Wide Bandwidth, Low Noise, Vibration Sensor Features: Single axis, digital output MEMS vibration sensing module   ±50 g measurement range Ultralow output noise density, 26 μg/√Hz (MTC mode) Wide bandwidth: dc to 10 kHz within 3 dB flatness (RTS mode) Embedded fast data conversion rate: 220 kSPS 6 digital FIR filters, 32 taps (coefficients), default options: High-pass filter cutoff frequencies: 1 kHz, 5 kHz, 10 kHz Low-pass filter cutoff frequencies: 1 kHz, 5 kHz, 10 kHz User configurable digital filter option (32 coefficients) Spectral analysis through internal FFT Extended record length: 2048 bins with user configurable bin sizes from 0.42 Hz to 53.7 Hz Manual or timer-based (automatic) triggering Windowing options: rectangular, Hanning, flat top FFT record averaging, configurable up to 255 records Spectral defined alarm monitoring, 6 alarms Time domain capture with statistical metrics Extended record length: 4096 samples Mean, standard deviation, peak, crest factor, skewness, and kurtosis Configurable alarm monitoring Real-time data streaming: 220 kSPS Burst mode communication with CRC-16 error checking Storage: 10 data records for each axis On demand self test with status flags Sleep mode with external and timer driven wakeup Digital temperature and power supply measurements SPI-compatible serial interface Identification registers: factory preprogrammed serial number, device ID, user programmable ID Single-supply operation: 3.0 V to 3.6 V Operating temperature range: −40°C to +105°C Automatic shutdown at 125°C (junction temperature) 23.7 mm × 27.0 mm × 12.4 mm aluminum package 36 mm flexible, 14-lead module with integrated flexible connector Mass: 13 g

Ultrafast 3.3 V Single-Supply Comparator w/CML Output Drivers Features: 3.3 V/5.2 V single-supply operation 150 ps propagation delay 15 ps overdrive and slew rate dispersion 8 GHz equivalent input rise time bandwidth 80 ps minimum pulse width 35 ps typical output rise/fall 10 ps deterministic jitter (DJ) 200 fs random jitter (RJ) On-chip terminations at both input pins Robust inputs with no output phase reversal Resistor-programmable hysteresis Differential latch control Extended industrial −40°C to +125°C temperature range

Single-Phase Active and Apparent Energy Metering IC Features: High accuracy; supports IEC 61036/60687, IEC62053-21, and IEC62053-22 On-chip digital integrator enables direct interface-to-current sensors with di/dt output A PGA in the current channel allows direct interface to shunts and current transformers Active and apparent energy, sampled waveform, and current and voltage rms Less than 0.1% error in active energy measurement over a dynamic range of 1000 to 1 at 25°C Positive-only energy accumulation mode available On-chip user programmable threshold for line voltage surge and SAG and PSU supervisory Digital calibration for power, phase, and input offset On-chip temperature sensor (±3°C typical) SPI®-compatible serial interface Please see data sheet for additional features.

High Performance Narrowband ISM Transceiver IC Features: Low power, high performance, narrowband transciever Frequency Bands: 80-650MHz and 862-940MHz Modulation schemes: 2FSK, 3FSK, 4FSK Spectral shaping: Gaussian and Raised Cosine Filtering Automatic PA ramp Data rates supported: 0.05kps to 25kbps Programmable output power: –16dBm to +13dBm Low IF architecture with programmable IF bandwidths of 12.5/18.5/25kHz 2.3V to 3.6V Power Supply Receiver sensitivity: –123dBm @ 1kbps FSK Fully automatic frequency control loop (AFC) compensates for lower tolerance crystals High Accuracy digital RSSI and integrated Tx/Rx switch

CMOS, 2.5 Low Voltage Quad SPDT Switch Features: 1.8 V to 5.5 V Single Supply ±2.5 V Dual Supply 2.5 Ω On Resistance 0.5 Ω On Resistance Flatness 100 pA Leakage Currents Triple SPDT: ADG786 Quad SPDT: ADG788 19 ns Switching Times 20-Lead 4 mm × 4 mm Chip Scale Packages Low Power Consumption TTL/CMOS-Compatible Inputs For Functionally-Equivalent Devices in 16-Lead TSSOP Packages, See ADG733/ADG734 Qualified for automotive applications

Wideband, 43 dB Isolation at 1 GHz, CMOS 1.65 V to 2.75 V, 2:1 Mux/SPDT Switches Features: Wideband switch: −3 dB at 4 GHz Absorptive/reflective switches High off isolation (43 dB at 1 GHz) Low insertion loss (0.8 dB at 1 GHz) Single 1.65 V to 2.75 V power supply CMOS/LVTTL control logic 8-lead MSOP and tiny 3 mm × 3 mm LFCSP Low power consumption (<1 µA)

5.7 kV RMS 500kbps Full Duplex Signal and Power Isolated RS-485 Transceiver with 15 kV IEC ESD Features: 5.7 kV rms isolated RS-485/RS-422 transceiver Low radiated emissions, integrated, isolated dc-to-dc converter Passes EN 55032 Class B with margin on a 2-layer PCB Cable invert smart feature Correct reversed cable connection on A, B, Y, and Z bus pins while maintaining full receiver fail-safe feature ESD protection on RS-485 A, B, Y, and Z pins 12 kV IEC61000-4-2 contact discharge 15 kV IEC61000-4-2 air discharge High speed 25 Mbps data rate (ADM2865E/ADM2867E) Low speed 500 kbps data rate for EMI control (ADM2861E/ADM2863E) Flexible power supplies Input VCC supply of 3 V to 5.5 V Logic VIO supply of 1.7 V to 5.5 V VSEL pin to select VISO supply of 5 V (VCC > 4.5 V) or 3.3 V PROFIBUS compliant for 5 V VISO Wide operating temperature range: −40°C to +105°C High common-mode transient immunity: 250 kV/μs Short-circuit, open-circuit, and floating input receiver fail-safe Supports 192 bus nodes (72 k receiver input impedance) Full hot swap support (glitch free power-up/power-down) Safety and regulatory approvals (pending) CSA Component Acceptance Notice 5A, DIN V VDE V 0884-11, UL 1577, CQC11-471543-2012, IEC 61010-1 Complies with ANSI/TIA/EIA-485-A-98 and ISO 8482:1987(E) 28-lead, fine pitch SOIC_W package (10.15 mm 10.05 mm) with >8.0 mm creepage and clearance

5.7 kV RMS/1.5 kV RMS, Quad-Channel LVDS 2.5 Gigabit Isolator (0 Reverse Channels) Features: 5.7 kV rms and 1.5 kV rms LVDS isolators Complies with TIA/EIA-644-A LVDS signal levels Quad-channel configuration Any data rate up to 2.5 Gbps switching with low jitter 10 Gbps total bandwidth across four channels 2.15 ns typical propagation delay Typical jitter: 0.82 ps rms random, 40 ps total peak Lower power 1.8 V supplies ±8 kV IEC 61000-4-2 ESD protection across isolation barrier High common-mode transient immunity: 100 kV/μs typical Safety and regulatory approvals (28-lead SOIC_W_FP package) UL (pending): 5700 V rms for 1 minute per UL 1577 CSA Component Acceptance Notice 5A (pending) VDE certificate of conformity (pending) DIN V VDE V 0884-11 (VDE V 0884-11):2017-01 VIORM = 849 VPEAK (working voltage) Enable or disable refresh (low speed output correctness check) Operating temperature range: −40°C to +125°C 28-lead, wide-body, finer pitch SOIC_W_FP package with 8.3 mm creepage and clearance or 6 mm × 6 mm LFCSP package with 1.27 mm creepage and clearance

800MHz to 2.7GHz High Linearity Direct Conversion Quadrature Demodulator Features: Input Frequency Range: 0.8GHz to 2.7GHz* 50Ω Single-Ended RF and LO Ports High IIP3: 28dBm at 900MHz, 22.6dBm at 1.9GHz High IIP2: 54.1dBm at 900MHz, 60dBm at 1.9GHz Input P1dB: 13.2dBm at 900MHz I/Q Gain Mismatch: 0.04dB Typical I/Q Phase Mismatch: 0.4° Typical Low Output DC Offsets Noise Figure: 12.8dB at 900MHz, 12.7dB at 1.9GHz Conversion Gain: 3dB at 900MHz, 4.2dB at 1.9GHz Very Few External Components Shutdown Mode 16-Lead QFN 4mm × 4mm Package with Exposed Pad

36V, 1A Module (Power Module) LED Driver and Current Source Features: True Color PWM™ Delivers Constant Color with 250:1 Dimming Ratio Wide Input Range: 4V to 36V Up to 1A LED Current Adjustable Control of LED Current High Output Current Accuracy is Maintained Over a Wide Range from 35mA to 1A Open LED and Short-Circuit Protection Grounded LED Cathode Connection Small Footprint (15mm × 9mm × 4.32mm) Surface Mount LGA Package