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DRV8770RGER

Texas Instruments DRV8770RGER

Price
RoHS Y Y Y Y Y Y Y Y Y Y
Lead Status Y Y Y Y Y Y Y Y Y Y
Operating temperature range(C) -40 to 150 -40 -40 -40 -40 -40 -40 -40 -40 to 125 -40
Package Group SOIC|8,SON|8,SOT-23-THIN|8 VQFN|36
Protocols CAN,CAN FD
Common mode voltage(V) -12 to 12
TI functional safety category Functional Safety-Capable Functional Safety-Compliant Functional Safety-Compliant
Number of channels(#) 1
Rating Automotive Catalog Catalog Catalog Catalog Catalog Automotive Catalog Automotive Catalog
Package size mm2 mm2
Supply voltage(V) 4.5 to 5.5 3.3
Isolated No
Signaling rate(Max)(Mbps) 8
Low power mode Standby
Approx. price(US$) .319 | 1ku .91 | 1ku .113 | 1ku .414 | 1ku .36 | 1ku 1.05 | 1ku 10.704 | 1ku 61 | 1ku 2.073 | 1ku .72 | 1ku
Bus fault voltage(V) -58 to 58
TI.com inventory 0 6981 179500 282142 0 20580 2985 1944 0 18513
Interface type SPI SPI MII,RMII,RGMII
Magnetic sensing range(mT) 150,300,75
Package area(mm^2) 14.7 0.405769 14.7 19.2 See data sheet 144 81 16
Package size (L x W)(mm) 3 x 4.9 0.637 x 0.637 3 x 4.9 3 x 6.4 See data sheet 12 x 12 9 x 9 4 x 4
Package type VSSOP DSBGA VSSOP TSSOP USIP HTQFP TQFP VQFN
Pin count 8 4 8.0 8.0 10.0 64 48 24.0
Pitch(mm) 0.65
Sample rate(ksps) 20
Sensitivity error(%) 2.5
Supply voltage(max)(V) 5.5
Supply voltage(min)(V) 2.3
Type 3-Axis linear Converter,Module
Accuracy(%) 1.5
Dropout voltage (Vdo)(typ)(mV) 205
Features Enable,Output discharge EMI Hardened,MUX Friendly,Small Size Cost Optimized,EMI Hardened EMI Tested,Enable,Output discharge,Overcurrent protection,Power good Integrated ADC,Overtemperature protection,Overvoltage protection,Stackable (built-in interface),Temperature sensing,Undertemperature protection,Undervoltage protection Integrated LPF,Cable diagnostics,25-MHz clock out,Wettable flank package,Single supply
Fixed output options(V) 1.75
Iout(max)(A) 0.2 2
Iq(typ)(mA) 0.0002 0.004
Load capacitance(min)(F) 1
Maximum package height(mm) 0.4
Noise(Vrms) 130
Output options Fixed Output
PSRR at 100 KHz(dB) 35
Regulated outputs(#) 1 1
Thermal resistance JA(C/W) 201.1
Vin(max)(V) 6 5.5 15
Vin(min)(V) 1.5 2.4
Vout(max)(V) 5 4
Vout(min)(V) 0.8 0.6
Architecture CMOS CMOS R-2R
CMRR(typ)(dB) 110 110
GBW(typ)(MHz) 11 10.6
Input common mode headroom (to negative supply)(typ)(V) 0 0
Input common mode headroom (to positive supply)(typ)(V) 0 -2
Iout(typ)(A) 0.073 0.06
Iq per channel(typ)(mA) 2.4 2.6
Number of channels 2 2
Offset drift(typ)(V/C) 0.25 1.25
Output swing headroom (to negative supply)(typ)(V) 0.025 0.06
Output swing headroom (to positive supply)(typ)(V) -0.025 -0.06
Rail-to-rail In,Out In to V-,Out
Slew rate(typ)(V/s) 33 25
TI package name DGK PW
Total supply voltage (+5 V = 5, 5 V = 10)(max)(V) 16 40
Total supply voltage (+5 V = 5, 5 V = 10)(min)(V) 2.7 4.5
Vn at 1 kHz(typ)(nVHz) 6.8 8.5
Vos (offset voltage at 25C)(max)(mV) 1 1.7
Control mode Constant on-time (COT),DCS-Control Independent 1/2-Bridge
Duty cycle(max)(%) 100
Soft start Fixed
Switching frequency(max)(kHz) 4000
Switching frequency(min)(kHz) 4000
Topology Buck,Synchronous Buck
Battery overvoltage protection(max)(V) 4.5
Battery overvoltage protection(min)(V) 2.7
Communication interface Daisy chain,SPI controller,UART
Device type Pack monitor
Operating current(typ)(A) 10400
INL(max)(n±LSb) 1
INL(max)(nLSB) 1
Number of DAC channels 1
Output range(max)(mA/V) 10
Output range(min)(mA/V) -10
Output type Unbuffered Voltage
Power consumption(typ)(mW) 158
Reference type Ext
Resolution(Bits) 20
Sample/update rate(Msps) 1
Settling time(s) 1
Datarate(Mbps) 100BASE-T1
Cable length(m) 49
IO supply(Typ)(V) 1.8,2.5,3.3
Number of ports Single
Control interface Hardware (GPIO)
Number of full bridges 1
Vs ABS(max)(V) 115
Vs(min)(V) 5