Up to 1GHz SHARC+ DSP with 640KB L1, 1024KB Shared L2 SRAM, 120-lead LQFP_EP Features:SHARC+ Core infrastructure 800MHz (max) or 1GHz (max) Core clock frequency 640KB on-chip Level 1 (L1) SRAM memory (with parity) increases low latency performance 32-bit, 40-bit & 64-bit floating point support 32-bit fixed point Byte, short-word, word, long-word addressedMemory 1024KB on-chip Level 2 (L2) SRAM with ECC protection - eliminates need for external memory in many use cases Advanced Hardware Accelerators Enhanced FIR/IIR offload engines running at Core clock frequency for added processing power Security Crypto Engines with OTPPowerful DMA SystemInnovative Digital Audio Interface (DAI) includes: 8x Full SPORT interfaces w/TDM & I2S modes 2x S/PDIF Rx/Tx, 8 ASRC pairs 4x Precision Clock Generators 24 BuffersOther Peripheral Connectivity / Interfaces: 2x Quad SPI, 1x Octal SPI MLB 3-pin 4x I2C, 2x UARTs 6x General Purpose Timer, 1x General Purpose Counter 2x Watchdog Timers 2-ch 12bit Housekeeping ADCs 22 GPIO pins, 24 DAI pins Thermal SensorPackage 14mm x 14mm 120-lead LQFP_EAdditional Features Security and Protection Crypto hardware accelerators Fast secure boot with IP protection Enhanced FIR and IIR accelerators running up to 1 GHz AEC-Q100 qualified for automotive applications

Up to 800MHz SHARC+ DSP with 640KB L1, 512KB Shared L2 SRAM, 400-Ball CSP_BGA Features:SHARC+ Core infrastructure 600MHz (max) or 800MHz (max) Core clock frequency 640KB on-chip Level 1 (L1) SRAM memory (with parity) increases low latency performance 32-bit, 40-bit & 64-bit floating point support 32-bit fixed point Byte, short-word, word, long-word addressedMemory 512KB on-chip Level 2 (L2) SRAM with ECC protection - eliminates need for external memory in many use cases One Level 3 (L3) interface optimized for low system power, providing 16-bit interface to DDR3 (supporting 1.35 V capable DDR3L devices) SDRAM devices16-bit DDR/DDR3L Memory Controller 1.35V support for DDR3LAdvanced Hardware Accelerators Enhanced FIR/IIR offload engines running at Core clock frequency for added processing power Security Crypto Engines with OTPPowerful DMA SystemInnovative Digital Audio Interface (DAI) includes: 8x Full SPORT interfaces w/TDM & I2S modes 2x S/PDIF Rx/Tx, 8 ASRC pairs 4x Precision Clock Generators 28 BuffersOther Peripheral Connectivity / Interfaces: 2x Quad SPI, 1x Octal SPI MLB 3-pin 6x I2C,3x UARTs 2x Link Ports 10x General Purpose Timer, 1x General Purpose Counter 2x Watchdog Timers 4-ch 12bit Housekeeping ADCs 40 GPIO pins, 28 DAI pins Thermal SensorPackage 17mm x 17mm (0.8mm pitch) 400-ball CSP_BGAAdditional Features Security and Protection Crypto hardware accelerators Fast secure boot with IP protection Enhanced FIR and IIR accelerators running up to 1 GHz AEC-Q100 qualified for automotive applications

Dual-core SHARC+ DSP (w/768KB L1), 1MB Shared L2, 176-LQFP Features: Dual-enhanced SHARC+ high performance floating-point cores Up to 500 MHz per SHARC+ core Up to 3 Mb (384 kB) L1 SRAM memory per core with parity (optional ability to configure as cache) 32-bit, 40-bit, and 64-bit floating-point support 32-bit fixed point Byte, short word, word, long word addressed Powerful DMA system On-chip memory protection Integrated safety features 176-lead LQFP_EP, RoHS compliant Low system power across automotive temperature range Memory Large on-chip L2 SRAM with ECC protection, up to 1 MBAdditional Features Security and Protection Cryptographic hardware accelerators Fast secure boot with IP protection Support for arm® TrustZone Accelerators FIR, IIR offload engines Qualified for automotive applications

High Performance Convergent Multimedia Blackfin Processor Features: Lockbox™ Secure Technology: Hardware-enabled security for code and content protection. Two independent DMA controllers Multimedia: Multiple Enhanced Parallel Peripheral Interfaces (EPPI), Pixel Compositor hardware accelerator Human Interface: 18/24-bit LCD Controller 32-bit Up/Down counter / Thumbwheel interface, 8x8 Keypad interface Blackfin® Processor Core with up to 533Mhz (1066 MMACS) performance Connectivity: High Speed USB OTG , Host DMA, UARTs, SPORTs, SPI, TWI, and CAN Expansion: SD/SDIO and ATAPI-6 Controllers Synchronous interface for DDR or Mobile DDR connectivity (See data sheet ordering guide for specific product information) Asynchronous memory interface for SRAM, EEPROM, NAND/NOR, Flash connectivity

Phase Detector / PLL Frequency Synthesizer Features: 400 MHz bandwidth 2.7 to 3.3 V power supply Separate charge pump supply (VP) allows extended tuning voltage in 3 V systems Programmable charge pump currents 3-wire serial interface Analog and digital lock detect Hardware and software power-down mode 104  MHz phase detectorADF4002-EP supports defense and aerospace applications (AQEC standard) Download ADF4002-EP data sheet (pdf) Military temperature range: −55°C to +125°C Controlled manufacturing baseline One assembly/test site One fabrication site Enhanced product change notification Qualification data available on request V62/11607 DSCC Drawing Number

Microwave Wideband Synthesizer with Integrated VCO Features: Output frequency range: 800 MHz to 12.8 GHz Jitter = 18 fsRMS (Integration BW: 100 Hz to 100 MHz) Jitter = 27 fsRMS (ADC SNR Method) Wideband Noise Floor: -160 dBc/Hz @12 GHz PLL Specifications: -239 dBc/Hz: Normalized In-Band Phase Noise Floor -147 dBc/Hz: Normalized In-Band 1/f Noise Phase Detector Frequency up to 500 MHzReference Input Frequency up to 1 GHz Typical -100 dBc PFD spursReference to Output Delay Specifications: Part-to-Part Standard Deviation: 3 ps Temperature Drift: 0.03 ps/ Adjustment Step Size: <+/-0.1 ps Multi-chip Output Phase Alignment 3.3 V and 5 V Power supplies 7 mm x 7 mm 48 Lead LGA

Isolated Module DC DC Converter 1 Output 2.5 ~ 12V 440mA 3.1V - 31V Input

2.5 V to 5.5 V, 230 A, Dual Rail-to-Rail Voltage Output 12-Bit DAC Features: AD5313: 2 buffered 10-bit DACs in 1 package A version: ±4 LSB INL B version: ±2 LSB INL AD5323: 2 buffered 12-bit DACs in 1 package A version: ±16 LSB INL  B version: ±8 LSB INL 16-lead TSSOP package Power-down to 200 nA @ 5 V, 50 nA @ 3 V Micropower operation: 300 μA at 5 V (including reference current) 2.5 V to 5.5 V power supply Double-buffered input logic Guaranteed monotonic by design over all codes Buffered/unbuffered reference input options Output range: 0 V to VREF or 0 V to 2 VREF Power-on-reset to 0 V

Dual, 16-Bit, 2.8 GSPS, TxDAC+ Digital-to-Analog Converter Features: Support input data rate >2 GSPS Proprietary low spurious and distortion design SFDR = 82 dBc at dc IF, −9 dBFS Flexible 8-lane JESD204B interface Multiple chip synchronization Fixed latency Data generator latency compensation Selectable 1×, 2×, 4×, or 8× interpolation filter Low power architecture Transmit enable function allows extra power saving and instant control of the output status High performance, low noise phase-locked loop (PLL) clock multiplier Digital inverse sinc filter Low power: 1.42 W at 1.6 GSPS full operating conditions 88-lead LFCSP with exposed pad

Quad, 16-Bit, 2.4 GSPS, TxDAC+ Digital-to-Analog Converter Features: Supports input data rates up to 1 GSPS Proprietary, low spurious and distortion design Single carrier LTE 20 MHz bandwidth (BW), ACLR = 77 dBc at 180 MHz IF Six carrier GSM IMD = 78 dBc, 600 kHz carrier spacing at 180 MHz IF SFDR = 72 dBc at 180 MHz IF, −6 dBFS single tone Flexible 8-lane JESD204B interface Multiple chip synchronization Fixed latency Data generator latency compensation Input signal power detection High performance, low noise phase-locked loop (PLL) clock multiplier Digital inverse sinc filter Digital quadrature modulation using a numerically controlled oscillator (NCO) Nyquist band selection—mix mode Selectable 1×, 2×, 4×, and 8× interpolation filters Low power: 2.11 W at 1.6 GSPS, full operating conditions 88-lead, exposed pad LFCSP