The fourth generation of SHARC® Processors now includes the low power floating point DSP products – the ADSP-21478 and ADSP-21479 and offers increased performance, hardware-based filter accelerators, audio and application-focused peripherals, and new memory configurations capable of supporting a single chip solution. All devices are pin-compatible with each other and completely code-compatible with all prior SHARC Processors. These newest members of the fourth generation SHARC Processor family are based on a single-instruction, multiple-data (SIMD) core, which supports both 32-bit fixed-point and 32-/40-bit floating-point arithmetic formats and their low power make them particularly suitable for battery powered applications or where a higher ambient operating temperature is required.The ADSP-21478 offers a very low power and high performance – 266 MHz/1596 MFLOPs – in a BGA and LQFP package within the fourth generation SHARC Processor family. This feature of power makes the ADSP-21478 particularly well suited to address the automotive audio and many industrial control segments where low power is a requirement. In addition to its high core performance, the ADSP-21478 includes additional processing blocks such as FIR, IIR, and FFT accelerators to increase the total performance of the system. There is a new feature called Variable Instruction Set Architecture (VISA) that allows the code size to be decreased by 20% to 30% and increase the memory size availability. The fourth generation DSP allows the ability to connect to external memory by providing a glueless interface to 16-bit wide SDR SDRAMs.Fourth-generation SHARC Processors also integrate application-specific peripherals designed to simplify hardware design, minimize design risks, and ultimately reduce time to market. Grouped together, and broadly named the Digital Applications Interface (DAI), these functional blocks may be connected to each other or to external pins via the software-programmable Signal Routing Unit (SRU). The SRU is an innovative architectural feature that enables complete and flexible routing amongst DAI blocks. Peripherals connected through the SRU include but are not limited to serial ports, SPI ports, S/PDIF Tx/Rx, and an 8-Channel asynchronous sample rate converter block. The fourth generation SHARC allows data from the serial ports to be directly transferred to external memory by the DMA controller. Other peripherals such as UART and Two-Wire Interface are routed through a Digital Peripheral Interface (DPI).

The BF592 is the low cost entry point into the Blackfin portfolio of processors. With core clock speeds of 200 and 400 MHz and a peripheral set including two SPORT’s, a PPI, two SPI’s, four general purpose counters and a factory-programmed Instruction ROM block containing the VDK RTOS and C-runtime libraries, the BF592 is feature and cost optimized for compute intensive industrial, automotive, and general purpose applications that do not require external memory or executable flash. The BF592 is offered in a low cost 9×9mm LFCSP package in commercial and industrial temperature grades as well as automotive qualified. 

The ADSP-SC57x/ADSP-2157x processors are members of the SHARC® family of products. The ADSP-SC57x processor is based on the SHARC+® dual-core and the arm® Cortex®-A5 core. The ADSP-SC57x/ADSP-2157x SHARC processors are members of the single-instruction, multiple data (SIMD) SHARC family of digital signal processors (DSPs) that feature Analog Devices Super Harvard Architecture. These 32-bit/40-bit/64-bit floating-point processors are optimized for high performance audio/floating-point applications with large on-chip static random-access memory (SRAM), multiple internal buses that eliminate input/output (I/O) bottlenecks, and innovative digital audio interfaces (DAI). New additions to the SHARC+ core include cache enhancements and branch prediction, while maintaining instruction set compatibility to previous SHARC products.By integrating a set of industry leading system peripherals and memory, the arm® Cortex-A5 and SHARC processor is the platform of choice for applications that require programmability similar to reduced instruction set computing (RISC), multimedia support, and leading edge signal processing in one integrated package. These applications span a wide array of markets, including automotive, professional audio, and industrial-based applications that require high floating-point performance.

Metering Systems on a Chip - SoC Highly Integrated SoC w/MCU Core

RapID Platform Generation 2 (RPG2) Network Interface Features: Configurable industrial protocol support PROFINET RT (Class B) PROFINET IRT (Class C): coming soon EtherNet/IP with DLR EtherCAT All protocols precertified Configurable applications processor interface UART: 115,200 bps to 1,000,000 bps Ethernet at 10 Mbps or 100 Mbps SPI follower: 10 MHz maximum clock I2C, QSPI, and CAN: future option Industrial Ethernet interface-compliant to IEEE 802.3, 10Base or 100Base transmit half and full duplex Single 3.3 V power supply, 840 mW Cycle time down to 1 ms (cycle times vary based on protocol, link type, and application data) 194-ball chip-scale package BGA form factor RoHS 3 compliant –40°C to +85°C industrial temperature range

High-Performance 32-bit Floating-Point SHARC Processor for General Purpose Applications Features: 400MHz SIMD SHARC Core, capable of 2.4 GFLOPS peak performance 2Mbits SRAM; 6 Mbits customer-definable ROM High bandwidth, 32-bit external memory interface supporting glue-less interface to SDRAM, SRAM, and FLASH Digital Audio Interface (DAI) enabling user-definable access to system peripherals including 8 serial ports (SPORTs), S/PDIF Tx/Rx, 8-channel asynchronous sample rate converter, and 4 precision clock generators. Digital Peripheral Interface (DPI) enabling user-definable access to system peripherals including 2 SPI-compatible ports, 2 UARTs, 3 full-featured timers, and a two-wire interface compliant to the I2C standard. 34 zero-overhead DMA channels 16 Pulse Width Modulation (PWM) channels 208-lead LQFP-EP and 256-ball SBGA packages Commercial and industrial temperature ranges Maximum core performance is reduced for LQFP package

Low Power 200MHz Blackfin+ Embedded Processor with 128KByte L2 SRAM Features: Blackfin+ core with up to 200 MHz performance Dual 16-bit or single 32-bit MAC support per cycle 16-bit complex MAC and many other instruction set enhancements Instruction set compatible with previous Blackfin product On-Chip Memory 136KB L1 SRAM with multi-parity-bit protection (64KB instruction, 64KB data, 8KB scratchpad) 128KByte on-chip L2 SRAM with ECC protection 512KByte On-chip L2 ROM Key Peripherals include USB2.0 HS OTG 2x CAN2.0B ePPI Video I/O 2x SPORTs (w/I2S) 2xQuad-SPI / 1xDual-SPI (w/ Host mode option) I2C 2xUART SD/SDIO/MMC (4-bit) Security and one-time-programmable memory Crypto hardware accelerators for fast secure boot/IP protection memDMA encryption/decryption for fast run-time security Low-cost packaging 88-Lead LFCSP (QFN) package (12 mm × 12mm), RoHS compliant Low system power with < 53 mW at 200 MHz at 25°C TJUNCTION

Low Power 200MHz Blackfin+ Embedded Processor with 128KByte L2 SRAM & DDR2/LPDDR Interface Features: Blackfin+ core with up to 200 MHz performance Dual 16-bit or single 32-bit MAC support per cycle 16-bit complex MAC and many other instruction set enhancements Instruction set compatible with previous Blackfin product On-Chip Memory 136KB L1 SRAM with multi-parity-bit protection (64KB instruction, 64KB data, 8KB scratchpad) 128KByte on-chip L2 SRAM with ECC protection 512KByte On-chip L2 ROM L3 interface providing 16-bit interface to DDR2 or LPDDR SDRAM devices (up to 200 MHz) Key Peripherals include USB2.0 HS OTG 2x CAN2.0B ePPI Video I/O 2x SPORTs (w/I2S) 2xQuad-SPI / 1xDual-SPI (w/ Host mode option) I2C 2xUART SD/SDIO/MMC (8-bit) 4-ch 12-bit 1MSPS ADC Security and one-time-programmable memory Crypto hardware accelerators for fast secure boot/IP protection memDMA encryption/decryption for fast run-time security Low-cost packaging 184-Ball CSP_BGA package (12 mm × 12mm × 0.8mm pitch), RoHS compliant Low system power with < 53 mW at 200 MHz at 25°C TJUNCTION

Low Power 400MHz Blackfin+ Embedded Processor with 256KByte L2 SRAM & DDR2/LPDDR Interface Features: Blackfin+ core with up to 400 MHz performance Dual 16-bit or single 32-bit MAC support per cycle 16-bit complex MAC and many other instruction set enhancements Instruction set compatible with previous Blackfin product On-Chip Memory 136KB L1 SRAM with multi-parity-bit protection (64KB instruction, 64KB data, 8KB scratchpad) 256KByte on-chip L2 SRAM with ECC protection 512KByte On-chip L2 ROM L3 interface providing 16-bit interface to DDR2 or LPDDR SDRAM devices (up to 200 MHz) Key Peripherals include USB2.0 HS OTG 2x CAN2.0B ePPI Video I/O 2x SPORTs (w/I2S) 2xQuad-SPI / 1xDual-SPI (w/ Host mode option) I2C 2xUART SD/SDIO/MMC (8-bit) 4-ch 12-bit 1MSPS ADC Security and one-time-programmable memory Crypto hardware accelerators for fast secure boot/IP protection memDMA encryption/decryption for fast run-time security Low-cost packaging 184-Ball CSP_BGA package (12 mm × 12mm × 0.8mm pitch), RoHS compliant Low system power with < 100 mW at 400 MHz (< 0.25 mW/MHz) at 25°C TJUNCTION

Configurable Impedance Network Analyzer & Potentiostat with Integrated Cortex M3 Core Features: Analog performance 160 kSPS, 16-bit, precision analog-to-digital converter (ADC) 4 dedicated voltage measurement channels 8 current measurement channels Impedance measurement engine High precision voltage reference Supply noise rejection filtering Ultralow leakage configurable switch matrix 12-bit digital-to-analog converter (DAC) Precision instrumentation amplifier control loop 6-channel CapTouch controller Temperature sensor Analog hardware accelerators Autonomous analog front-end (AFE) controller Independent sequencer for AFE functions Direct digital synthesizer (DDS)/arbitrary waveform generator Receive filters Complex impedance measurement (DFT) engine Processing 16 MHz ARM Cortex-M3 processor 384 kB of embedded flash memory 32 kB system SRAM 16 kB Flash configured EEPROM Integrated full-speed USB 2.0 controller and PHY Multilayer advanced microcontroller bus architecture (AMBA) bus matrix Central direct memory access (DMA) controller Real-time clock (RTC) General-purpose, wake-up, and watchdog timers Communication Input/output I2S and beeper interface LCD display controller (parallel and serial) LCD segment controller SPI, I2C, and UART peripheral interfaces Programmable GPIOs Power Coin cell battery compatible 2.5 V to 3.6 V active measurement range Power management unit (PMU) Power-on reset (POR) and power supply monitor (PSM) Packages and temperature range Operating temperature range: −40°C to +85°C Package: 120-lead, 8 mm × 8 mm CSP_BGA