Robust, Industrial, Low Power 10BASE-T1L Ethernet PHY Features: 10BASE-T1L IEEE Standard 802.3cg-2019 compliant Supports 1.0 V p-p and 2.4 V p-p transmit levels Supports intrinsic safety applications Cable Reach 1700 meters with 1.0 V p-p 1700 meters with 2.4 V p-p Low power consumption Single supply 1 V p-p: 45 mW typical Dual supply 1 V pk-pk: 39 mW typical Diagnostics Frame generator and checker Multiple loopback modes IEEE test mode support Link and cable diagnostics MII, RMII and RGMII MAC interfaces MDIO Management Interface Single or dual supply with 1.8 V or 3.3 V operation Unmanaged configuration using pin strapping including 25 MHz crystal or external clock input (50 MHz for RMII) 3.3 V, 2.5 V, or1.8 V MAC interface VDDIO supply Integrated power supply monitoring and POR EMC test standards IEC 61000-4-4 EFT (±4 kV) IEC 61000-4-2 ESD (±4 kV contact discharge) IEC 61000-4-2 ESD (±8 kV air discharge) IEC 61000-4-5 surge (±4 kV) IEC 61000-4-6 conducted immunity (10 V/m) IEC 61000-4-3 radiated immunity (Class A) EN 55032 radiated emissions (Class B) Small package 40-lead (6 mm x 6 mm) LFCSP Temperature range Industrial: -40°C to +85°C Extended:-40°C to +105°C

CLOCK & TIMING ANALOG DEV KITS;

High-Performance 32-bit Floating-Point SHARC Processor for General Purpose Applications Features: 400MHz SIMD SHARC Core, capable of 2.4 GFLOPS peak performance 2Mbits SRAM; 6 Mbits customer-definable ROM High bandwidth, 32-bit external memory interface supporting glue-less interface to SDRAM, SRAM, and FLASH Digital Audio Interface (DAI) enabling user-definable access to system peripherals including 8 serial ports (SPORTs), S/PDIF Tx/Rx, 8-channel asynchronous sample rate converter, and 4 precision clock generators. Digital Peripheral Interface (DPI) enabling user-definable access to system peripherals including 2 SPI-compatible ports, 2 UARTs, 3 full-featured timers, and a two-wire interface compliant to the I2C standard. 34 zero-overhead DMA channels 16 Pulse Width Modulation (PWM) channels 208-lead LQFP-EP and 256-ball SBGA packages Commercial and industrial temperature ranges Maximum core performance is reduced for LQFP package

Low Power 200MHz Blackfin+ Embedded Processor with 128KByte L2 SRAM Features: Blackfin+ core with up to 200 MHz performance Dual 16-bit or single 32-bit MAC support per cycle 16-bit complex MAC and many other instruction set enhancements Instruction set compatible with previous Blackfin product On-Chip Memory 136KB L1 SRAM with multi-parity-bit protection (64KB instruction, 64KB data, 8KB scratchpad) 128KByte on-chip L2 SRAM with ECC protection 512KByte On-chip L2 ROM Key Peripherals include USB2.0 HS OTG 2x CAN2.0B ePPI Video I/O 2x SPORTs (w/I2S) 2xQuad-SPI / 1xDual-SPI (w/ Host mode option) I2C 2xUART SD/SDIO/MMC (4-bit) Security and one-time-programmable memory Crypto hardware accelerators for fast secure boot/IP protection memDMA encryption/decryption for fast run-time security Low-cost packaging 88-Lead LFCSP (QFN) package (12 mm × 12mm), RoHS compliant Low system power with < 53 mW at 200 MHz at 25°C TJUNCTION

Low Power 200MHz Blackfin+ Embedded Processor with 128KByte L2 SRAM & DDR2/LPDDR Interface Features: Blackfin+ core with up to 200 MHz performance Dual 16-bit or single 32-bit MAC support per cycle 16-bit complex MAC and many other instruction set enhancements Instruction set compatible with previous Blackfin product On-Chip Memory 136KB L1 SRAM with multi-parity-bit protection (64KB instruction, 64KB data, 8KB scratchpad) 128KByte on-chip L2 SRAM with ECC protection 512KByte On-chip L2 ROM L3 interface providing 16-bit interface to DDR2 or LPDDR SDRAM devices (up to 200 MHz) Key Peripherals include USB2.0 HS OTG 2x CAN2.0B ePPI Video I/O 2x SPORTs (w/I2S) 2xQuad-SPI / 1xDual-SPI (w/ Host mode option) I2C 2xUART SD/SDIO/MMC (8-bit) 4-ch 12-bit 1MSPS ADC Security and one-time-programmable memory Crypto hardware accelerators for fast secure boot/IP protection memDMA encryption/decryption for fast run-time security Low-cost packaging 184-Ball CSP_BGA package (12 mm × 12mm × 0.8mm pitch), RoHS compliant Low system power with < 53 mW at 200 MHz at 25°C TJUNCTION

Low Power 400MHz Blackfin+ Embedded Processor with 256KByte L2 SRAM & DDR2/LPDDR Interface Features: Blackfin+ core with up to 400 MHz performance Dual 16-bit or single 32-bit MAC support per cycle 16-bit complex MAC and many other instruction set enhancements Instruction set compatible with previous Blackfin product On-Chip Memory 136KB L1 SRAM with multi-parity-bit protection (64KB instruction, 64KB data, 8KB scratchpad) 256KByte on-chip L2 SRAM with ECC protection 512KByte On-chip L2 ROM L3 interface providing 16-bit interface to DDR2 or LPDDR SDRAM devices (up to 200 MHz) Key Peripherals include USB2.0 HS OTG 2x CAN2.0B ePPI Video I/O 2x SPORTs (w/I2S) 2xQuad-SPI / 1xDual-SPI (w/ Host mode option) I2C 2xUART SD/SDIO/MMC (8-bit) 4-ch 12-bit 1MSPS ADC Security and one-time-programmable memory Crypto hardware accelerators for fast secure boot/IP protection memDMA encryption/decryption for fast run-time security Low-cost packaging 184-Ball CSP_BGA package (12 mm × 12mm × 0.8mm pitch), RoHS compliant Low system power with < 100 mW at 400 MHz (< 0.25 mW/MHz) at 25°C TJUNCTION

The Blackfin processor family is extended further into the industrial and instrumentation market with the availability of an on chip eMAC, a 3-phase PWM generation unit and a quadrature encoder. The high performance 16/32-bit Blackfin embedded processor core, the flexible cache architecture, the enhanced DMA subsystem, and the dynamic power management (DPM) functionality allow system designers a flexible platform to address a wide range of connected applications, including motor control, power line monitoring, biometrics, pro-audio and femto cells. The embedded eMAC of the BF516 coupled with a 400MHz CPU and a plethora of other peripherals make the BF516 the most attractive choice for demanding network connected systems.The VoIP challenge to the embedded-system designer is to choose a processing solution that is cost-effective, easy to deploy and scaleable in performance across market spaces. A “sweet spot” embedded-solution approach is to design with a platform that can implement a low channel count basic VoIP solution, yet retain sufficient capacity for value added capabilities and services – such as video, music, imaging and system control. Unlike traditional VoIP embedded solutions that utilize two processor cores to provide VoIP functionality, the ADSP-BF516 provides a convergent solution in a unified core architecture that allows voice and video signal processing concurrent with RISC MCU processing to handle network and user-interface demands. This unique ability to offer full VoIP functionality on a single convergent processor provides for a unified software development environment, faster system debugging and deployment, and lower overall system cost.The BF516 also brings ultra low power and a removable storage interface covering SDIO, CE-ATA and eMMC for portable devices.IP protection has become a necessary part of today’s embedded computing applications. The ADSP-BF516 provides a security scheme which balances flexibility and upgradeability with performance through the inclusion of a firmware-based solution including OTP (One Time Programmable) memory to enable users to implement private keys for secure access to program code.

The ADV3002 is a complete HDMI™/DVI link switch featuring equalized transition minimized differential signaling (TMDS) inputs, ideal for systems with long cable runs. The ADV3002 includes bidirectional buffering for the DDC bus and CEC line, with integrated pull-up resistors for the CEC line. Additionally, the ADV3002 includes an EDID replication function that enables one EDID EEPROM to be shared for all four HDMI ports.The ADV3002 is provided in a space-saving, 80-lead LQFP surface-mount Pb-free plastic package and is specified to operate over the 0°C to 85°C temperature range.PRODUCT HIGHLIGHTS Input cable equalizer enables use of long cables at the input. For a 24 AWG cable, the ADV3002 compensates for more than 20m at data rates up to 3 Gbps. Auxiliary multiplexer isolates and buffers the DDC bus and the CEC line, increasing total system capacitance limit. EDID replication eliminates the need for multiple EDID EEPROMs. EDID can be loaded from a single external EEPROM or from a system microcontroller. 5 V power combiner powers the EDID replicator and CEC buffer when local system power is off. Integrated hot plug detect pulse low on channel switch with programmable pulse width or direct manual control.APPLICATIONS Advanced television (HDTV) sets Projectors A/V receivers Set-top boxes

The Blackfin® Processor family has been expanded to address the ever-increasing need for pervasive embedded network connectivity. This connectivity is powerful when utilized in conjunction with the high performance 16-/32-bit Blackfin embedded processor core, the flexible cache architecture, the enhanced DMA subsystem, and the Dynamic Power Management (DPM) functionality. System designers can take advantage of the combined control and signal processing capabilities of the processor core across a wide range of end applications through the scalability of the pin and code compatibility of these new family members. The ADSP-BF536 and ADSP-BF537 are a functional extension of the popular ADSP-BF531 / ADSP-BF532 / ADSP-BF533 processors, and they are ideally suited for a variety of networked applications. The ADSP-BF537 is the higher performance series member, with more embedded memory enabling higher throughput needs for embedded applications suchas video security/surveillance and industrial-environment-based distributed control/factory automation applications. The ADSP-BF536 offers exceptional performance and is designed for low cost connected devices such as remote monitoring devices, VoIP, point-of-sale terminals, and biometrics/security applications. Both devices are ideally suited for a broadrange of industrial, instrumentation, medical, and consumer appliance applications— allowing for scalability based upon the required network bandwidth and mix of control, plus signal processing needed in the end product.

The fourth generation of SHARC® Processors now includes the low power floating point DSP products – the ADSP-21478 and ADSP-21479 and offers increased performance, hardware-based filter accelerators, audio and application-focused peripherals, and new memory configurations capable of supporting a single chip solution. All devices are pin-compatible with each other and completely code-compatible with all prior SHARC Processors. These newest members of the fourth generation SHARC Processor family are based on a single-instruction, multiple-data (SIMD) core, which supports both 32-bit fixed-point and 32-/40-bit floating-point arithmetic formats and their low power make them particularly suitable for battery powered applications or where a higher ambient operating temperature is required.The ADSP-21478 offers a very low power and high performance – 266 MHz/1596 MFLOPs – in a BGA and LQFP package within the fourth generation SHARC Processor family. This feature of power makes the ADSP-21478 particularly well suited to address the automotive audio and many industrial control segments where low power is a requirement. In addition to its high core performance, the ADSP-21478 includes additional processing blocks such as FIR, IIR, and FFT accelerators to increase the total performance of the system. There is a new feature called Variable Instruction Set Architecture (VISA) that allows the code size to be decreased by 20% to 30% and increase the memory size availability. The fourth generation DSP allows the ability to connect to external memory by providing a glueless interface to 16-bit wide SDR SDRAMs.Fourth-generation SHARC Processors also integrate application-specific peripherals designed to simplify hardware design, minimize design risks, and ultimately reduce time to market. Grouped together, and broadly named the Digital Applications Interface (DAI), these functional blocks may be connected to each other or to external pins via the software-programmable Signal Routing Unit (SRU). The SRU is an innovative architectural feature that enables complete and flexible routing amongst DAI blocks. Peripherals connected through the SRU include but are not limited to serial ports, SPI ports, S/PDIF Tx/Rx, and an 8-Channel asynchronous sample rate converter block. The fourth generation SHARC allows data from the serial ports to be directly transferred to external memory by the DMA controller. Other peripherals such as UART and Two-Wire Interface are routed through a Digital Peripheral Interface (DPI).