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CC3130RNMRGKR

Texas Instruments CC3130RNMRGKR

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Texas Instruments CLXC8T245QRHLRQ1

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Texas Instruments DAC43701DSGR

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Texas Instruments DLP2010LCFQJ

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Price
RoHS Y Y Y Y Y Y Y Y Y Y
Lead Status Y Y Y Y Y Y Y Y Y Y
Certifications Wi-Fi CERTIFIED Chip
Features 16 secure sockets,2.4-GHz coexistence,4 STAs,802.11bgn,IPv4 & IPv6 Integrated pulldown resistors,Output enable,Overvoltage tolerant inputs,Partial power down (Ioff),Vcc disconnect,Vcc isolation Small Size,Smart DAC Cost Optimized,Current Output,Low Power,SDO,Small Size,Smart DAC 10BASE-T1L,Cable diagnostics,Compliant with IEEE 802.3cg,Dual MDI amplitude level for long cable reach,External terminations on MDI for intrinsic safety 10BASE-T1L,Cable diagnostics,Compliant with IEEE 802.3cg,Dual MDI amplitude level for long cable reach,External terminations on MDI for intrinsic safety
Operating temperature range(C) -40 -40 -40 -40 -40 0 -40 -40 -40 -40
Package area(mm^2) 81 19.25 4 9 25 84.27 25 25 6.08 6.08
Package size (L x W)(mm) 9 x 9 5.5 x 3.5 2 x 2 3 x 3 5 x 5 15.9 x 5.3 5 x 5 5 x 5 4 x 1.52 4 x 1.52
Package type VQFN VQFN WSON WQFN VQFN DLP-S244 VQFN VQFN TO-92 TO-92
Pin count 64.0 24.0 8.0 16 32 40.0 32.0 32.0 3 3
Processor External MCU
Protocols Wi-Fi 2.4 GHz
Rating Catalog Automotive Catalog Catalog Catalog Catalog Catalog Catalog Catalog Catalog
Security Device identity,Networking security (WPA3),Secure FW and SW update,Secure storage
TI functional safety category
Throughput(max)(MBits) 16
Type Wireless network processor Omnipolar switch Omnipolar switch
TI.com inventory 6636 187586 1614204 23250 195 634 491743 35280 490 9950
Approx. price(US$) 2.86 | 1ku .615 | 1ku .52 | 1ku 3.696 | 1ku 6.708 | 1ku 35.33 | 1ku 3.2 | 1ku 3.84 | 1ku .35 | 1ku .095 | 1ku
Applications GPIO,JTAG,SPI,UART
Bits(#) 8
Data rate(max)(MBits) 420
Data rate(max)(Mbps) 420
High input voltage(max)(V) 5.5
High input voltage(min)(V) 0.44
IOH(max)(mA) -32
IOL(max)(mA) 32
Input type Schmitt-Trigger
Output type 3-State Buffered Voltage Buffered Current,Buffered Voltage Buffered Voltage
Supply current(max)(A) 12
Technology family LXC
Vout(max)(V) 5.5
Vout(min)(V) 1.1
Architecture String String R-2R
INL(max)(n±LSb) 1 1 1
INL(max)(nLSB) 1 1 1
Interface type I2C I2C,SPI SPI MII,RGMII,RMII master low power 5MHz,RMII master/slave MII,RGMII,RMII master low power 5MHz,RMII master/slave
Number of DAC channels 1 4 2
Output range(max)(mA/V) 5.5 5.5 40
Output range(min)(mA/V) 0 0 -20
Power consumption(typ)(mW) 0.36 0.3
Reference type Ext,Int Ext,Int Ext,Int
Resolution(Bits) 8 10 12
Settling time(s) 12 20
Sample/update rate(Msps) 0.25
Array diagonal(in) 0.2
Chipset family DLP2010LC,DLPA2000,DLPA2005,DLPA3000,DLPC3470
Component type DMD
Display resolution(max) 854 x 480 (WVGA)
Illumination wavelength(max)(nm) 700
Illumination wavelength(min)(nm) 420
Input frame rate(Hz) 120
Micromirror array orientation Orthogonal
Micromirror array size 854 x 480
Micromirror driver support Integrated
Micromirror pitch(mm) 0.0054
Pattern rate, 8-bit(max)(Hz) 272
Pattern rate, binary(max)(Hz) 2487
Thermal dissipation(C/W) 7.9
Datarate (Mbps) 10BASE-T1L 10BASE-T1L
ESD HBM(kV) 6 6
I/O supply voltage(typ)(V) 1.8,2.5,3.3 1.8,2.5,3.3
Number of LEDs 3 3
Number of ports Single Single
Supply voltage(V) 3.3 3.3
Bandwidth(kHz) 0.02 0.02
Operate point(max)(mT) 9.5 9.5
Operate point(typ)(mT) 0.007 0.007
Output Open-drain Open-drain
Release point(min)(mT) 3 3
Supply current(A) 1.3 1.3
Supply voltage(max)(V) 5.5 5.5
Supply voltage(min)(V) 1.65 1.65