INTEL FOR LGA 775 TM

Adlink Technology, Inc
HEAT SINK: MATERIAL:AL 6063 & CU CORE

INTEL LGA1156 TM

Adlink Technology, Inc
HEATSINK MATERIAL : COPPER

NuPRO-A331DV

Adlink Technology, Inc
Single Board Computers PICMG 1.0 SBC Q57 / QUAD

Express-MV-SL9400

Adlink Technology, Inc
Computer-On-Modules - COM COM-Express CORE 2 Duo 1.86GHz GS45

RUF735W-02030-A101

Adlink Technology, Inc
Embedded Box Computers RuffSystem735, 1.6GHz Atom N270, 128GB SSD, 2GB RAM, Ubuntu8.04, 14-32VDC, RoHS

Express-ATC-N270-8G

Adlink Technology, Inc
Computer-On-Modules - COM COM-Express ATOM N270 1.6Ghz 8GB SSD

MXC-6403D/M4G

Adlink Technology, Inc
Embedded Box Computers Intel Skylake-H Core i3 CPU+QM170 fanless expandable computer,1PCI+2PCIex8,2DP+1DVI-I,3xGbE,6xUSB3.0,4xCOM,16-CH DIO,1xCfast socket,4x2.5" SATA port,9-32VDC input,4G DDR4

RK-460MB

Adlink Technology, Inc
ROHS,4U MB CHASSIS;

RK-608MB-C

Adlink Technology, Inc
WALLMOUNT CHASSIS

NS-608MBC-M302-74-01

Adlink Technology, Inc
M-302,RK-608MB-C, Rack/Wallmount Chassis, Intel Core2 Duo E7400 CPU, 2.8GHz, 2GB RAM, 460W PSU