT601/656 YCrCb to PAL/NTSC Video Encoder High Quality 10-Bit Video DACs SSAF (Super Sub-Alias Filter) Advanced Power Management Features CGMS (Copy Generation Management System) WSS (Wide Screen Signalling) Simultaneous Y, U, V, C Output Format NTSC-M, PAL-M/N, PAL-B/D/G/H/I, PAL-60 Single 27 MHz Clock Required (x2 Oversampling) 80 dB Video SNR 32-Bit Direct Digital Synthesizer for Color Subcarrier

A2B Main 4xPDM XCVR wI2S/TDM Features:A2B BUS FEATURES Line topology Single main node, multiple subordinate nodes Up to 15 m between nodes and up to 40 m overall cable length Communication over distance Synchronous data Multichannel I2S/TDM to I2S/TDM Synchronous clock, phase aligned in all nodes Low latency node to node communication Control and status information I2C to I2C GPIO and interrupt Bus power or local power subordinate nodes Configurable with SigmaStudio/SigmaStudio+ graphical software tool AEC-Q100 qualified for automotive applicationsA2B TRANSCEIVER FEATURES Configurable A2B bus main node or subordinate node Programmable via I2C interface 8-bit to 32-bit multichannel I2S/TDM interface Programmable I2S/TDM data rate Up to 32 upstream and 32 downstream channels PDM interface Programmable PDM clock rate Up to 4 high dynamic range microphone inputs Simultaneous reception of I2S data with up to 4 PDM microphones Unique ID register for each transceiver Crossover or straight-through cabling Programmable settings to optimize EMC performance

Up to 1 GHz Dual-SHARC+ DSP w/ Integrated Arm Cortex-A5 Features:SHARC+ Core Infrastructure 800 MHz (max) or 1 GHz (max) Core clock frequency 2x 640KB on-chip Level 1 (L1) SRAM memory (with parity) increases low latency performance 32-bit, 40-bit & 64-bit floating point support 32-bit fixed point Byte, short-word, word, long-word addressedArm Core Infrastructure: 1 GHz Arm Cortex-A5 (with Neon/FPU) 32 kByte/32 kByte L1 Instr./Data Cache 256 kByte L2 CacheMemory 2048 KB on-chip Level 2 (L2) SRAM with ECC protection - eliminates need for external memory in many use cases Level 3 (L3) interface optimized for low system power, providing 16-bit interface to DDR3 (supporting 1.35 V capable DDR3L devices)16-bit DDR/DDR3L Memory Controller 1.35V support for DDR3LAdvanced Hardware Accelerators Enhanced FIR/IIR offload engines running at Core clock frequency for added processing power Security Crypto Engines with OTPPowerful DMA SystemInnovative Digital Audio Interface (DAI) includes: 8x Full SPORT interfaces w/TDM & I2S modes 2x S/PDIF Rx/Tx, 8 ASRC pairs 8x Precision Clock Generators 2x 4-channel PDM Mic Inputs 40 BuffersOther Peripheral Connectivity / Interfaces: 2x Quad SPI, 1x Octal SPI MLB 3-pin / 6-pin 6x I2C,3x UARTs 2x Link Ports 16x General Purpose Timer, 1x General Purpose Counter 3x Watchdog Timers ePPI USB 2.0 HS OTG Controller 10/100 EMAC 10/100/1000 EMAC w/AVB and 1588 2x CAN FD 8-ch 12bit Housekeeping ADC 135 GPIO pins, 40 DAI pins Thermal SensorPackage 17mm x 17mm (0.8mm pitch) 400-ball FCBGAAdditional Features Security and Protection Crypto hardware accelerators Fast secure boot with IP protection Enhanced FIR and IIR accelerators running up to 1 GHz AEC-Q100 qualified for automotive applications

9 GHz to 12 GHz, GaAs, MMIC, I/Q Downconverter Features: Conversion gain: 11 dB (typical) at IFOUT = 100 MHz Image rejection: 25 dB (typical) at IFOUT = 100 MHz LO to RF isolation: 46 dB (typical) LO to IF isolation: 26 dB (typical) IF output frequency: dc to 3.5 GHz 32-lead, 4.9 mm × 4.9 mm ceramic leadless chip carrier

5.6 GHz to 8.6 GHz, GaAs, MMIC, I/Q Downconverter Features: Conversion gain: 13 dB typical Image rejection: 32 dBc typical Input P1dB compression: −6 dBm typical Input IP3: 3 dBm typical, 6.0 GHz to 8.6 GHz Noise figure: 2 dB typical LO to RF isolation: 48 dBm typical LO to IF isolation: 13 dBm typical RF to IF isolation: 10 dBm typical Amplitude balance: 0.2 dB typical Phase balance: −2° typical RF return loss: 10 dB typical LO return loss: 15 dB typical IF return loss: 15 dB typical Exposed paddle, 4 mm × 4 mm, 24-lead, LFCSP

5.6 GHz to 8.6 GHz, GaAs, MMIC, I/Q Downconverter Features: Conversion gain: 13 dB typical Image rejection: 32 dBc typical Input P1dB compression: −6 dBm typical Input IP3: 3 dBm typical, 6.0 GHz to 8.6 GHz Noise figure: 2 dB typical LO to RF isolation: 48 dBm typical LO to IF isolation: 13 dBm typical RF to IF isolation: 10 dBm typical Amplitude balance: 0.2 dB typical Phase balance: −2° typical RF return loss: 10 dB typical LO return loss: 15 dB typical IF return loss: 15 dB typical Exposed paddle, 4 mm × 4 mm, 24-lead, LFCSP

16-Bit, 15 MSPS, Module Data Acquisition Solution Features: Integrated fully differential ADC driver with signal scaling Wide input common range High common-mode rejection Single-ended to differential conversion 2.048 V input range with 4.096 V REFBUF Critical passive components 0.005% precision matched resistor array for FDA 9 mm × 9 mm, 0.8 mm pitch, 100-ball BGA package 4× footprint reduction versus discrete solution Low power, dynamic power scaling, power-down mode 143 mW typical at 15 MSPS Throughput: 15 MSPS, no pipeline delay INL: 0.4 LSB typical, 1 LSB maximum SINAD: 89 dB typical at 1 kHz THD: 115 dB at 1 kHz, 106 dB at 400 kHz Gain error: 0.005% FS typical Gain error drift: 1 ppm/C maximum On-board reference buffer with VCMO generation Serial LVDS interface Wide operating temperature range: 40C to +85C

SigmaDSP Digital Audio Processor Features: Qualified for automotive applications Fully programmable audio DSP for enhanced sound processing Features SigmaStudio, a proprietary graphical programming tool for the development of custom signal flows Clock oscillator for generating master clock from crystal Up to 294.912 MHz, 32-bit SigmaDSP core at 1.2 V Up to 6144 SIMD instructions per sample at 48 kHz Up to 40 kWords of parameter/data RAM Up to 800 ms digital audio delay pool at 48 kHz Audio input/output and routing 4 serial input ports, 4 serial output ports 48-channel, 32-bit digital input/output up to a sample rate of 192 kHz Flexible configuration for TDM, I2S, left and right justified formats, and PCM Up to 8 stereo ASRCs from 1:8 up to 7.75:1 ratio and 139 dB DNR Stereo S/PDIF input and output Four PDM microphone input channels Multichannel, byte addressable, TDM serial ports Integer PLL and flexible clock generators Integrated die temperature sensor