ANALOG DEVELOPMENT KIT ACCESSORIES;

3-Axis, 0.5 g/1 g/2 g/4 g Digital Accelerometer Features: Ultralow power (scales automatically with data rate) As low as 30 μA in measurement mode (VS = 3.3 V) As low as 0.1 μA in standby mode (VS = 3.3 V) Low noise performance 150 μg/√Hz typical for X- and Y-axes 250 μg/√Hz typical for the Z-axis Embedded, patent pending FIFO technology minimizes host processor load User-selectable resolution Fixed 10-bit resolution for any g range Fixed 1024 LSB/g sensitivity for any g range Resolution scales from 10-bit at ±0.5 g to 13-bit at ±4 g Built-in motion detection functions for activity/inactivity monitoring Supply and I/O voltage range: 2.0 V to 3.6 V See data sheet for additional features

3-Axis 1g/2g/4g/8g Digital Accelerometer Features: Excellent Zero-g bias accuracy and stability with minimum/maximum specifications User-selectable resolution Fixed 10-bit resolution Full resolution, where resolution increases with g range, up to 13-bit resolution at ±8 g (maintains 2 mg/LSB scale factor in all g ranges) Embedded, 32-level FIFO buffer minimizes host processor load Tap/double tap detection and free-fall detection Activity/inactivity monitoring Supply voltage range: 2.0 V to 3.6 V I/O voltage range: 1.7 V to VS See data sheet for additional features

Low Noise, Low Drift, Low Power, 3-Axis MEMS Accelerometers Features: Hermetic package offers excellent long-term stability 0 g offset vs. temperature (all axes): 0.15 mg/°C maximum Ultralow noise density (all axes): 22.5µg/√Hz Low power, VSUPPLY (LDO regulator enabled) ADXL354 in measurement mode: 150 μA ADXL355 in measurement mode: 200 μA ADXL354/ADXL355 in standby mode: 21 μA ADXL354 has user adjustable analog output bandwidth Electromechanical self test Integrated temperature sensor ADXL355 digital output features Digital SPI and I2C interfaces supported 20-bit ADC Data interpolation routine for synchronous sampling Programmable high- and low-pass digital filters Voltage range options VSUPPLY with internal regulators: 2.25 V to 3.6 V V1P8ANA, V1P8DIG with internal LDO regulator bypassed: 1.8 V typical ± 10% Operating temperature range: −40°C to +125°C 14-terminal, 6 mm × 5.6 mm × 2.2 mm, LCC package

Micropower 3-Sensor Combination Including Acceleration and Temperature Features: All sensors sampled synchronously Up to 400 Hz ODR Samples can be synchronized to external trigger Ultralow power 1.95 A at 100 Hz ODR, 2.0 V supply, all sensors on 270 nA at 6 Hz motion activated wake-up mode 10 nA standby current 12-bit resolution for all sensors Acceleration scale factor down to 1 mg/LSB Temperature scale factor: 0.065C/LSB (typical) Built-in features for motion-based system level power savings Adjustable threshold sleep/wake modes for motion activation Accelerometer, temperature sensor, and provision for third analog sensor input Autonomous interrupt processing, without need for microcontroller intervention, to allow the rest of the system to be turned off completely Deep embedded FIFO minimizes host processor load Awake state output enables implementation of standalone, motion activated switch Wide supply and I/O voltage ranges: 1.6 V to 3.5 VOperates off 1.8 V to 3.3 V railsPower can be derived from coin cell batterySPI digital interfaceSmall and thin 3 mm 3.25 mm 1.06 mm package

Micropower 3-Sensor Combination Including Acceleration and Temperature Features: All sensors sampled synchronously Up to 400 Hz ODR Samples can be synchronized to external trigger Ultralow power 1.95 A at 100 Hz ODR, 2.0 V supply, all sensors on 270 nA at 6 Hz motion activated wake-up mode 10 nA standby current 12-bit resolution for all sensors Acceleration scale factor down to 1 mg/LSB Temperature scale factor: 0.065C/LSB (typical) Built-in features for motion-based system level power savings Adjustable threshold sleep/wake modes for motion activation Accelerometer, temperature sensor, and provision for third analog sensor input Autonomous interrupt processing, without need for microcontroller intervention, to allow the rest of the system to be turned off completely Deep embedded FIFO minimizes host processor load Awake state output enables implementation of standalone, motion activated switch Wide supply and I/O voltage ranges: 1.6 V to 3.5 VOperates off 1.8 V to 3.3 V railsPower can be derived from coin cell batterySPI digital interfaceSmall and thin 3 mm 3.25 mm 1.06 mm package

Micropower, 3-Axis, 200 g Digital Output, MEMS Accelerometer Features: ±200 g measurement range 160 Hz to 2560 Hz user selectable bandwidth with four-pole antialiasing filter Selectable oversampling ratio Adjustable high-pass filter Ultra low power Power can be derived from a coin cell battery 28 µA at 2560 Hz ODR, 3.3 V supply Low power, wake-up mode for low g activity detection 1.7 A instant on mode with adjustable threshold Built in features for system level power savings Autonomous interrupt processing without processor intervention Ultra low power event monitoring detects impacts and wakes up fast enough to capture the transient events Adjustable, low g threshold activity and inactivity detection Wide operating voltage range: 2.5 V to 3.5 V Acceleration sample synchronization via external trigger SPI digital interface and I2C interface format support 12-bit output at 100 mg/LSB scale factor Wide temperature range: 40°C to +105°C Small, thin, 3 mm × 3.25 mm × 1.06 mm package

Ultralow noise, dual-axis MEMS Gyroscope for Stabilization Applications Features: Pitch and roll rate gyroscope Ultralow noise: 0.004°/s/√Hz High vibration rejection over a wide frequency range Power saving standby mode 80 µA current consumption in standby mode Fast startup time from standby mode: <100 ms Low delay of <0.5 ms for a 30 Hz input at the widest bandwidth setting Serial peripheral interface (SPI) digital output Programmable high-pass and low-pass filters 2000 g powered acceleration survivability 2.7 V to 5.0 V operation −25°C to +85°C operation 4.5 mm × 5.8 mm × 1.2 mm cavity laminate package

Integrated AMR Angle Sensor and Signal Conditioner with Differential Outputs Features: Contactless angular measurement High precision 180° angle sensor Typical angular error of ±0.1° Low output noise of 850 μV rms Sine and cosine differential outputs Ratiometric analog voltage outputs Negligible hysteresis SAR or Σ-Δ ADC compatible Temperature compensated AMR bridge Industrial temperature range: −40°C to +125°C Automotive temperature range: −40°C to +150°C EMI resistant Fault diagnostics VDD from 2.7 V to 5.5 V Minimal phase error of 0.85° at 30,000 rpm AEC-Q100 qualified for automotive applications Single chip solution Available in an 8-lead SOIC package

The ADXL346 is a small, thin, ultralow power, 3-axis accelerometer with high resolution (13-bit) measurement at up to ±16g. Digital output data is formatted as 16-bit twos complement and is accessible through either an SPI (3- or 4-wire) or I2C® digital interface.The ADXL346 is well suited for mobile device applications. It measures the static acceleration of gravity in tilt-sensing applications, as well as dynamic acceleration resulting from motion or shock. Its high resolution (4 mg/LSB) enables measurement of inclination changes of less than 1.0°.Several special sensing functions are provided. Activity and inactivity sensing detect the presence or lack of motion by comparing the acceleration on any axis with user-set thresholds. Tap sensing detects single and double taps in any direction. Free-fall sensing detects if the device is falling. Orientation detection is capable of concurrent four- and six-position sensing and a user-selectable interrupt on orientation change for 2D or 3D applications. These functions can be mapped individually to either of two interrupt output pins. An integrated, patent pending memory management system with 32-level first in, first out (FIFO) buffer can be used to store data to minimize host processor activity and lower overall system power consumption.Low power modes enable intelligent motion-based power management with threshold sensing and active acceleration measurement at extremely low power dissipation.The ADXL346 is supplied in a small, thin, 3 mm × 3 mm × 0.95 mm, 16-lead, plastic package.APPLICATIONS Handsets Medical instrumentation Gaming and pointing devices Industrial instrumentation Personal navigation devices Hard disk drive (HDD) protection