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Texas Instruments INA821IDGKR

Price
RoHS Y Y Y Y Y Y Y Y Y Y
Lead Status Y Y Y Y Y Y Y Y Y Y
Configurability Factory programmable,Software configurable
Features Enable pin,I2C control,Power good,Power sequencing,Spread-Spectrum Clock (SSC) Generation,Thermal shutdown,UVLO adjustable Active Demagnetization to reduce power losses,Analog or Digital Hall inputs,Code-free Hall sensor based trapezoidal (120) commutation,Configurable PWM modulation Enable,Foldback Overcurrent protection,Output discharge,Power good,Soft start Cost Optimized,Current Output,Low Power,SDO,Small Size,Smart DAC HDCP
Iout(max)(A) 3 2
Iq(typ)(mA) 0.009 2.8
LDO 2
Operating temperature range(C) -40 -40 -40 -45 -45 -45 -40 -40 to 125 -40 -40 to 125
Package area(mm^2) 25 35 106.09 15.75 15.75 15.75 12.25 81
Package size (L x W)(mm) 5 x 5 7 x 5 10.3 x 10.3 4.5 x 3.5 4.5 x 3.5 4.5 x 3.5 3.5 x 3.5 9 x 9
Package type VQFN VQFN SOIC VQFN-HR VQFN-HR VQFN-HR VQFN VQFNP
Pin count 28 40.0 16.0 25.0 25 25.0 20.0 64
Pitch(mm) 0.5
Processor name i.MX 8M Mini/Nano
Processor supplier NXP
Product type Processor and FPGA
Rating Catalog Catalog Catalog Automotive Automotive Automotive Catalog Catalog Automotive Catalog
Regulated outputs(#) 4 1
Step-down DC/DC controller 0
Step-down DC/DC converter 2
Step-up DC/DC controller 0
Step-up DC/DC converter 0
Switching frequency(max)(kHz) 2200
Switching frequency(typ)(kHz) 2000
TI functional safety category Functional Safety-Capable Functional Safety-Capable
Vin(max)(V) 5.5 6.5
Vin(min)(V) 2.8 1.1
Vout(max)(V) 3.36 5.2
Vout(min)(V) 0.7 0.8
TI.com inventory 110360 34552 25696 418 11938 17500 57145 29217 0
Approx. price(US$) .968 | 1ku 1.433 | 1ku 1.12 | 1ku 1.736 | 1ku 2.136 | 1ku 2.02 | 1ku 1.4 | 1ku 1.9 | 1ku 9.715 | 1ku 2.21 | 1ku
Architecture Integrated FET String
Control interface 1xPWM
Control topology Sensored,Trapezoidal
Vs ABS(max)(V) 40
Vs(min)(V) 4.5
CMTI(min)(V/s) 100000
Clearance(min)(mm) 8
Creepage(min)(mm) 8
Current consumption per channel (1 Mbps)(typ)(mA) 1.95
Current consumption per channel (DC)(typ)(mA) 1.26
Data rate(max)(MBits) 50
Data rate(max)(Mbps) 50
Default output High
Forward/reverse channels 3 forward / 3 reverse
Integrated isolated power No
Isolation rating Reinforced
Number of channels 6
Propagation delay time(typ)(s) 0.011
Supply voltage(max)(V) 5.5
Supply voltage(min)(V) 1.71
Surge isolation voltage (VIOSM)(VPK) 10000
Transient isolation voltage (VIOTM)(VPK) 7071
Withstand isolation voltage (VISO)(Vrms) 5000
Alternate mode No No No
Data role Dataless Dataless Dataless
Dead battery support No No No
External power-path control No No No
Function Type-C,USB2,USB3 Type-C Type-C Serializer
Internal power path 5 V 3 A 5 V 3 A 5 V 1.5 A,5 V 3 A
Power role Source Source Source
Type CC controller,DC/DC converter CC controller,DC/DC converter CC controller,DC/DC converter
Accuracy(%) 0.75
Dropout voltage (Vdo)(typ)(mV) 75
Load capacitance(min)(F) 47
Maximum package height(mm) 1.0
Noise(Vrms) 4.4
Output options Adjustable Output,Fixed Output
PSRR at 100 KHz(dB) 40
Thermal resistance JA(C/W) 43
Interface type I2C,SPI
Power consumption(Typ)(mW) 1
Resolution(Bits) 10
Number of DAC channels(#) 4
INL(Max)(+/-LSB) 1
Output type Buffered Current,Buffered Voltage
Settling time(s) 20
Output range(Max)(mA/V) 5.5
Output range(Min)(mA/V) 0
Package Group WQFN|16 SOIC|8,VSSOP|8
Sample/update rate(MSPS) 0.25
Package size mm2 mm2
Reference type Ext,Int
Color depth(bps) 24
Diagnostics BIST
EMI reduction BIST
Input compatibility MIPI DSI
Output compatibility FPD-Link III LVDS
Signal conditioning Adaptive Equalizer
Input offset (+/-)(Max)(uV) 35
Vs(Max)(V) 36
Gain error (+/-)(Max)(%) 0.025
Input bias current (+/-)(Max)(nA) 0.5
Number of channels(#) 1
Gain(Max)(V/V) 10000
Iq(Typ)(mA) 0.6
Noise at 0.1 Hz-10 Hz(Typ)(uVpp) 0.14
Gain(Min)(V/V) 1
CMRR(Min)(dB) 140
Gain non-linearity (+/-)(Max)(%) 0.001
Input offset drift (+/-)(Max)(uV/C) 0.4
Noise at 1 kHz(Typ)(nV/rt (Hz)) 7
Bandwidth at min gain(Typ)(MHz) 4.7
Vs(Min)(V) 4.5