High-Performance 32-bit Floating-Point SHARC Processor for General Purpose Applications Features: 400MHz SIMD SHARC Core, capable of 2.4 GFLOPS peak performance 2Mbits SRAM; 6 Mbits customer-definable ROM High bandwidth, 32-bit external memory interface supporting glue-less interface to SDRAM, SRAM, and FLASH Digital Audio Interface (DAI) enabling user-definable access to system peripherals including 8 serial ports (SPORTs), S/PDIF Tx/Rx, 8-channel asynchronous sample rate converter, and 4 precision clock generators. Digital Peripheral Interface (DPI) enabling user-definable access to system peripherals including 2 SPI-compatible ports, 2 UARTs, 3 full-featured timers, and a two-wire interface compliant to the I2C standard. 34 zero-overhead DMA channels 16 Pulse Width Modulation (PWM) channels 208-lead LQFP-EP and 256-ball SBGA packages Commercial and industrial temperature ranges Maximum core performance is reduced for LQFP package

Low Power 200MHz Blackfin+ Embedded Processor with 128KByte L2 SRAM Features: Blackfin+ core with up to 200 MHz performance Dual 16-bit or single 32-bit MAC support per cycle 16-bit complex MAC and many other instruction set enhancements Instruction set compatible with previous Blackfin product On-Chip Memory 136KB L1 SRAM with multi-parity-bit protection (64KB instruction, 64KB data, 8KB scratchpad) 128KByte on-chip L2 SRAM with ECC protection 512KByte On-chip L2 ROM Key Peripherals include USB2.0 HS OTG 2x CAN2.0B ePPI Video I/O 2x SPORTs (w/I2S) 2xQuad-SPI / 1xDual-SPI (w/ Host mode option) I2C 2xUART SD/SDIO/MMC (4-bit) Security and one-time-programmable memory Crypto hardware accelerators for fast secure boot/IP protection memDMA encryption/decryption for fast run-time security Low-cost packaging 88-Lead LFCSP (QFN) package (12 mm × 12mm), RoHS compliant Low system power with < 53 mW at 200 MHz at 25°C TJUNCTION

Low Power 200MHz Blackfin+ Embedded Processor with 128KByte L2 SRAM & DDR2/LPDDR Interface Features: Blackfin+ core with up to 200 MHz performance Dual 16-bit or single 32-bit MAC support per cycle 16-bit complex MAC and many other instruction set enhancements Instruction set compatible with previous Blackfin product On-Chip Memory 136KB L1 SRAM with multi-parity-bit protection (64KB instruction, 64KB data, 8KB scratchpad) 128KByte on-chip L2 SRAM with ECC protection 512KByte On-chip L2 ROM L3 interface providing 16-bit interface to DDR2 or LPDDR SDRAM devices (up to 200 MHz) Key Peripherals include USB2.0 HS OTG 2x CAN2.0B ePPI Video I/O 2x SPORTs (w/I2S) 2xQuad-SPI / 1xDual-SPI (w/ Host mode option) I2C 2xUART SD/SDIO/MMC (8-bit) 4-ch 12-bit 1MSPS ADC Security and one-time-programmable memory Crypto hardware accelerators for fast secure boot/IP protection memDMA encryption/decryption for fast run-time security Low-cost packaging 184-Ball CSP_BGA package (12 mm × 12mm × 0.8mm pitch), RoHS compliant Low system power with < 53 mW at 200 MHz at 25°C TJUNCTION

Low Power 400MHz Blackfin+ Embedded Processor with 256KByte L2 SRAM & DDR2/LPDDR Interface Features: Blackfin+ core with up to 400 MHz performance Dual 16-bit or single 32-bit MAC support per cycle 16-bit complex MAC and many other instruction set enhancements Instruction set compatible with previous Blackfin product On-Chip Memory 136KB L1 SRAM with multi-parity-bit protection (64KB instruction, 64KB data, 8KB scratchpad) 256KByte on-chip L2 SRAM with ECC protection 512KByte On-chip L2 ROM L3 interface providing 16-bit interface to DDR2 or LPDDR SDRAM devices (up to 200 MHz) Key Peripherals include USB2.0 HS OTG 2x CAN2.0B ePPI Video I/O 2x SPORTs (w/I2S) 2xQuad-SPI / 1xDual-SPI (w/ Host mode option) I2C 2xUART SD/SDIO/MMC (8-bit) 4-ch 12-bit 1MSPS ADC Security and one-time-programmable memory Crypto hardware accelerators for fast secure boot/IP protection memDMA encryption/decryption for fast run-time security Low-cost packaging 184-Ball CSP_BGA package (12 mm × 12mm × 0.8mm pitch), RoHS compliant Low system power with < 100 mW at 400 MHz (< 0.25 mW/MHz) at 25°C TJUNCTION

Configurable Impedance Network Analyzer & Potentiostat with Integrated Cortex M3 Core Features: Analog performance 160 kSPS, 16-bit, precision analog-to-digital converter (ADC) 4 dedicated voltage measurement channels 8 current measurement channels Impedance measurement engine High precision voltage reference Supply noise rejection filtering Ultralow leakage configurable switch matrix 12-bit digital-to-analog converter (DAC) Precision instrumentation amplifier control loop 6-channel CapTouch controller Temperature sensor Analog hardware accelerators Autonomous analog front-end (AFE) controller Independent sequencer for AFE functions Direct digital synthesizer (DDS)/arbitrary waveform generator Receive filters Complex impedance measurement (DFT) engine Processing 16 MHz ARM Cortex-M3 processor 384 kB of embedded flash memory 32 kB system SRAM 16 kB Flash configured EEPROM Integrated full-speed USB 2.0 controller and PHY Multilayer advanced microcontroller bus architecture (AMBA) bus matrix Central direct memory access (DMA) controller Real-time clock (RTC) General-purpose, wake-up, and watchdog timers Communication Input/output I2S and beeper interface LCD display controller (parallel and serial) LCD segment controller SPI, I2C, and UART peripheral interfaces Programmable GPIOs Power Coin cell battery compatible 2.5 V to 3.6 V active measurement range Power management unit (PMU) Power-on reset (POR) and power supply monitor (PSM) Packages and temperature range Operating temperature range: −40°C to +85°C Package: 120-lead, 8 mm × 8 mm CSP_BGA 

Robust, Industrial, Low Power 10BASE-T1L Ethernet PHY Features: 10BASE-T1L IEEE Standard 802.3cg-2019 compliant Supports 1.0 V p-p and 2.4 V p-p transmit levels Supports intrinsic safety applications Cable Reach 1700 meters with 1.0 V p-p 1700 meters with 2.4 V p-p Low power consumption Single supply 1 V p-p: 45 mW typical Dual supply 1 V pk-pk: 39 mW typical Diagnostics Frame generator and checker Multiple loopback modes IEEE test mode support Link and cable diagnostics MII, RMII and RGMII MAC interfaces MDIO Management Interface Single or dual supply with 1.8 V or 3.3 V operation Unmanaged configuration using pin strapping including 25 MHz crystal or external clock input (50 MHz for RMII) 3.3 V, 2.5 V, or1.8 V MAC interface VDDIO supply Integrated power supply monitoring and POR EMC test standards IEC 61000-4-4 EFT (±4 kV) IEC 61000-4-2 ESD (±4 kV contact discharge) IEC 61000-4-2 ESD (±8 kV air discharge) IEC 61000-4-5 surge (±4 kV) IEC 61000-4-6 conducted immunity (10 V/m) IEC 61000-4-3 radiated immunity (Class A) EN 55032 radiated emissions (Class B) Small package 40-lead (6 mm x 6 mm) LFCSP Temperature range Industrial: -40°C to +85°C Extended:-40°C to +105°C

RapID Platform Generation 2 (RPG2) Network Interface Features: Configurable industrial protocol support PROFINET RT (Class B) PROFINET IRT (Class C): coming soon EtherNet/IP with DLR EtherCAT All protocols precertified Configurable applications processor interface UART: 115,200 bps to 1,000,000 bps Ethernet at 10 Mbps or 100 Mbps SPI follower: 10 MHz maximum clock I2C, QSPI, and CAN: future option Industrial Ethernet interface-compliant to IEEE 802.3, 10Base or 100Base transmit half and full duplex Single 3.3 V power supply, 840 mW Cycle time down to 1 ms (cycle times vary based on protocol, link type, and application data) 194-ball chip-scale package BGA form factor RoHS 3 compliant –40°C to +85°C industrial temperature range

RapID Platform Generation 2 (RPG2) Network Interface Features: Configurable industrial protocol support PROFINET RT (Class B) PROFINET IRT (Class C): coming soon EtherNet/IP with DLR EtherCAT All protocols precertified Configurable applications processor interface UART: 115,200 bps to 1,000,000 bps Ethernet at 10 Mbps or 100 Mbps SPI follower: 10 MHz maximum clock I2C, QSPI, and CAN: future option Industrial Ethernet interface-compliant to IEEE 802.3, 10Base or 100Base transmit half and full duplex Single 3.3 V power supply, 840 mW Cycle time down to 1 ms (cycle times vary based on protocol, link type, and application data) 194-ball chip-scale package BGA form factor RoHS 3 compliant –40°C to +85°C industrial temperature range

CLOCK & TIMING ANALOG DEV KITS;

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