The BF592 is the low cost entry point into the Blackfin portfolio of processors. With core clock speeds of 200 and 400 MHz and a peripheral set including two SPORT’s, a PPI, two SPI’s, four general purpose counters and a factory-programmed Instruction ROM block containing the VDK RTOS and C-runtime libraries, the BF592 is feature and cost optimized for compute intensive industrial, automotive, and general purpose applications that do not require external memory or executable flash. The BF592 is offered in a low cost 9×9mm LFCSP package in commercial and industrial temperature grades as well as automotive qualified. 

The Blackfin processor family is extended further into the industrial and instrumentation market with the availability of an on chip eMAC, a 3-phase PWM generation unit and a quadrature encoder. The high performance 16/32-bit Blackfin embedded processor core, the flexible cache architecture, the enhanced DMA subsystem, and the dynamic power management (DPM) functionality allow system designers a flexible platform to address a wide range of connected applications, including motor control, power line monitoring, biometrics, pro-audio and femto cells. The embedded eMAC of the BF516 coupled with a 400MHz CPU and a plethora of other peripherals make the BF516 the most attractive choice for demanding network connected systems.The VoIP challenge to the embedded-system designer is to choose a processing solution that is cost-effective, easy to deploy and scaleable in performance across market spaces. A “sweet spot” embedded-solution approach is to design with a platform that can implement a low channel count basic VoIP solution, yet retain sufficient capacity for value added capabilities and services – such as video, music, imaging and system control. Unlike traditional VoIP embedded solutions that utilize two processor cores to provide VoIP functionality, the ADSP-BF516 provides a convergent solution in a unified core architecture that allows voice and video signal processing concurrent with RISC MCU processing to handle network and user-interface demands. This unique ability to offer full VoIP functionality on a single convergent processor provides for a unified software development environment, faster system debugging and deployment, and lower overall system cost.The BF516 also brings ultra low power and a removable storage interface covering SDIO, CE-ATA and eMMC for portable devices.IP protection has become a necessary part of today’s embedded computing applications. The ADSP-BF516 provides a security scheme which balances flexibility and upgradeability with performance through the inclusion of a firmware-based solution including OTP (One Time Programmable) memory to enable users to implement private keys for secure access to program code.

The ADV3002 is a complete HDMI™/DVI link switch featuring equalized transition minimized differential signaling (TMDS) inputs, ideal for systems with long cable runs. The ADV3002 includes bidirectional buffering for the DDC bus and CEC line, with integrated pull-up resistors for the CEC line. Additionally, the ADV3002 includes an EDID replication function that enables one EDID EEPROM to be shared for all four HDMI ports.The ADV3002 is provided in a space-saving, 80-lead LQFP surface-mount Pb-free plastic package and is specified to operate over the 0°C to 85°C temperature range.PRODUCT HIGHLIGHTS Input cable equalizer enables use of long cables at the input. For a 24 AWG cable, the ADV3002 compensates for more than 20m at data rates up to 3 Gbps. Auxiliary multiplexer isolates and buffers the DDC bus and the CEC line, increasing total system capacitance limit. EDID replication eliminates the need for multiple EDID EEPROMs. EDID can be loaded from a single external EEPROM or from a system microcontroller. 5 V power combiner powers the EDID replicator and CEC buffer when local system power is off. Integrated hot plug detect pulse low on channel switch with programmable pulse width or direct manual control.APPLICATIONS Advanced television (HDTV) sets Projectors A/V receivers Set-top boxes

This device is a member of the ADSP-BF70x Blackfin Digital Signal Processor (DSP) product family. The new Blackfin+ processor core combines dual-MAC 16-bit, 32-bit MAC and 16-bit complex MAC in to a state-of-the-art signal processing engine. It also combines advantages of a clean, orthogonal RISC-like microprocessor instruction set, and single-instruction, multiple-data (SIMD) multimedia capabilities within a single instruction-set architecture. Further new enhancements to the Blackfin+ core add cache enhancements, branch prediction and other instruction set improvements—all while maintaining instruction set compatibility to previous Blackfin products.The processor offers performance up to 400 MHz, as well as lowest power consumption at By integrating a rich set of industry-leading system peripherals, large on-chip memory & a high speed external memory interface, this Blackfin processor is the platform of choice for next-generation applications that require RISC-like programmability, multimedia support, and leading-edge signal processing in one integrated package. These applications span a wide array of markets, from automotive systems to embedded industrial, instrumentation, video/image analysis, biometric and control applications.

The ADSP-SC57x/ADSP-2157x processors are members of the SHARC® family of products. The ADSP-SC57x processor is based on the SHARC+® dual-core and the arm® Cortex®-A5 core. The ADSP-SC57x/ADSP-2157x SHARC processors are members of the single-instruction, multiple data (SIMD) SHARC family of digital signal processors (DSPs) that feature Analog Devices Super Harvard Architecture. These 32-bit/40-bit/64-bit floating-point processors are optimized for high performance audio/floating-point applications with large on-chip static random-access memory (SRAM), multiple internal buses that eliminate input/output (I/O) bottlenecks, and innovative digital audio interfaces (DAI). New additions to the SHARC+ core include cache enhancements and branch prediction, while maintaining instruction set compatibility to previous SHARC products.By integrating a set of industry leading system peripherals and memory, the arm® Cortex-A5 and SHARC processor is the platform of choice for applications that require programmability similar to reduced instruction set computing (RISC), multimedia support, and leading edge signal processing in one integrated package. These applications span a wide array of markets, including automotive, professional audio, and industrial-based applications that require high floating-point performance.

The AD8124 is a triple, high speed, differential receiver and equalizer that compensates for the transmission losses of UTP and coaxial cables up to 200 meters in length. Various gain stages are summed together to best approximate the inverse frequency response of the cable. Logic circuitry inside the AD8124 controls the gain functions of the individual stages so that the lowest noise can be achieved at short-to-medium cable lengths. This technique optimizes its performance for low noise, short-to-medium range applications, while at the same time provides the high gain bandwidth required for longer cable equalization (up to 200 meters). Each channel features a high impedance differential input that is ideal for interfacing directly with the cable.The AD8124 has three control pins for optimal cable compensation, as well as an output offset adjust pin. Two voltage-controlled pins are used to compensate for different cable lengths; the VPEAK pin controls the amount of high frequency peaking and the VGAIN pin adjusts the broadband flat gain, which compensates for the low frequency flat cable loss.For added flexibility, an optional pole adjustment pin, VPOLE, allows movement of the pole locations, allowing for the compensation of different gauges and types of cable as well as variations between different cables and/or equalizers. The VOFFSET pin allows the dc voltage at the output to be adjusted, adding flexibility for dc-coupled systems.The AD8124 is available in a 6 mm × 6 mm, 40-lead LFCSP and is rated to operate over the extended temperature range of −40°C to +85°C.APPLICATIONS Keyboard-video-mouse (KVM) Digital signage RGB video over UTP cables Professional video projection and distribution HD video Security video

High-Performance 32-bit Floating-Point SHARC Processor for General Purpose Applications Features: 400MHz SIMD SHARC Core, capable of 2.4 GFLOPS peak performance 2Mbits SRAM; 6 Mbits customer-definable ROM High bandwidth, 32-bit external memory interface supporting glue-less interface to SDRAM, SRAM, and FLASH Digital Audio Interface (DAI) enabling user-definable access to system peripherals including 8 serial ports (SPORTs), S/PDIF Tx/Rx, 8-channel asynchronous sample rate converter, and 4 precision clock generators. Digital Peripheral Interface (DPI) enabling user-definable access to system peripherals including 2 SPI-compatible ports, 2 UARTs, 3 full-featured timers, and a two-wire interface compliant to the I2C standard. 34 zero-overhead DMA channels 16 Pulse Width Modulation (PWM) channels 208-lead LQFP-EP and 256-ball SBGA packages Commercial and industrial temperature ranges Maximum core performance is reduced for LQFP package

Low Power 200MHz Blackfin+ Embedded Processor with 128KByte L2 SRAM Features: Blackfin+ core with up to 200 MHz performance Dual 16-bit or single 32-bit MAC support per cycle 16-bit complex MAC and many other instruction set enhancements Instruction set compatible with previous Blackfin product On-Chip Memory 136KB L1 SRAM with multi-parity-bit protection (64KB instruction, 64KB data, 8KB scratchpad) 128KByte on-chip L2 SRAM with ECC protection 512KByte On-chip L2 ROM Key Peripherals include USB2.0 HS OTG 2x CAN2.0B ePPI Video I/O 2x SPORTs (w/I2S) 2xQuad-SPI / 1xDual-SPI (w/ Host mode option) I2C 2xUART SD/SDIO/MMC (4-bit) Security and one-time-programmable memory Crypto hardware accelerators for fast secure boot/IP protection memDMA encryption/decryption for fast run-time security Low-cost packaging 88-Lead LFCSP (QFN) package (12 mm × 12mm), RoHS compliant Low system power with < 53 mW at 200 MHz at 25°C TJUNCTION

Low Power 200MHz Blackfin+ Embedded Processor with 128KByte L2 SRAM & DDR2/LPDDR Interface Features: Blackfin+ core with up to 200 MHz performance Dual 16-bit or single 32-bit MAC support per cycle 16-bit complex MAC and many other instruction set enhancements Instruction set compatible with previous Blackfin product On-Chip Memory 136KB L1 SRAM with multi-parity-bit protection (64KB instruction, 64KB data, 8KB scratchpad) 128KByte on-chip L2 SRAM with ECC protection 512KByte On-chip L2 ROM L3 interface providing 16-bit interface to DDR2 or LPDDR SDRAM devices (up to 200 MHz) Key Peripherals include USB2.0 HS OTG 2x CAN2.0B ePPI Video I/O 2x SPORTs (w/I2S) 2xQuad-SPI / 1xDual-SPI (w/ Host mode option) I2C 2xUART SD/SDIO/MMC (8-bit) 4-ch 12-bit 1MSPS ADC Security and one-time-programmable memory Crypto hardware accelerators for fast secure boot/IP protection memDMA encryption/decryption for fast run-time security Low-cost packaging 184-Ball CSP_BGA package (12 mm × 12mm × 0.8mm pitch), RoHS compliant Low system power with < 53 mW at 200 MHz at 25°C TJUNCTION

Low Power 400MHz Blackfin+ Embedded Processor with 256KByte L2 SRAM & DDR2/LPDDR Interface Features: Blackfin+ core with up to 400 MHz performance Dual 16-bit or single 32-bit MAC support per cycle 16-bit complex MAC and many other instruction set enhancements Instruction set compatible with previous Blackfin product On-Chip Memory 136KB L1 SRAM with multi-parity-bit protection (64KB instruction, 64KB data, 8KB scratchpad) 256KByte on-chip L2 SRAM with ECC protection 512KByte On-chip L2 ROM L3 interface providing 16-bit interface to DDR2 or LPDDR SDRAM devices (up to 200 MHz) Key Peripherals include USB2.0 HS OTG 2x CAN2.0B ePPI Video I/O 2x SPORTs (w/I2S) 2xQuad-SPI / 1xDual-SPI (w/ Host mode option) I2C 2xUART SD/SDIO/MMC (8-bit) 4-ch 12-bit 1MSPS ADC Security and one-time-programmable memory Crypto hardware accelerators for fast secure boot/IP protection memDMA encryption/decryption for fast run-time security Low-cost packaging 184-Ball CSP_BGA package (12 mm × 12mm × 0.8mm pitch), RoHS compliant Low system power with < 100 mW at 400 MHz (< 0.25 mW/MHz) at 25°C TJUNCTION