INTEL FOR LGA 775 TM

Adlink Technology, Inc
HEAT SINK: MATERIAL:AL 6063 & CU CORE

INTEL LGA1156 TM

Adlink Technology, Inc
HEATSINK MATERIAL : COPPER

RK-460MB

Adlink Technology, Inc
ROHS,4U MB CHASSIS;

RK-410FS

Adlink Technology, Inc
4U Rackmount Industrial Chassis Beige Steel 4U

RK-608MB-C

Adlink Technology, Inc
WALLMOUNT CHASSIS

NS-608MBC-M302-74-01

Adlink Technology, Inc
M-302,RK-608MB-C, Rack/Wallmount Chassis, Intel Core2 Duo E7400 CPU, 2.8GHz, 2GB RAM, 460W PSU

NS-608MBC-M342-726-00

Adlink Technology, Inc
M-342,RK-608MB-C, Rack/Wallmount Chassis, Intel Core I7-2600 CPU, 3.4GHz

NS-608MBC-M322-53-02

Adlink Technology, Inc
M-322,RK-608MB-C, Rack/Wallmount Chassis, Intel Pentium E5300 CPU, 2.6GHz, 2GB RAM, 350W PSU

NS-608MBC-M342-726-02

Adlink Technology, Inc
M-342,RK-608MB-C, Rack/Wallmount Chassis, Intel Core I7-2600 CPU, 3.4GHz, 4GB DDR3

NS-610MB-M322-74-00

Adlink Technology, Inc
RK-610AM-W,M-322, 4U Rackmount Industrial Chassis, 14-slot BP and MB, Intel Core2 Duo E7400, 2.8GHz, 2GB RAM, 460W PS